Abstract: A computer system comprises a chassis, an electronic component disposed within the chassis, and a cooling fan that comprises a motor support fixed to a housing that is coupled to the chassis and a hub disposed within the housing. A plurality of blades extend radially from the hub. A motor is disposed within a motor enclosure formed by the motor support and the hub. The hub is rotatably coupled to the motor such that the plurality of blades generates a flow of air around the motor enclosure. The system comprises a motor cooler comprising a flow path through the motor enclosure, where the flow path has a first opening and a second opening, and where the second opening is disposed within an area of lowered downstream pressure so as to develop a differential pressure between the first and second openings and generate a flow of air through the motor enclosure.

Abstract: A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall.

Abstract: An apparatus includes a heat generating component; a heat radiating member that absorbs heat from the heat generating component and radiates heat; a fan that sends air toward the heat radiating member; a housing incorporating the heat generating component, the heat radiating member and the fan, and including a first opening that discharges air warmed up by the heat radiating member to an outside and a second opening that exposes an air inlet portion of the heat radiating member in which air from the fan enters; and a cover member that is detachably attached to the housing and covers the second opening.

Abstract: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

Abstract: A bus-bar having a prismatic housing, an elongate conductor extending along a length of the housing, and a resilient retainer which extends along a length of the housing and retains the conductor in the housing is disclosed.

Abstract: An integrated heat-dissipating device for a portable electronic product includes a heat-conducting base, a heat-dissipating plate, a first heat-dissipating module and a second heat-dissipating module. The heat-dissipating plate is adhered onto the heat-conducting base. The coefficient of heat conductivity of the heat-dissipating plate is larger than that of the heat-conducting base. The first heat-dissipating module includes a first heat pipe. One section of the first heat pipe is connected to the heat-conducting base, and the other section thereof extends in a direction away from the heat-conducting base. The second heat-dissipating module includes a second heat pipe, an adapting block and a third heat pipe. One section of the second heat pipe is connected to the heat-conducting base, and the other section thereof is connected to the adapting block. One section of the third heat pipe is connected to the adapting block, and the other section thereof extends in a direction away from the adapting block.

Abstract: An electronic device includes a housing that has a bottom surface and a side surface and includes an opening for air cooling formed therein; and a substrate that has a heat generating component mounted on a surface thereof facing the bottom surface of the housing and is fixed in the housing such that there is space between the substrate and the opening. The electronic device further includes a heat radiation component that contacts the heat generating component on the substrate and that spreads, between the bottom surface of the housing and the substrate, through the space, and to a position near and inside the opening; and a fan that is disposed in the space and fixed in the housing independently of the substrate so as to perform air cooling using the opening.

Abstract: A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating.

Abstract: According to one embodiment, an electronic device includes a housing including an opening, a partition wall which partitions an interior part of the housing into a first chamber and a second chamber which is opened to the outside through the opening, first and second heat generating parts mounted in the first chamber, a first heat radiation member located in the second chamber, a heat transfer member which transfers heat generated by the first heat generating part, a cooling fan which draws outside air and exhausts the air against the first heat radiation member, a second heat radiation member which is exposed to the outside of the housing and is thermally connected to the second heat generating part, and a cover covering the opening and the second heat radiation member. The cover forms a gap between the cover and the housing. The gap communicates with the second chamber.

Abstract: A server chassis is provided for receiving a functional module therein. The server chassis includes a base with an opening defined in an end thereof for the functional module inserted therethrough, and an air flap apparatus engaging with the base. The air flap apparatus includes a shielding panel pivotably attached to the base, and a resilient member connected to the base and the shielding panel to urge movement of the shielding panel.

Abstract: An electronic module packaging system and an electronic module packaging apparatus are disclosed. The electronic module packaging system includes an exterior packing box, an electronic module packaging apparatus, and antistatic packing foam holding the electronic module packaging apparatus within the exterior packing box. The electronic module packaging apparatus includes a top component made of an antistatic material, and a bottom component made of a conductive material. The bottom component includes multiple support members to hold an electronic module in a stable position. The top component and the bottom component may be coupled with multiple securing clips.

Abstract: A frame for mounting a data storage device, includes a holder configured for mounting the data storage thereto, a baffle board mounted to the holder, and a V-shaped air guiding board mounted to the holder between the baffle board and the data storage device. An intake defined in the baffle board is configured to let airflow therethrough to cool the data storage device mounted to the frame. The opening of the “V” of the air guiding board faces the data storage device. Because of the V-shaped air guiding board, the frame efficiently dissipates heat from and around the data storage device.

Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.

Abstract: A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.

Abstract: A heat dissipating apparatus includes a heat spreader (20) for thermally connecting with a heat generating electronic component, a heat sink (10) thermally connected with the heat spreader, and a heat pipe (30) thermally connecting the heat sink with the heat spreader for transferring heat from the heat spreader to the heat sink. The heat pipe includes an evaporation section (31) attached to the heat spreader, two semicircular condensation sections (33, 34) thermally engaging with the heat sink, and two connecting sections (35, 36) each interconnecting a corresponding condensation section and the evaporation section.

Abstract: A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. The clip includes a pressing body, two bending portions slantwise to the pressing body and extending from two opposite ends of the pressing body, and two locking arms extending from two ends of the bending portions. The pressing body of the clip abuts against the top surface of the base. The bending portions are extended downwardly from the pressing body to be located adjacent to two sides of the base to prevent the clip from moving horizontally along a lateral direction of the heat sink.

Abstract: A system for receiving and supporting a plurality of devices connected to a network. The system comprises a rack having a front side providing access to a plurality of chassis bays for receiving a chassis and aligning a back end of the chassis for blind docking with an electrical power source. The chassis includes a power supply, a fan, and a front side providing access to a plurality of module bays for receiving a module and aligning a back end of the module for blind docking with the power supply. A compute module is received in a module bay and directly blind docked to the power supply. The system further includes at least one other module received in a module bay within the same chassis as the compute module and directly blind docked with the same power supply along with the compute module.

Abstract: Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

Abstract: A heat radiating unit provided in an electronic apparatus includes: a fan for blowing air; and a heat radiating member in which heat radiation fins for transmitting heat to passing air are arranged and which has an endothermic section that contacts a top surface of a first heat-producing component on a circuit substrate so as to absorb heat from the first heat-producing component. The heat radiating unit further includes a supporting member provided with a heat-radiating-member biasing section that biases the heat radiating member toward the circuit substrate. The supporting member is also provided with an endothermic arm that extends toward and contacts a top surface of a second heat-producing component so as to absorb heat from the second heat-producing component. The top surfaces of the first and second heat-producing components are different in height.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.