Abstract: A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

Abstract: The invention relates to a frequency converter, comprising: a power electronics part provided with wheels on the lower part thereof; an installation cabinet for receiving the power electronics part movable on the wheels; and connectors arranged to the power electronics part and the installation cabinet, a contact being created between the connectors when the power electronics part is installed into the installation cabinet. To facilitate electrical installation works, the power electronics part is divided at least into a base part provided with wheels and a power stage part arranged thereon, the two being detachably attached together, whereby the base part, when detached from the power stage part, can be pulled out of the installation cabinet whereas the power stage part remains in place in the installation cabinet.

Abstract: In one embodiment a thermal dissipation heat slug sandwich includes a circuit board, a circuit package having an integrated heat slug mounted to an obverse side of the circuit board, and a lower heat sink plate on a reverse side of the circuit board thermally coupled to the heat slug and a housing enclosing the circuit board An upper heat sink plate may be mounted to the obverse side of the circuit board to cover the circuit package. The upper heat sink plate thermally coupled to the lower heat sink plate through the circuit board. An insulating cover may also be provided to redirect radiant heat from the circuit package to the housing.

Abstract: An apparatus for mounting a plurality of heat sinks onto a circuit board during testing while the circuit board is tested in a fixed manufacturing station. The apparatus has a polygonal shaped frame with a size that is limited to an area on the circuit board which contains a plurality of data processing elements to be cooled. At least four apertures are on the frame, wherein each of the apertures corresponds to a different one of the plurality of data processing elements to be cooled. A slot is positioned on the frame to receive oversized processing elements. At least four pillars extend from the frame and mount into mounting holes provided on the circuit board. The apertures on the frame support the heat sinks above the data processing elements to be cooled. No additional screws, adhesives, clips or other fixing mechanisms are required to secure the heat sinks.

Abstract: A method for isolating phases in an electrical equipment enclosure having multi-phase bus bars and a mounting base for mounting electrical equipment. The insulation system includes a plurality of components including a plurality of side isolation barriers with each barrier defining at least one slot proximate one edge of the barrier and having at least one tab along another edge of the barrier. A side barrier adapter is configured to engage the isolation barrier and to engage the mounting base. An inner isolation barrier is configured to isolate at least two of the vertical bus bars and couple to the mounting base. A vertical bus rear wall defining a plurality of slots proximate at least two edges of the cover is fastened to the inner isolation barrier. A plurality of corner connectors is configured to engage one of the cover slots and the side isolation barrier slots.

Abstract: A wiring and power distribution device for a cabinet housing electronic equipment. The distribution device includes a plurality of compartments. Each compartment adapted to contain an electronic component, such as an uninterruptible power supply, a power-conditioning device, or a power distribution center containing circuit breakers. The distribution device also includes a cooling compartment, including a fan or passive convective chimney arranged to cool the interior of the cabinet with ambient air. The distribution device provides a single input point for power and signal wiring, and at least one output point for connection to the electronic devices contained within the cabinet.

Abstract: According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section.

Abstract: A docking system is disclosed. The docking system includes a portable electronic device capable of operating in multiple orientations including vertical and horizontal. The docking system also includes a docking station configured to mechanically accept and operatively interface with the portable electronic device in any of its multiple orientations including vertical and horizontal.

Abstract: The invention relates to an inverter casing, said inverter casing comprising in the bottom at least one depression for receiving heat dissipating electric components, coils in particular.

Abstract: A power monitoring system for monitoring characteristics of power transmitted through one or more power lines comprises a meter base and multiple option modules. The meter base includes a processor and associated circuitry for processing signals derived from sensors coupled to said power lines and producing output signals representing selected characteristics of the power transmitted through the power lines, and a housing containing the processor and the associated circuitry and having a first surface adapted to be mounted on a DIN rail, and a second surface containing multiple connectors for receiving multiple modules and electrically connecting the modules to the processor and the associated circuitry.

Abstract: Described herein are various embodiments of a power distribution unit having modular components. For example, according to one embodiment, a power distribution unit can include a component portion that comprises at least two modules selected from the group consisting of outlet modules, circuit protection modules, power input modules, communications I/O modules, and display modules. Each of the at least two modules of the component portion can comprise at least one connection element and can be removably secured to one or more other of the at least two modules via the connection elements. The power distribution unit can also include a housing that defines an interior cavity. The component portion can be removably secured to the housing at least partially within the interior cavity.

Abstract: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.

Abstract: An electronic device enclosure includes a chassis having a base plate, a number of fans, a number of securing boards mounted on the corresponding fans, and a number of pivot members. The receiving bracket includes a first sidewall, a second sidewall parallel to the first sidewall, and a bottom wall secured to the base plate and connecting the first sidewall to the second sidewall together such that the first sidewall, the second sidewall, and the bottom wall cooperatively define a receiving housing configured for receiving the fans. The pivot members each has a pivot end attached to the corresponding securing boards and a securing end secured to the first sidewall of the receiving bracket. Each pivot member is capable of rotating about a pivot axis of the securing board and configured for securing the corresponding fan to the receiving housing.

Abstract: A heat sink clip (30) includes an elongated resilient main body (31) with two spaced barbs (315) at a first end thereof, a first locking member (33) coupled with a second end of the main body and a moveable second locking member (32) movably coupled with the first end of the main body. The barbs each vertically extend and include a neck (3151) connecting with the main body and a locking end (3152) at a free end thereof. The moveable second locking member includes an operating portion (321) and a locking leg (322) defining two connecting slots (323) therein. Each of the connecting slots includes a longitudinally narrow portion (3231) and a longitudinally wide portion (3232) beside the narrow portion. The barbs enter the connecting slots through the wide portions and the necks are received in the narrow portions.

Abstract: A universal power distribution system is provided for routing electrical circuits within a building structure to comprehensively provide electrical power to the building in ceiling configurations, wall-mounted configurations, raised floor configurations and in office furniture configurations. The system components for all of these configurations have common plug connectors that are engagable with each other so as to be readily usable in a wide variety of applications. The system is readily adaptable to form virtually any conventional circuit configuration found within conventional hard-wired systems yet is formed simply through the routing of the cables through the building cavities and interconnection is accomplished merely by plugging components together rather than through labor-intensive manual wiring.

Abstract: A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round corners in four corners of the body. Each main body of the fins defines a plurality of locking members thereon to engage with corresponding locking members of a corresponding front fin. The arch-shaped flanges in four respective corners of the fins cooperate with each other to form four arced faces in four corners of the assembled fins along an entire length of the assembled fins.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.

Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).

Abstract: A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example.

Abstract: A switch guide located between a pair of switches on a computerized bicycle control panel is disclosed for guiding a bicycle rider's thumb to a proper switch on a bicycle handle bar. The switch guide is preferably a protrusion dimensioned to be detected by the bicycle rider's thumb. In a preferred embodiment of the invention, the height of the switch guide is greater than the height of the switch. In an alternative embodiment, the height of the switch guide is greater than the height of the switch, when the switch is activated. The switch guide is located in sufficient proximity to the switches to allow the rider's thumb to access one of the switches by moving the thumb to one side of the switch guide and the other switch by moving the thumb to the other side of the switch guide.