Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.

Abstract: A waterproof panel comprises a front wall, a back wall, a front baffle assembly and a back baffle. A cavity is defined between the front wall and the back wall, the front baffle assembly and the back baffle are received in the cavity. The front wall defines a first hole array and a second hole array, the back wall defines a third hole array in same height with the second hole array. The front baffle assembly fixed on one side of the second hole array near the third hole array comprises a main baffle. The back baffle fixed on one side of the third hole array near the second hole array is on one side of the main baffle near the second hole array. The back wall comprises a plurality of protruding strips, which can rebound water entering through the third hole array back.

Abstract: An electronic apparatus includes a semiconductor chip 15, a first substrate 10A having an antenna 12 formed on a first face 10a thereof and having the semiconductor chip 15 loaded on a second face 10b thereof, a second substrate 20A on which the first substrate 10A is provided so as to face the semiconductor chip 15, and which is connected to the outside, copper core solder balls 18 electrically connecting the first substrate 10A and the second substrate 20A, and a resin material 30 disposed between the first substrate 10A and the second substrate 20A. The second substrate 20A is provided with a thermal via 27 which radiates the heat in the semiconductor chip 15.

Abstract: A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.

Abstract: A heat sink protective cover includes a main body, on which at least one receiving space is defined for receiving a heat sink therein. The receiving space includes at least one positioning section and a dust-proof section. The positioning section is located at two opposite inner wall surfaces of the receiving space. The dust-proof section includes a raised portion and a recess portion, the raised portion is extended along a periphery of the dust-proof section to limit the recess portion on four sides thereof, and the dust-proof section is located on a bottom of the receiving space. The heat sink is stably hold in place in the receiving space by the positioning section and isolated from dust by the dust-proof section, and can therefore be effectively protected against collision, damage, and contamination while being transported.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: A board card having a control circuit includes a first substrate and an electrical fan. The first substrate has a heat source and the electrical fan is disposed on the first substrate. The electrical fan includes a revolving spindle, a plurality of blades and a LED module. The revolving spindle is disposed on the first substrate and rotates about an axis. The blades are joined with the revolving spindle. The LED module is electrically connected to the control circuit, wherein when the revolving spindle drives the blades rotate, the light-emitting direction of the LED module is along a radial direction of the revolving spindle.

Abstract: Electrical units are effectively cooled, even if the longitudinal length of the cover member in which the electrical units to be cooled are accommodated is short, by easily guiding a flow of air during operation toward the electrical units. A second cover member which constitutes at least a part of a body cover together with a first cover member is positioned ahead of the first cover member which accommodates an electrical unit to be cooled. Inlets which let a flow of air during operation into the second cover member are disposed in the second cover member. An outlet for discharging a flow of air during operation out of the first cover member is provided in the first cover member.

Abstract: A cooling arrangement is disclosed for electrical components which are arranged in a housing of a soft starter which in particular may be designed for operation of an electric motor. In at least one embodiment, the cooling arrangement includes at least one fan arranged inclined in an opening in a housing wall such that the rotation axis of the fan is at an angle to the normal to the housing wall.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A computer assembly having a processor integrated circuit, a hard disk drive electrically connected to the processor units and a power supply assembly, powering the processor integrated circuit and hard disk drive. These components are sealed in an liquid-tight case defining fluid channels. Electrical connectors permit connection of the processor to outside devices. Finally, a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitates the movement of heat through the computer assembly and creates a monolithic thermal structure. In one embodiment, the computer assembly is powered by a raw DC power supply input and self manages this power input source to provide consistent and reliable power to the computer assembly without burdening the raw DC power supply during transient conditions.

Abstract: A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

Abstract: A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components of the dies.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.

Abstract: A securing device includes a securing member defining a securing hole, and a fastener. The fastener includes a spring, and a bolt having a main portion, a bottom fixing portion, and a top head portion. The securing hole includes an inner portion and an outer portion extending horizontally from the inner portion to an outside. A width of the outer portion is smaller than the fixing portion and larger than the main portion. The main portion enters into the inner portion through the outer portion. The fixing portion abuts against a bottom of the securing member. The spring is compressed between a top of the securing member and the head portion. A concave is depressed from the securing member and surrounds the inner portion. A lower portion of the spring is fittingly received in the concave.

Abstract: A gas-insulated power apparatus comprising a vertically arranged gas-insulated circuit breaker included in a vertically arranged gas-insulated main tank, a first gas-insulated branch pipe connected to one side of an upper portion of the gas-insulated main tank substantially orthogonal to a direction of extending the gas-insulated main tank and leading out a feeder from a movable side of the gas-insulated circuit breaker, and a second and a third gas-insulated branch pipes which are respectively connected to both sides in a peripheral direction of a lower portion of the gas-insulated main tank substantially orthogonal to the direction of extending the gas-insulated main tank, one of which connects a fixed side of the gas-insulated circuit breaker to one gas-insulated Y bus of gas-insulated double buses and other of which connects the fixed side of the gas-insulated circuit breaker to other gas-insulated X bus of the gas-insulated double buses, respectively, by which a gas-insulated power apparatus having a str

Abstract: A transit container, such as a rack-mount style container, includes a temperature control system for maintaining a desired temperature within the container such that any cargo within the container remains operational at selected times and possibly in selected locations. The temperature control system includes support or mounting brackets, a temperature control assembly, shock isolation devices for shock attenuation of the temperature control assembly, exhaust assemblies that include exhaust fans and exhaust/intake louvers, and a mounting plate attachable to a lid of the transit container. The temperature control assembly and the aforementioned components may be arranged to have a low-height profile or envelope, which in turn permits the temperature control system to be located in a cavity or chamber of the lid.

Abstract: An apparatus, system, and method are disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces. Additionally, the system includes a plurality of thermally conductive particles disposed within the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles. Beneficially, such a system would provide effective thermal coupling between a heat generating device and a heat dissipating device. Additionally, the system would be modular, reusable, and easy to install or replace without a significant mess.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate. The coolant flow paths are formed such that coolant flows in a coolant flow direction.