Abstract: An apparatus for enhancing the cooling of a dual in-line memory module (DIMM) includes a planar body having opposing surfaces, a top edge, a bottom edge, and opposing ends. An engagement flange is connected to the bottom edge of the body. A first clip leg is connected to the engagement flange. The first clip leg includes a tab arranged to engage one mounting latch recess of the DIMM. A second clip leg connected to the engagement flange. The second clip leg includes a tab arranged to engage the other mounting latch recess of the DIMM.

Abstract: A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A miniaturized liquid cooling device (200) includes a heat absorber (20), a heat dissipater (30), a droplet generator (40) driving a working fluid circulating between the heat absorber and the heat dissipater, and a plurality of tubes (50) connecting the heat absorber, the heat dissipater and the droplet generator with each other. The droplet generator includes a bottom electrode plate (42), a top electrode plate (44) hermetically covering the bottom electrode plate, a fluid channel (425) formed between and a plurality of control electrodes (422) disposed between the top electrode plate and the bottom electrode plate. The control electrodes are arranged between an inlet (481) and an outlet (491) of the droplet generator. Voltages are regularly applied across the control electrodes so as to generate a plurality of fluid droplets (D) and drive the fluid droplets to move from the inlet towards the outlet of the droplet generator.

Abstract: Disclosed is a printed circuit board (PCB) comprising at least one light emitting diode (LED) element and a PCB body. The LED comprises a heat sink, a light emitting body and two base feet, each base foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion, and the heat sink is disposed under the support portion. The PCB body comprises a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and two second recess portions for receiving the engaging portions of the base feet to increase heat dissipation of the base feet.

Abstract: A computer enclosure includes a fan, a base and a cover. The base includes a support plate. The support plate defines a plurality of air vents. The fan is located on a bottom side of the support plate, and a plurality of operating components is mounted on a top side of the support plate. The cover is mounted on the top side of the support plate to enclose the plurality of operating components. The cover includes a top plate. The top plate defines a plurality of air vents cooperating with the air vents of the support plate to form an air flowing channel.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: Systems and method for installing computer equipment and power distribution equipment in facilities is provided. In one aspect, the present invention provides a power distribution rack, and uninterruptible power supply rack and a plurality of equipment racks. A plurality of power cables are run from the power distribution rack to each of the plurality of equipment racks using power cable tracks located on the roofs of the equipment racks.

Abstract: Described herein are various embodiments of a fuse module with a fuse carrier for fused electrical devices. According to one exemplary embodiment, at least one fuse module can be mounted to a power distribution unit for receiving at least one power input and providing power to associated electronic equipment. The power distribution unit can have a housing with at least one fuse access passage and at least one power output displaced along the housing and electrically couplable to the at least one power input. The fuse module can be disposed at least partially within the at least one fuse access passage and be electrically couplable to the at least one power input and at least one power output. The fuse module can have at least one removably attachable fuse carrier that, when attached, electrically couples a fuse housed by the fuse carrier to the at least one power input and the at least one power output.

Abstract: An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat sink. The heat spreader is oriented such that the thermal conductor propagates heat along a length of the heat sink. A heat channel composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat spreader. The heat channel is oriented to propagate heat towards the heat spreader.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: The subject matter of the invention is an inverter including a casing (1), said casing (1) including at least two casing chambers (2, 3) that are each closable through a separate cover (2a, 3a).

Abstract: A panel type display device for minimizing temperature increase in the interior of a case and a display panel. The display device includes a case, a display panel mounted in an interior of the case, at least one circuit board for controlling the display panel, a first cooling fluid path for cooling the display panel, and a second cooling fluid path for cooling the circuit board. In the display device, the first and second cooling fluid paths are separated from each other.

Abstract: According to one embodiment, an electronic apparatus is provided with a case, a printed circuit board which is contained in the case and includes a first surface and a second surface formed on the side opposite from the first surface, a first heating element mounted on the first surface, a second heating element mounted on the second surface, a first cooling fan used to cool the first heating element, and a second cooling fan used to cool the second heating element. A thickness of the second cooling fan is smaller than a thickness of the first cooling fan. The second cooling fan is mounted so as to overlap the first cooling fan in a direction parallel to the first surface of the circuit board and be situated within a range of the thickness of the first cooling fan.

Abstract: A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card.

Abstract: A remote control duo power set comprises one first power outlet which has one first housing, a plurality of first sockets being set on one surface of said first housing, a power cord extending from one side of said first housing; one connecting cord of which one end is connected to the other side of said first housing; and one second power outlet, which is connected to the other side of said connecting cord and has one second housing, a plurality of second sockets and at least one power switch being provided at a side of the second housing. User can easily supply power to the electronic devices by said second power outlet. Furthermore, users can also easily control the supply of power by said power switch.

Abstract: A circuit breaker apparatus is provided and includes a circuit breaker, having a housing surface perpendicular to a plane of a front side of the circuit breaker and internal components, a terminal block structurally coupled to the housing surface, first terminal housings arrayed on the terminal block to each support first components and to be receptive of second terminal housings each of which supports second components, at least some of which are electrically coupled to the internal components, to be electrically coupled to at least some of the first components, and an access block. The access block is disposed on the terminal block and has apertures defined therein to provide for front-side access to the first terminal housings.

Abstract: A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot.

Abstract: The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.