Abstract: A heat dissipation apparatus includes a heat sink (30) and a fan (50) mounted on the heat sink. The heat sink includes a plurality of radial fins (311, 331). An air channel (312, 332) is defined between every two adjacent fins. Each of the fins includes a main body (331, 331) and an airflow guiding flange (314, 334) extending upwardly and outwardly from a top side of the main body. The airflow guiding flange is twisted in a radial direction, such that an included angle between the airflow guiding flange and the main body is gradually increased from an outer side (318, 338) towards an inner side (317, 337) of the main body. The fan is used to generate airflow towards the heat sink. The airflow is guided into the air channels between the fins via the airflow guiding flanges.

Abstract: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink having a bottom for in contact with the electronic component and a plurality of fasteners securing the heat sink onto the printed circuit board. Each fastener includes a first latching member, a second latching member rotatably connected to the first latching member and an operating member rotatably connected to the first latching member and having a pressing part engaging a curved portion defined on a top of the second latching member. The heat sink and the printed circuit board are located between the first and second latching members of each fastener. The operating member is rotated to force the first and the second latching members to rotate toward each other to closely clip the heat sink and printed circuit board together.

Abstract: A heat dissipating structure associated with light emitting diodes includes a circuit substrate, a guide heat component, a heat dissipating device. The circuit substrate is attached with light emitting diodes. The guide heat component has a first end contacting the circuit substrate and a second end contacting with fins, which are provided with the heat dissipating device. The heat generated by the light emitting diodes is transmitted to the heat dissipating device via the guide heat pipe and then dissipated outward via the heat dissipating device.

Abstract: A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.

Abstract: Replacing, and in particular extending, the body of an outdoor distributor cabinet includes removing the body of the old distributor cabinet, slipping a new hollow base over the old assembly frame and the old base. A new body, which has at least the same inner capacity as the old body, is placed on top of the old assembly frame, aligned therewith, and secured. Accordingly, the distributor cabinet remains in its original position, whereby no new authorization for installation or building permit is required.

Abstract: A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.

Abstract: A heat sink assembly includes a heat sink and a clip assembly. The clip assembly includes a clip and a pair of movable fasteners pivotally connected to the clip. The clip includes a main body, two pressing portions extending from two opposite ends of the main body and two locking arms extending oppositely from the two pressing portions, respectively. The movable fasteners each include a main body, a pair of receiving portions curved upwardly from the main body and receiving a corresponding locking arm therein and a hook extending downwardly from the main body and engaging with a clasp on a printed circuit board. A distance from each of the hooks of the movable fasteners to a corresponding clasp can be adjustable via rotation of the movable fasteners around the locking arms of the clip.

Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and a plurality of adjustable filler panel assemblies. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. The plurality of adjustable filler panel assemblies selectively block portions of the air inlet opening in order to create a custom-fit air inlet opening for a particular piece of equipment so that exhaust air from the equipment does not flow back into the enclosure after entering the exhaust duct.

Abstract: A quick connect system for an electronic device, comprising a docking station configured to engage the electronic device, the docking station having a locking mechanism actuatable to an unlocked position, the locking mechanism configured to independently remain in the unlocked position and automatically return to a locking position in response to disengagement of the electronic device from the docking station.

Abstract: Described herein are various embodiments of a fuse module for fused electrical devices. According to one exemplary embodiment, a fuse module is mounted to the housing of a fused electrical device. The fused electrical device can include at least one power output displaced along the power distribution housing with the at least one power output electrically couplable to at least one power input. The fuse module can be electrically coupled to the at least one power input and electrically couplable to the at least one power outputs. Further, the fuse module can comprise at least one fuse holder that is movable between a first position in which a fuse held by the fuse holder is electrically couplable to the at least one power output and a second position in which a fuse held by the fuse holder not electrically couplable to the at least one power output and is exposed to allow access to the fuse.

Abstract: A water-cooling radiator for a computer chip is provided to lower the temperature of the computer chip. The radiator includes a body on which other elements can be fixed and providing an interface for heat exchange, an internal circulation flow path built inside the body to provide a passage required for the coolant to flow through, and a pump fixed to the side of the body near the computer chip to provide power required for the coolant circulation.

Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation.

Abstract: According to one embodiment, an electronic device includes a heat generating part housed inside a cabinet and a loop heat pipe housed inside the cabinet, which includes an internal flow path having a loop shape in which a working fluid is sealed. The loop heat pipe further includes a heat receiving unit, a heat radiating unit, a vapor flow path which allows a gasified portion of the working fluid to flow from the heat receiving unit towards the heat radiating unit, a liquid returning flow path which allows a liquefied portion of the working fluid to flow from the heat radiating unit towards the heat receiving unit, and a wick provided at a position adjacent to the vapor flow path inside the liquid returning flow path. The wick also serves as a partition portion which partitions the vapor flow path and the liquid returning flow path from each other.

Abstract: A frontal structure of an information processing apparatus, includes a plurality plate-like members, each member having a plurality of perforations opened at predetermined intervals therebetween, each perforation having a predetermined size and shape, and a light-emitting unit for emitting light toward the plate-like members. The plate-like members run in parallel and are arranged with one behind another and an entire or part of frontmost one of the plate-like members serves as an entire or part of front of a casing of the information processing apparatus.

Abstract: The invention relates to a heat sink arrangement with a heat sink element, with a cylindrical interior, in particular a housing of an electric motor or housing part for such, with power electronics integrated into the housing or housing part, with at least one electronics component attached to the heat sink element from inside, in which the heat sink element is a sector of a cylinder adapted to the cylindrical interior of the heat sink arrangement, and that a springy clip is present that presses onto the ends of the sector such that the heat sink element is pressed against the cylindrical interior by spreading, as well as to an electric motor, a housing part and a springy clip.

Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.

Abstract: Particles having a relatively high porosity can be used in an information handling system or other information handling system. In one aspect, a portable information handling system can include an electrical circuit that can generate thermal energy during normal operation of the electrical circuit. The portable information handling system can also include a housing that includes a first material and particles having a porosity of at least 80%. In another aspect, an information handling system can include a housing that includes a material and a coating, wherein the coating includes a polymeric material and particles having a porosity of at least 80%. In another aspect, a process of forming an information handling system can include coating a surface of a housing, wherein the coating includes particles having a porosity of at least 80%, and placing an electrical circuit within the housing after coating the surface.

Abstract: A heat dissipating assembly capable of being placed between a circuit board and a casing of an electronic device includes a fan assembly and a bracket. The fan assembly is mounted on the circuit board. The fan assembly includes an enclosure defining a chamber and an opening at a side wall thereof, along with a blower received in the chamber. The bracket is located between the fan assembly and the casing of the electronic device. The bracket has a side wall thereof defining a cutout connected with the chamber. The cutout and the opening of the enclosure are defined at two different sides of the heat dissipating assembly.

Abstract: An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.