Abstract: Circuit breakers with cooperating plug and socket assemblies which are configured as separate spaced apart components, with plugs and sockets held spaced apart from the circuit breaker body, typically above the top of the circuit breaker body. The plug assembly can have a short compact profile and can include pairs of plugs held by an insulated support with a compact spacing between adjacent pairs and upper and lower plugs of each plug pair. The plug assembly can be attached to a racking frame to allow the plug assembly to be retracted during a rack-out action of the unit from a motor control center.

Abstract: A heat management structure for a wearable electronic device includes a first thermally conductive layer, a second thermally conductive layer, and insulating layer. The first and second thermally conductive layers and the insulating layer are arranged in a stacked configuration along their surface areas with the insulating layer disposed between and in physical contact with the first and second thermally conductive layers. At least one edge of the second thermally conductive layer extends beyond an edge of at least one of the first thermally conductive layer or the insulating layer.

Abstract: The present invention relates to a carrier module (100) for fieldbus modules that can be snapped onto a carrier profile and is movable on the carrier profile, with a first plug connector (101L) for electrically and mechanically connecting a left-side fieldbus module to the carrier module (100) and with a second plug connector (101R) for electrically and mechanically connecting a right-side fieldbus module to the carrier module (100).

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: In a switchgear cabinet, the line side power conductors upstream of the main breaker are surrounded with arc attenuating/extinguishing channels and protective conduit in a location prior to the conductor's attachment to the main breaker. Thus, passive arc attenuation can be had prior to the breakers, Personal Protection Equipment (PPE) levels can be predicted and controlled, and the need for action by circuit breakers during an arcing event is substantially lessened.

Abstract: A system for conveying air from one location to another includes a soft duct having a passage and an air flow control device. The air flow control device can be operated to vary a cross sectional area of a portion of the passage of the soft duct.

Abstract: A method of manipulating a cooling system of a data center includes designing a cooling system to address cooling needs in the data center, selecting components for the cooling system including one or more distribution boxes adapted to distribute coolant, one or more cooling racks, and flexible tubing to connect the one or more distribution boxes to the one or more cooling racks, assembling the components for the cooling system in the data center, operating the cooling system, identifying hot spots within the data center, and adjusting the location of one or more cooling racks in the data center based on the indentified hot spots in the data center.

Abstract: A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured to thermally contact heat-generating components in a computer system and a large water body such as river and reservoir. The heat created in computer system is carried out by liquid coolant and dissipated to large water body. The cooling system is simple and cost-effective.

Abstract: A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM) packages manufactured by using three-dimensional integrated circuit (3D IC) stacked using through-silicon via (TSV) stacking processes, and liquid cooling approach. The system has advantages of low power consumption, fast DRAM access rate, high performance, high cooling efficiency, small form factor, and low costs. Cooling liquid could be water, oil, and ionic liquid. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body such as river, reservoir, or ocean. The computer disclosed in this invention is suitable to be a server for application in datacenter.

Abstract: An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.

Abstract: A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

Abstract: A data center can include an inflatable enclosure in which rack computer systems can be installed and can provide computing capacity. The inflatable enclosure includes an inflatable structure which is at least partially inflated based on cooling air discharged into the inflatable enclosure by one or more cooling modules. A cooling module can include a cooling system and a cooling air vent, where the cooling system adjustably induces a stream of cooling air and the cooling air vent adjustably directs the cooling air stream into a particular space enclosed by an inflatable structure. The inflatable enclosure can be established by separate modules positioned on opposite sides of a space and an inflatable structure which extends across the space between the modules. The inflatable structure can be extended over additional spaces to expand the inflatable enclosure, thereby providing additional space to install rack computer systems.

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract: The invention relates to a cooling device for heat-emitting components, wherein at least one component is arranged on a printed circuit board and wherein the cooling device includes a first cooling member and a second cooling member. The two cooling members are arranged on the printed circuit board adjacent to and at a predetermined distance from the at least one component on opposite sides of the component. The invention further relates to a cooling arrangement for cooling at least one heat-emitting component arranged on a printed circuit board, wherein use is made of the cooling device.

Abstract: A method, apparatus, and system are described for a monolithic, pre-wired, pre-engineered, and pre-assembled integrated platform for a critical power supply and electrical distribution system that is scalable and modular. The skeletal framework of the integrated platform acts as an equipment support structure and includes an upper superstructure and a lower superstructure. Two or more cabinet enclosures are mounted onto the lower superstructure where their weight is supported by the skeletal framework. One or more National Electric Code approved (NEC-approved) electrical cable routing support systems are mounted onto the upper superstructure. The skeletal framework also includes one or more vertical columns that are connected between the upper superstructure and the lower superstructure. The skeletal framework and the cabinet enclosures are fabricated in place as a monolithic, pre-wired, pre-engineered, and pre-assembled integrated platform prior to being installed.

Abstract: An exemplary electric apparatus includes a fan for generating a first airflow, a component space includes a secondary electric component, and a housing. In order to obtain efficient cooling solution one or more walls separate the component space including the secondary electric component from the first cooling element for preventing the first airflow from entering the component space. A second cooling element has a first end in the component space and a second end located outside of the component space for dissipating heat received from the secondary electric component to the first airflow.

Abstract: The present invention relates to an arc deflecting and ventilation assembly (100) comprising of a slotted unit (102), wire mesh arrangement (106) and an array of are plates (108). The slotted unit (102) is provided with a plurality of slots (104) and is fixedly mounted to the electrical enclosure (109) and is provided with an open face (110), a closed face (112) and a wall structure (114). The arc deflecting and ventilation assembly (100) provides ventilation to the electrical enclosure (109) during normal conditions and also in an event of arcing. The present invention also provides systems (101) for arc deflecting and ventilation of hot gases generated within electrical enclosures (109).

Abstract: A switch assembly including a vacuum switch mounted to an at least partly electrically conductive housing, and a holder for a vacuum bottle. The housing includes at least one gas entry opening at a lower end of the housing and at least one gas exit opening at an upper end of the housing, and a first free heat convection path between the openings to provide cooling. A second free heat convection path may be provided in a free space between the holder and vacuum bottle. A switching device for connecting the vacuum switch to a second electric conductor. An electric power distribution switchgear, encapsulating at least one three-phase module including a switching device.

Abstract: A circuit breaker (33) formed with a sealed tank (4) having a breaker section and an operating mechanism (2) is laterally arranged in a lengthwise direction and is fixed to a frame (1), and above the circuit breaker, main bus containers (11, 12) are provided, substantially orthogonally to an axial direction of the circuit breaker (33). Operating mechanism-side working space (B) and breaker section-side working space (C) are provided respectively above the operating mechanism (2) and the sealed tank (4), and a hand hole (5) is provided on an upper surface of the sealed tank (4). A connecting pin (24) is provided in a link mechanism connecting the operating mechanism (2) and the movable contact (7), and an operating mechanism-side working hole for accessibility to the connecting pin (24) from the operating mechanism-side working space (B) is provided.

Abstract: An embodiment of the invention relates to busbars having different cross sections for a busbar system with a common protection and/or neutral conductor for the transport of electrical energy. The busbar system includes at least one first segment and a second segment, the segments having each at least one first busbar with a first cross-sectional area, at least a second busbar with a second cross-sectional area, a holding element and at least one connection. According to an embodiment of the invention, the busbars of the segments are held by the respective holding element and are electrically connected to each other via the at least one connection, and a busbar from either the first busbars or second busbars serves as a common protection conductor and/or as a common neutral conductor.