Abstract: The present disclosures provides an electronic control apparatus for a vehicle using overmolding in which a heat radiating plate is attached to an opposite side of a part requiring heat radiation in a printed circuit board (PCB) and a part other than the part, to which the heat radiating plate is attached, is overmolded so as to directly discharge heat to the air through the heat radiating plate such that a heat radiation effect is excellent, the heat radiating plate is attached in advance and then a housing is formed of mold resin such that a manufacturing process is simplified, and a printed circuit board (PCB) is surrounded by mold resin such that a waterproof function is excellent, and a manufacturing method thereof.

Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.

Abstract: A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.

Abstract: Described herein are various embodiments of a power distribution unit having modular components. For example, according to one embodiment, a power distribution unit can include a component portion that comprises at least two modules including outlet modules, circuit protection modules, power input modules, communications I/O modules, and display modules. Each of the at least two modules of the component portion can comprise at least one connection element and can be removably secured to one or more other of the at least two modules via the connection elements. The power distribution unit can also include a housing that defines an interior cavity. The component portion can be removably secured to the housing at least partially within the interior cavity.

Abstract: A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

Abstract: An electronic display assembly for suspending an electronic display from one or more elongate members is disclosed. A closed loop of circulating fluid, such as air, may be placed within a sealed electronics compartment. An open loop channel may permit fluid, such as ambient air, to pass through the assembly via a channel defined by the space between the back pan and the electronic display. A pair of passageways preferably extend vertically along the assembly and are configured to accommodate the passage of an elongate member. Clamps may be utilized within these passageways to secure the assembly to the elongate members.

Abstract: Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.

Abstract: A sealed plug-in circuit breaker panel has an enclosure defining a sealed interior portion. The enclosure includes a housing, a face plate removably coupled to the housing and a front seal member disposed between the face plate and the housing such that the face plate and the housing are sealingly engaged. The panel further includes an electrical bus structure coupled to the housing, a plurality of first plug-in members coupled to the bus structure and a number of circuit breakers disposed in the enclosure. Each circuit breaker includes a manual operator and at least a pair of second plug-in members which are electrically coupled to corresponding first plug-in members. The manual operator protrudes through and extends from a respective aperture formed in the face plate. The panel further includes a number of feeders and load connectors electrically coupled to the bus structure.

Abstract: A modular power distribution system comprises a chassis; and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) an OR-ing diode; (ii) a circuit protection device; (iii) a microprocessor controlling the circuit protection device; and (iv) a power output connection location. A circuit option switch is located on each module for setting the current limits for each module. A control module is provided connected to the backplane.

Abstract: A circuit breaker module is provided. The circuit breaker module includes: a frame assembly, a faceplate assembly, and a number of circuit breakers, the circuit breakers having an electrically conductive surface and an extending handle, the frame assembly having a front member and a back member, the frame assembly front member and the frame assembly back member being spaced from each other and defining an enclosed space, the frame assembly front member being electrically conductive, the faceplate assembly having an electrically conductive faceplate, the faceplate being a planar member with a number of openings therein, the faceplate coupled to the frame assembly front member, the circuit breaker disposed in the frame assembly enclosed space, and wherein the circuit breaker is in electrical communication with the faceplate and the frame assembly front member, whereby a current may pass from the circuit breaker to the frame assembly front member.

Abstract: Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.

Abstract: In a switchgear in which cables are used on both of the input side and the output side for connection between a main circuit and an external main circuit, a circuit breaker and connection conductors of the switchgear are stored in a box-shaped pressure tank together with insulating gas; an operating mechanism that performs opening and closing operation of the circuit breaker and a first cable connection portion that is connected to the connection conductors are attached to one face of the pressure tank; and a second cable connection portion that is connected to the connection conductors is attached to the other face of the pressure tank, the other face being parallel with respect to a direction connecting the operating mechanism and the circuit breaker.

Abstract: An electronic component includes a base substance, a cooling channel formed in the base substance and flows a cooling medium in a second direction from a first direction, a radiator formed in a surface of the cooling channel using a material of which thermal conductivity is higher than a thermal conductivity of the base substance or formed so that the radiator may project to the cooling channel, and that contacts the cooling medium.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

Abstract: An electric device provided includes a bottom case having an air outlet and an air inlet, a top cover combined with the bottom case, a fin set, a heat sink having a cold-end portion and a hot-end portion being opposite to each other, and a fan element. An accommodation space is defined between the bottom case and the top cover. The fin set is disposed in the accommodation space. The heat sink is disposed in the accommodation space, and the cold-end portion is adjacent to the air inlet, and the hot-end portion thereof is attached on a projection zone from the fin set to the top cover. The fan element draws airflows into the bottom case from the air in let for cooling the fin set and the hot-end portion.

Abstract: Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold.

Abstract: A cart with one or more of a power supply system that includes an outlet box and a plurality of flexible receptacles, a bi-layer shelf, a positionable cable routing tray, and a removable cable management module.

Abstract: An electronic device socket includes an insulating circuit board having a plurality of electrical terminals mounted therein, a decoupling capacitor mounted on the circuit board and a heat sink body. Each electrical terminal has a female upper end which can receive a lead of an electronic device, and a male lower end which can be received in a printed circuit board or another socket. The decoupling capacitor is electrically connected between the designated voltage and ground terminals. The heat conducting body has an upper surface configured to receive an electronic device in thermally conductive relation, and a lower surface having a recessed cavity configured to receive the circuit board. The heat conducting body has vias corresponding to the electrical terminals. The circuit board is received within the recessed cavity wherein the female upper ends of the electrical terminals are aligned with vias and receive the leads of an electronic device.

Abstract: Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled