Abstract: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.

Abstract: A heat sink fastener includes a heat sink assembly, a first stand, a second stand, a fastening plate, a fastening member, and a movable bar. The first stand includes a fastening portion. The second stand includes a restriction portion. The fastening plate is connected to the heat sink assembly. The fastening plate includes a hook portion, an extension portion, and a through hole. The hook portion is engaged with the fastening portion. The extension portion contacts with the restriction portion. The fastening member is inserted through the through hole and secured the second stand. The fastening member includes a bolt and a screw nail. The screw nail is provided with a pushing portion. The movable bar is connected to the second stand. The movable bar includes a pivot shaft, a restriction end restricting the pushing portion from movement, and a release end releasing the pushing portion to move.

Abstract: A cooling structure for an inverter (31) controls a motor (6) to drive an automobile. This inverter device (22) includes a power circuit section (28) having an inverter (31) to convert a DC power of a battery (19) to an AC power for the motor (6), and a casing (39) enclosing the power circuit section (28). A fin (41) is provided in an outer surface of the casing (39), a coolant path (42) for the flow of a cooling medium is provided within the casing (39) or in the outer surface thereof, and a pump (43) circulating the cooling medium in the coolant path (42) is disposed on or in the casing (39). With this structure, the flow resistance for cooling the inverter (31) is reduced to allow the pump (43) to be downsized and a proper cooling can be accomplished to the amount of heat by the inverter (31).

Abstract: An exemplary energy supply device for explosion-proof electronic functional units supplies each functional unit with a high-frequency AC voltage via an inductor. The inductors are formed as substantially congruent conductor tracks of a multi-level printed circuit board, which can be connected to one another and arranged vertically on a distribution printed circuit board. The number of metallization planes of the multi-level printed circuit board being greater than the number of metallization planes of the distribution printed circuit board.

Abstract: A heat-dissipating base is provided. The heat-dissipating base includes a main body and at least one first protrusion. The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface for thermally contacting at least one first component above the main body.

Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.

Abstract: A restraint assembly is for a switchgear system. The switchgear system includes an enclosure having a number of compartments and a number of electrical apparatus, such as for example, circuit breakers, movable into and out of the compartments. The restraint assembly includes at least one latch assembly comprising a mounting member, a latch pivotably coupled to the mounting member, and a number of biasing elements biasing the latch. The latch moves between a latched position corresponding to the latch locking an electrical apparatus within a corresponding compartment, and an unlatched position corresponding to the electrical apparatus being movable with respect to the compartment. The biasing elements bias the latch toward the latched position.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: A mobile computer workstation for use with a computer network is disclosed. The workstation can include a wheeled chassis having a vertical beam that supports a horizontal work surface. An input device tray is located at a front side of the work surface and a bracket located at a rear side of the work surface mounts a display screen to the workstation above and off the work surface. A power unit including a battery charger and a battery is mounted to the chassis and supplies power to the display screen.

Abstract: An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks.

Abstract: A cooling device includes a power module incorporating chips that generate heat and having chip arrangement in which a first chip having the largest amount of heat generation and second chips having the second largest amount of heat generation are not adjacent to each other and the first chip is adjacent to any two of third chips having the smallest amount of heat generation, a heat sink, to a base surface of which the power module is closely attached, and flat first and second anisotropic high heat conductors having a thermal conductivity higher than a main body disposed on the surface of the heat sink. The first and second anisotropic high heat conductors are separated into two and disposed under the first chip and under the second chips.

Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

Abstract: A heat-dissipating module including a fan holding structure and a fan is disclosed. The fan holding structure includes: a carrying body, at least one resilient clamping member, at least one resilient engaging member, and a plurality of resilient fixing members. The at least one resilient clamping member and the resilient fixing members are arranged on the carrying body. An electronic device includes an opening and at least one engaging member. The resilient engaging member corresponds to the engaging member, so that the heat-dissipating module with the fan holding structure is detachably arranged at the opening. The fan of the heat-dissipating module can be quickly and effectively detached and attached through the at least one resilient clamping member and the resilient fixing members.

Abstract: The present invention relates to an electrical distribution board. The electrical distribution board comprises at least one incoming conductor terminal, at least one outgoing conductor terminal, at least one longitudinal bus conductor connected to the at least one incoming conductor terminal, at least one lateral conductor tab connected to the at least one bus conductor for distributing electrical power from the at least one bus conductor to the at least one outgoing conductor terminal, and at least one isolation mechanism for electrically isolating the at least one outgoing conductor terminal from the at least one lateral conductor tab. The at least one isolation mechanism is moveable between a first position in which the at least one outgoing conductor terminal is electrically isolated from the at least one lateral conductor tab and a second position in which the at least one outgoing conductor terminal is electrically connected to the at least one lateral conductor tab.

Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

Abstract: A heat dissipation structure for a wearable mobile device comprises a wearable mobile device and a flexible belt. The wearable mobile device has a receiving space which receives a plurality of electronic components having at least one heat source. The flexible belt is made of rubber or silicone and has a cavity which has at least one wick structure and a working liquid. A wall of the cavity protrudes to form a supporting portion. The flexible belt defines a heat absorbing portion and at least one heat dissipating portion. Two ends of the heat absorbing portion form the heat dissipating portion. The heat absorbing portion contacts the electronic components or the heat source to conduct heat. The present invention provides a heat dissipation structure using a vapor-liquid circulating chamber and structure disposed in a flexible belt for a wearable mobile device to enhance the whole heat dissipation efficiency.

Abstract: A computing device housing is described. The housing includes a front shell and a back shell coupled to a mid-frame. An infrared port may be an integral portion of the housing or the mid-frame.

Abstract: A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant; a fan unit provided in the casing and configured to generate a second airflow by taking in the outside air through the second intake opening; and an electronic device provided in the casing and configured to be air-cooled by a mixed airflow of the first airflow and the second airflow and release an exhaust airflow after the air-cooling to the exhaust opening. The first intake opening and the second intake opening are provided on different surfaces of the casing.

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract: An apparatus includes an enclosure defining an interior space and at least one server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and includes at least one stability control unit at the bottom of the enclosure. Each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a first set of one or more dampers that are contiguous to natural air outside of the room and a second set of one or more dampers that are contiguous with air in the room.