Abstract: Electronics modules and cooling apparatuses having branching microchannels for liquid cooling by jet impingement and fluid flow are disclosed. In one embodiment, a cooling apparatus includes a heat receiving surface and an array of branching microchannel cells. Each branching microchannel cell includes an inlet manifold fluidly coupled to the heat receiving surface and a branching microchannel manifold fluidly coupled to the inlet manifold. The branching microchannel manifold includes a plurality of fins that orthogonally extend from the heat receiving surface such that the plurality of fins define a plurality of branching microchannels that is normal with respect to the heat receiving surface. The cooling apparatus further includes an outlet manifold fluidly coupled to the plurality of branching microchannels. The coolant fluid flows through the plurality of branching microchannels in a direction normal to the heat receiving surface.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: A gas insulated switchgear includes: gas tanks filled with insulating gas; a circuit breaker which is arranged such that the shaft center direction of a driving shaft thereof is parallel to a front portion of the gas tank and horizontal; a first disconnecting switch which is arranged on the lower side of the circuit breaker and is electrically connected to the circuit breaker; a busbar whose one end is connected to the circuit breaker and the other end is extended in the shaft center direction of the driving shaft of the circuit breaker; a second disconnecting switch electrically connected to the busbar; a cable terminal led out outside the gas tank from the first disconnecting switch; and a cable terminal led out outside the gas tank from the second disconnecting switch.

Abstract: Embodiments provide a low-profile, electronic circuit breaker. The electronic circuit breaker includes a housing containing first and second electrical branches coupled to respective first and second load terminals, and an electronic processing circuit within the housing adapted to monitor an electrical condition of the first and second electrical branches, wherein a maximum transverse width (Wt) of the housing is limited to occupy only a single standard breaker panelboard location. Circuit breakers including triggering mechanisms and tripping units are also disclosed. System and method aspects are provided, as are other aspects.

Abstract: A container-type data center is provided, which can be transported while having outdoor units of an air conditioning facility installed therein, and having an enhanced cooling effect. A partition panel 10 is provided for separating a container 100 into an IT equipment accommodation chamber 18 and an outdoor unit installation chamber 15, and on both ends of the panel are provided pillar sections 14e and 14f for the partition panel. The length-direction dimension of the outdoor unit installation chamber 15 is within the range of 1.6 to 2 meters, which can be selected arbitrarily according to the size of the outdoor units 6a through 6d. The outdoor units 6a through 6d are arranged so that their air discharge openings face the outer side in the width direction of the container. Regarding the outdoor units 6a through 6d, it is possible to set up an angle steel rack and stack two outdoor units vertically.

Abstract: A driver device has a rear frame end disposed on an axial end of a motor, a heat sink on which a power module is fastened, and a connector case disposed on an outside of the heat sink having a first connector and a second connector for an external connection. A plate is fastened onto the connector case, with a motor-facing contact face of the plate contacting the rear frame end and a motor-facing-away contact face of the plate contacting the heat sink. Heat conductivity of the plate is equal to or greater than that of the rear frame end and that of the heat sink combined. Thus, a gap between the rear frame end and the heat sink is sealed and heat from the heat sink on which the power module is fastened is appropriately transmitted to the rear frame end.

Abstract: A stacked package includes a substrate, and a first structure bonded to the substrate. The first structure has a plurality of bumps, and a first hydrophilic coating is on sidewalls of the first structure. The stacked package further includes a second structure bonded to the plurality of bumps. The first hydrophilic coating is on sidewalls of the second structure. The first structure is between the second structure and the substrate. The stacked package further includes a housing, wherein the housing defines a volume enclosing the first structure and the second structure. A second hydrophilic coating is on sidewalls of an inner surface of the housing. The stacked package further includes a cooling fluid within the volume enclosing the first structure and the second structure. A top surface of the cooling fluid is above a top surface of the second structure.

Abstract: The present invention provides a container-type data center having an air conditioning facility, which enables to effectively cool IT equipment by applying the arrangement to an existing container. A system ceiling 50 is attached to a ceiling surface 25 to send out cooling air to a cooling area 2 from a vent 31a of an indoor unit 31 of an air conditioning device disposed in a container 1, and a draft air duct is defined by the system ceiling 50, a down-wall 51 and the ceiling surface 25. A vinyl curtain 60 is provided on an upper portion of a rack 40 so as to prevent cooling air having reached the cooling area 2 from flowing out to a heat exhaust area 3 without passing through the rack 40 loading the IT equipment, and a vinyl curtain 70 in a form of a shop curtain is disposed at an area used as a path for operators entering the cooling area 2.

Abstract: A system and method for coupling electrical power subsea. The system comprises a subsea electrical distribution system having at least one modular subsea circuit breaker assembly. The modular subsea circuit breaker assembly may be coupled to sources of power and/or subsea loads via one or more subsea power cable harness assemblies. The modular subsea circuit breaker assembly has at least electrical connector. Each subsea power cable harness assembly has a corresponding electrical connector. At least one of these electrical connectors is extendable to engage an electrical connector opposite it.

Abstract: A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a control device. The container defines a number of air inlets and a number of air outlets. A number of first shielding plates movably coupled to the container to cover the air inlets and a number of second shielding plates movably coupled to the container to cover the air outlets. The container forms a cooling air channel at one side of the server cabinets and a heat air channel at an opposite side of the server cabinets. The ventilation pipe is communicated between the heat dissipation apparatus and at least one of the air inlets, the ventilation pipe defines a opening communicating with the heating air channel, and a third shielding plate is movably coupled to the ventilation pipe to cover the corresponding through hole.

Abstract: A contact bus bar assembly for supplying power to a load, and further pertains to a switching device which can be connected to such a compact bus bar assembly, and to a power distribution system. The bus bar assembly includes at least two electrically conductive tracks which are at least partly covered by an electrically insulating cover. An outer surface of said insulating cover is provided with a plurality of ribs arranged in a region connecting pin terminals. The switching device may additionally comprise a separating element provided with a plurality of second ribs.

Abstract: A mechanical interlock assembly for a network transformer primary disconnect assembly is provided. The mechanical interlock assembly includes a blocking member assembly with a body. The a blocking member assembly body includes an obstruction portion and a lacunar portion. The blocking member assembly is movably disposed adjacent to a movable operation contact carriage and a ground contact carriage. The blocking member assembly body is movable between a first position, wherein the blocking member assembly body obstruction portion is disposed in the path of the ground contact carriage, a neutral position, wherein the blocking member assembly body obstruction portion is disposed in the path of the ground contact carriage and the operation contact carriage, and a second position, wherein the blocking member assembly body obstruction portion is disposed in the path of the operation contact carriage.

Abstract: A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided.

Abstract: A junction box for a vehicle is provided. The junction box includes at least one printed circuit board having a metal core and a heat transfer member formed at an edge of the printed circuit board. In addition, the junction box includes a case in which at least one printed circuit board is disposed. Further, the heat transfer member contacts the inner surface of the case.

Abstract: An enclosure includes an explosion resistant housing having a back wall, a top, a first side, a second side, and a door. The enclosure further including a transistor disposed on the back wall of the explosion resistant housing. The enclosure also includes a passive heat exchanger disposed on the outside of the back wall of the explosion resistant housing. Also, a method of thermal management within an enclosure includes transferring heat from a transistor within an explosion resistant housing, wherein the heat is transferred from the transistor to a back wall of the explosion resisting housing. The method further includes passively removing the heat from the explosion resistant housing.

Abstract: An immersion cooling tank includes: a tank comprised of a base wall, and perimeter walls, and having a lower tank volume in which a liquid can be maintained and heated to a boiling point to generate a rising plume of vapor; a rack structure within the tank volume that supports insertion of multiple, heat dissipating electronic devices in a side-by-side vertical configuration; and a condenser configured as a plurality of individually rotatable condenser sub-units, with each condenser sub-unit located above a vertical space that extends vertically from the lower tank volume and within which an electronic device can be inserted. Each individual condenser sub-unit can be opened independent of the other sub-units and each other condenser sub-unit can remain in a closed position while a first condenser sub-unit is opened to allow access to a first vertical space and any existing electrical device contained therein below the first condenser sub-unit.

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract: A package for active electronics is provided. The package includes a housing structure configured to house the active electronics, a connector element and an interposer element disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element.

Abstract: A faceplate for use in a panel for electrical switching apparatus includes a generally planar member having a first surface, an opposite second surface and a number of apertures disposed through the first surface and the opposite second surface. Each aperture is configured to receive an actuatable mechanism of an electrical switching apparatus. The faceplate further includes a number of inclined features, each extending from the opposite second surface about a respective aperture of the number of apertures. At least one inclined feature includes an inclined surface disposed opposite the opposite second surface of the generally planar member. The inclined surface is disposed at a non-zero angle with respect to the generally planar member.