Abstract: A data structure that identifies a characteristic of a region that is located between programming distributions of the memory device and that corresponds to read level thresholds at the region is determined. An estimator type is selected from a plurality of estimator types corresponding with the data structure. A read level threshold of the read level thresholds is estimated using the selected estimator type. A read operation is performed at the memory device using the read level threshold estimated using the selected estimator type.

Abstract: A method and device for Fail Bit (FB) repairing. The method includes: a bank to be repaired of a chip to be repaired is determined; first repair processing is performed on first FBs in each target repair bank using a redundant circuit; second FBs are determined, and second repair processing is performed on the second FBs through a state judgment repair operation; for each target repair bank, unrepaired FBs in the target repair bank is determined, and candidate repair combinations and candidate repair costs of the unrepaired FBs are determined using an optimal combined detection manner; and a target repair cost is determined according to the candidate repair costs, and a target repair solution corresponding to the target repair cost is determined to perform repair processing on the unrepaired FBs according to the target repair solution.

Abstract: Provided are standby circuit dispatch method, apparatus, device and medium. The method includes: a first test item is executed and first test data is acquired, the first test data including position data of a failure bit acquired during execution of the first test item; a first redundant circuit dispatch result is determined according to the first test data; a second test item is executed and second test data is acquired; when the failure bit acquired during execution of the second test item includes a failure bit outside the repair range of the dispatched regional redundant circuits and dispatched global redundant circuits, and the dispatchable redundant circuits have been dispatched out, a maximum target bit umber is acquired according to the first test data and the second test data; and a target dispatch mode is selected and a second redundant circuit dispatch result is determined according to the target dispatch mode.

Abstract: A system includes a memory device and a processing device. The processing device performs, at a first frequency, a first scan of a page of a block family that measures a first data state metric and identifies a specific bin corresponding to a measured value for the first data state metric. Processing device updates a bin, to which the page is assigned, to match the specific bin. Processing device performs, at a second frequency higher than the first frequency, a second scan of the page to measure a second data state metric for read operations performed using a threshold voltage offset value from each of multiple bins. Processing device updates the bin, to which the page is assigned for the specified die, to match a second bin having the threshold voltage offset value that yields a lowest read bit error rate from the second scan.

Abstract: Methods, apparatuses, and systems for staggering refresh operations to memory arrays in different dies of a three-dimensional stacked (3DS) memory device are described. A 3DS memory device may include one die or layer of that controls or regulates commands, including refresh commands, to other dies or layers of the memory device. For example, one die of the 3DS memory may delay a refresh command when issuing the multiple concurrent memory refreshes would cause some problematic performance condition, such as high peak current, within the memory device.

Abstract: A memory system includes: a memory controller suitable for: generating a first target address by sampling an active address according to an active command, providing the active address together with the active command, and providing a first target refresh command together with the first target address; and a memory device suitable for: generating a second target address by sampling the active address according to the active command, performing a target refresh operation on at least one word line corresponding to the first target address according to the first target refresh command, and performing the target refresh operation on at least one word line corresponding to the second target address according to a second target refresh command.

Abstract: A voltage of a conductive line, such as a control line, a data line, or a voltage supply line associated with a memory die may be monitored. A frequency response of the voltage may be analyzed to determine if the conductive line may be operating at or near a specific frequency, such as a resonance frequency. If the conductive line is operating at or near the specific frequency, an action, such as a memory operation, may be performed to mitigate the resonance of the conductive line. The monitoring, analyzing, and action performing may be accomplished with circuitry of the memory die.

Abstract: A method for using a high bandwidth memory controller includes providing a clock signal having a first clock frequency, providing a write strobe signal having a second clock frequency, providing a write command/address signal based on the clock signal, and providing a write data signal based on the write strobe signal. The first clock frequency is half of the second clock frequency, the write strobe signal has two cycles of pre-amble before the write data signal, and the write strobe signal has two cycles of post-amble after the write data signal.

Abstract: Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, an apparatus may include a memory cell, a differential amplifier having a first input node, a second input node, and an output node that is coupled with the first input node via a first capacitor, and a second capacitor coupled with the first input node. The apparatus may include a controller configured to cause the apparatus to bias the first capacitor, couple the memory cell with the first input node, and generate, at the output node, a sense signal based at least in part on biasing the first capacitor and coupling the memory cell with the first input node. The apparatus may also include a sense component configured to determine a logic state stored by the memory cell based at least in part on the sense signal.

Abstract: A memory device is provided, the memory device includes multiple cells arranged in a matrix of multiple rows and multiple columns. The memory device further includes multiple bit lines each of which is connected to first cells of the multiple cells arranged in a row of the multiple rows. A voltage control circuit is connectable to a selected bit line of the multiple bit lines and includes a voltage detection circuit that detects an instantaneous supply voltage and a voltage source selection circuit connected to the voltage detection circuit. The voltage source selection circuit selects a voltage source from multiple voltage sources based on the detected instantaneous supply voltage. The voltage source selection circuit includes a switch that connects the selected voltage source to the selected bit line to provide a write voltage.

Abstract: Systems and methods are provided for reading data from non-volatile storage devices and decoding the read data. A method may include obtaining a unique identifier for a storage location to be read, retrieving from a memory an adjustment to read reference voltage (Vref) associated with the unique identifier, performing a read operation on the storage location using a read reference voltage adjusted by the adjustment to Vref, decoding data read from the storage location in a decoding process and updating the adjustment to Vref with decoding information generated during the decoding process.

Abstract: Methods, systems, and devices for sensing techniques for differential memory cells are described. A method may include selecting a pair of memory cells that comprise a first memory cell coupled with a first digit line and a second memory cell coupled with a second digit line for a read operation, the pair of memory cells storing one bit of information. The method may further include applying a first voltage to a plate line coupled with the first memory cell and the second memory cell and applying a second voltage to a select line to couple the first digit line and the second digit line with a sense amplifier. The amplifier may sense a logic state of the pair of memory cells based on a difference between a third voltage of the first digit line and a fourth voltage of the second digit line.

Abstract: Apparatuses, systems, and methods for single-ended global and local input/output architecture. A conventional memory may use local input/output (LIO) and global input/output (GIO) lines which are paired and carry complimentary signals. The present disclosure includes single ended LIO and GIO architecture where a single LIO couples a single GIO between a read/write amplifier and bit line as part of an access operation. This may reduce a footprint of the memory device.

Abstract: A processing device of a memory sub-system is configured to determine a current refresh frequency associated with the memory device, the current refresh frequency specifying a rate of performing refresh operations on data stored at the memory device; compute an updated refresh frequency by updating the current refresh frequency based on a criterion reflecting a result of comparing one or more operating parameters of the memory device to their respective threshold values; and perform a refresh operation on data stored at the memory device according to the updated refresh frequency.

Abstract: Hardware-assisted Dynamic Random Access Memory (DRAM) row merging, including: identifying, by a memory controller, in a DRAM module, a plurality of rows storing identical data; storing, in a mapping table, data mapping one or more rows of the plurality of rows to another row; and excluding the one or more rows from a refresh the DRAM module.

Abstract: A repair circuit includes: a plurality of redundant memory cells, each redundant memory cell being configured with a state signal; and a repair module connected to the plurality of redundant memory cells and configured to determine target memory cells from the redundant memory cells based on the state signals and repair defective memory cells through the target memory cells. The target memory cells are in one-to-one correspondence to the defective memory cells. The repair module can repair, at each of multiple repair stages, different defective memory cells, the plurality of redundant memory cells being shared at the multiple repair stages.

Abstract: A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.

Abstract: Methods, systems, and devices for write operation techniques for memory systems are described. In some memory systems, write operations performed on target memory cells of the memory device may disturb logic states stored by one or more adjacent memory cells. Such disturbances may cause reductions in read margins when accessing one or more memory cells, or may cause a loss of data in one or more memory cells. The described techniques may reduce aspects of logic state degradation by supporting operational modes where a host device, a memory device, or both, refrains from writing information to a region of a memory array, or inhibits write commands associated with write operations on a region of a memory array.

Abstract: Embodiments of the disclosure, there is provided a method, a system for adjusting the memory, and a semiconductor device. The method for adjusting the memory includes: acquiring a mapping relationship between a temperature of a transistor, an equivalent width-length ratio of a sense amplifier transistor in a sense amplifier and an actual time at which the data is written into the memory; acquiring a current temperature of the transistor; and adjusting the equivalent width-length ratio, based on the current temperature and the mapping relationship, so that the actual time at which the data is written into the memory corresponding to the adjusted equivalent width-length ratio is within a preset writing time.

Abstract: Disclosed herein is an apparatus that includes: first and second wiring patterns extending in a first direction, first and second transistors arranged adjacent to each other, and third to sixth wiring patterns extending in a second direction. The third wiring pattern is connected between the first wiring pattern and one of source/drain regions of the first transistor, the fourth wiring pattern is connected between the second wiring pattern and other of source/drain regions of the first transistor, the fifth wiring pattern is connected to one of source/drain regions of the second transistor, the fifth wiring pattern overlapping with the first wiring pattern, the sixth wiring pattern is connected to other of source/drain regions of the second transistor, the sixth wiring pattern overlapping with the second wiring pattern. The third and fourth wiring patterns are greater in width in the first direction than the fifth and sixth wiring patterns.