Patents Examined by Minh N Trinh
  • Patent number: 11056869
    Abstract: A device for leading cables through a wall orifice of a switch cabinet includes a one-piece housing with a strain relief element attached to an inner side of the housing. An assembly window is provided on an opposite side, through which assembly window the strain relief elements can be actuated. The closing of the window by a cover causes seal elements to be compressed and the cables to be sealed to the housing.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: July 6, 2021
    Assignee: HARTING Electric GmbH & Co. KG
    Inventor: Albert Ferderer
  • Patent number: 11056812
    Abstract: An actuator device includes: an actuator including first contacts arranged in a first direction; and a wire member including second contacts and joined to the actuator. The second contacts are arranged in the first direction and respectively connected to the first contacts. Each of particular contacts as the first contacts or the second contacts has a protruding and recessed portion including: at least two protrusions; and a recess between the at least two protrusions. The particular contacts include: at least one central-region contact disposed on a central region in the first direction; and at least one end-region contact disposed nearer to an end region than to the central region in the first direction. The protruding and recessed portion of each of the at least one central-region contact is different in shape from the protruding and recessed portion of each of the at least one end-region contact.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: July 6, 2021
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Toru Kakiuchi, Yasuo Kato, Rui Wang, Yuichi Ito
  • Patent number: 11046533
    Abstract: A magnetic track system for transporting batteries at a telecommunications site includes a plurality of pods which are magnetic and which are attachable to a battery; and a track system including repelling magnets, wherein the track system is selectively laid between a first point to a second point to transport the battery with the plurality of pods attached thereto, wherein the transport comprises pushing or pulling the battery along the track system. The track system can include a plurality of tracks, strips, or a rollable mat. The track system can have a length less than a distance between the first point and the second point, wherein the track system is moveable such that tracks which have already been traversed by the battery are moved to a front to accommodate the distance.
    Type: Grant
    Filed: July 7, 2018
    Date of Patent: June 29, 2021
    Assignee: ETAK Systems, LLC
    Inventors: Michael Griffin, Lee Priest
  • Patent number: 11050153
    Abstract: A method includes placing a device die and a pre-formed dielectric block over a first carrier, encapsulating the device die and the pre-formed dielectric block in an encapsulating material, grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block, removing the carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block, and forming a ground panel, a feeding line, and a patch on the encapsulating material. The ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: June 29, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Monsen Liu, Lai Wei Chih, Chung-Hao Tsai, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang
  • Patent number: 11051415
    Abstract: A method for assembling the electronic device is provided, including providing a band member, forming a buffer structure on the band member by overmolding, pulling the band member out of the buffer structure to form a channel in the buffer structure, providing a flexible circuit, and disposing the flexible circuit through the channel.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: ACER INCORPORATED
    Inventors: Sheng-Wen Wu, Yu-Cheng Huang, Ke-Hua Lin, Shao-Chi Chuang, Wen-Shu Lee
  • Patent number: 11039539
    Abstract: A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: June 15, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Juan Chen
  • Patent number: 11038312
    Abstract: A method for connecting an electrical cable having at least one wire made of aluminum or an aluminum alloy to a connector element includes the following steps: Inserting a stripped portion at an end of the electrical cable into a tube of the connector element. Crimping the tube where an end portion of the electrical cable is arranged so that a relative motion between the tube and the electrical cable is prevented. Crimping the tube where a second portion of the electrical cable is arranged, the second portion being further from the end of the electrical cable than the end portion, such that a change of the cross section and an elongation of the least one wire at the second portion of the electrical cable is caused. Resistance welding the tube to the at least one wire at the second portion of the electrical cable.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: June 15, 2021
    Assignee: Strunk Connect automated solutions GmbH & Co. KG
    Inventors: Olaf Strunk, Nico Langberg
  • Patent number: 11031329
    Abstract: A method of fabricating a packaging substrate is provided, which includes: forming on a carrier a conductor layer having a plurality of openings; forming a plurality of conductive bumps on the conductor layer, wherein each of the conductive bumps has a post body disposed in a corresponding one of the openings and a conductive pad disposed on the conductor layer, the post body being integrally formed with the conductive pad and less in width than the conductive pad; forming a plurality of conductive posts on the conductive pads; forming on the carrier a first insulating layer that encapsulates the conductive bumps and the conductive posts; removing the carrier; and removing the entire conductor layer to expose the post bodies from a first surface of the first insulating layer. As such, a semiconductor chip can be bonded to the packaging substrate through the conductive bumps.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: June 8, 2021
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang
  • Patent number: 11032907
    Abstract: A printed board joining method according to an embodiment includes preparing a printed board having, on an upper surface, a plurality of connection land portions provided along a side end, preparing a printed board having, on a lower surface, a plurality of connection land portions along a side end, and joining the printed board and the printed board together with a conductive joining material such that the upper surface is opposed to the lower surface and the plurality of connection land portions are electrically connected to the corresponding connection land portions. One or more cutout portions are provided between the plurality of connection land portions and/or between the plurality of connection land portions.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: June 8, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventor: Toshifumi Okano
  • Patent number: 11031582
    Abstract: An apparatus for manufacturing an electrode performs press-working of a strip electrode being conveyed. This manufacturing apparatus includes a press roll including a roll surface having a width that is twice or more a width of the strip electrode, a switch configured to switch a contact region of the roll surface contacting with the strip electrode during press-working, and a controller. When an abnormality of the roll surface is detected in a state where the contact region of the roll surface is a region located on the left side with respect to a center line of the roll surface, the controller controls the switch such that the contact region of the roll surface is switched to a region located on the right side with respect to the center line of the roll surface.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: June 8, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shigeru Suzuki
  • Patent number: 11024936
    Abstract: Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 1, 2021
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
  • Patent number: 11017963
    Abstract: The present disclosure provides an intelligent lighting control system including a releasable faceplate. The faceplate is used for installation of at least one base module. The base module has a base housing that forms a well and includes a first connector positioned in the well. The base module further includes a power terminal configured to receive electrical current and a dimmer circuit configured to modulate a flow of the electrical current to a load terminal coupled to a lighting circuit. A switch controller is mounted in the faceplate and includes a second connector configured to electrically engage with the first connector when the faceplate is pivoted to the base module. The switch controller is further configured to send one or more commands to the base module to control the dimmer circuit.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 25, 2021
    Assignee: Racepoint Energy, LLC
    Inventors: William Lark, Jr., Nicholas David Pennycooke
  • Patent number: 11019727
    Abstract: In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: May 25, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masashi Matsubara
  • Patent number: 11018543
    Abstract: A method is for manufacturing a stator of a rotary electric machine. The method includes; forming a stator core; forming each of cassette coils by concentrically winding rectangular wire for the specified number of turns, each of the cassette coils being formed by applying a shift amount with respect to an axis in a winding direction to a wire shape of at least one of the turns before being attached to the teeth; attaching each of the cassette coils to each of teeth while canceling the shift amount; and forming a wire coil of the rotary electric machine by connecting a winding terminal of one of the cassette coils to a winding terminal of another of the cassette coils.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: May 25, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hiroshi Hoshina
  • Patent number: 11014187
    Abstract: A method of manufacturing a Radio Frequency (RF) coil for a multi-driven RF based negative ion source includes manufacturing a first coil and a second coil using tubes of stainless steel as a substrate material, coating the first coil and the second coil separately; and joining the first coil and the second coil by orbital TIG welding after coating the first coil and the second coil to provide the RF coil for the multi-driven RF based negative ion source.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: May 25, 2021
    Assignee: Institute for Plasma Research
    Inventors: Jaydeep Joshi, Chandra Mouli Rotti, Arun Kumar Chakraborty, Mainak Bandyopadhyay, Agrajit Gahlaut, Milind Kumar Patel, Venkata Nagaraju Muvvala, Deepak Kumar Parmar
  • Patent number: 11011915
    Abstract: Various embodiments of a wireless connector system are described. The system has a transmitter module and a receiver module that are configured to wirelessly transmit electrical energy and/or data via near field magnetic coupling. The wireless connector system is designed to increase the amount of wirelessly transmitted electrical power over a greater separation distance. The system is configured with various sensing circuits that alert the system to the presence of the receiver module to begin transfer of electrical power as well as undesirable objects and increased temperature that could interfere with the operation of the system. The wireless connector system is a relatively small foot print that is designed to be surface mounted.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: May 18, 2021
    Assignee: NuCurrent, Inc.
    Inventors: Vinit Singh, Pavel Shostak, Jason Luzinski, Glenn E Riese, Robert Giometti, Oleg Los
  • Patent number: 11013159
    Abstract: A component mounting device mounts electronic components fed at component feeding positions arranged in one line onto printed circuit boards, and includes a rotary head and a head transfer mechanism. The rotary head includes a rotary body, an N-axis servomotor that rotates the rotary body, pickup nozzles attached to the rotary body in a movable manner along a rotation axis, and two Z-axis drive units. The pickup nozzles are arranged on an imaginary circle centered at the rotation axis, and hold and release the electronic components. The Z-axis drive units move one of the pickup nozzles located at a predetermined driving position on the imaginary circle along the rotation axis. The N-axis drive units are arranged with the rotary body therebetween in a direction in which the component feeding positions are arranged. The head transfer mechanism moves the rotary head in a direction perpendicular to the rotation axis.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: May 18, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Tomoyoshi Utsumi
  • Patent number: 10993334
    Abstract: A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 27, 2021
    Assignee: Manaflex, LLC
    Inventor: Robert Clinton Lane
  • Patent number: 10993357
    Abstract: A component mounter comprises a reel holder that holds a reel on which a carrier tape accommodating components is wound, a tape supplier that feeds the carrier tape withdrawn from the reel held by the reel holder to a predetermined component supplying position, and a mounting head that performs component mounting of removing the component from the carrier tape and mounting the component on a board. The reel holder includes a first reel support that supports the reel when component mounting is performed, a second reel support that supports a reel on which the carrier tape to be withdrawn by the tape supplier when a next component mounting is performed, and a reel guide that guides the reel moving from the second to first reel support by receiving a force acting toward the first reel support when the force acts on the reel supported on the second reel support.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: April 27, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yuzuru Taniguchi
  • Patent number: 10993359
    Abstract: A reel holder includes a reel supporting member that is configured to support an axle against a force of gravity. The reel supporting member has an abutting part configured to support a reel, form a discharge opening having a width that allows the axle of the reel to be discharged through the discharge opening, and abut on carrier tape that is wound around the axle and accommodates a component. The reel holder further includes a tape supplier configured to pull out the carrier tape from the reel held by the reel holder and feed the carrier tape to a predetermined component supplying position. The axle of the reel, which displaces under the force of gravity with a decreasing amount of the carrier tape wound around the axle by pulling the carrier tape from the reel, is guided to the discharge opening by the reel supporting member.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: April 27, 2021
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yuzuru Taniguchi