Abstract: A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 ?m to 2 ?m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.

Abstract: A frequency adjustment method of a vibrator element includes preparing a vibrator element that has a vibrating arm, a first weight placed on one principal surface of the vibrating arm, and a second weight placed on the other principal surface of the vibrating arm, in which the first weight has a non-overlapping region which does not overlap the second weight in a plan view in a normal direction of the principal surface, preparing a substrate including a wiring portion, and fixing the vibrator element to the substrate by causing the other principal surface side of the vibrator element to face the substrate side, and irradiating the non-overlapping region of the first weight with an energy ray from one principal surface side, removing a portion of the non-overlapping region of the first weight, and adjusting a resonance frequency of the vibrating arm.

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The method includes steps of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane, overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive paste provided between the facing electrical connection pads. To prepare the printed wiring boards, attach an insulating film to at least one of surfaces faced when the boards are overlaid in the overlaying, bore holes in the insulating film so that the electrical connection pads are exposed, and provide a conductive paste in the holes.

Abstract: A component-handling device for removing components from a structured component supply and for depositing the removed components at a receiving device. A first turning device having a plurality of receiving units receives a component from the structured component supply at a dispensing point, to turn the received component by a first predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a transfer point. A second turning device having a plurality of receiving units receives the component at the transfer point from a receiving unit of the first turning device, to turn the received component by a second predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a depositing point.

Abstract: The present disclosure provides a device transferring apparatus and a device transferring method, comprising: a controlling component and a punching component, the punching component is located at one side of the controlling component; the punching component comprises at least one punching head movable in a first direction; and the controlling component comprises a protruding portion corresponding to the at least one punching head and capable of protruding toward the corresponding punching head, the protruding portion pushes the punching head to move in the first direction by protruding the protruding portion.

Abstract: A method is described that is suitable for automated use of peg apparatus and an electrical wire harness peg board. The pegs are utilized on a wire harness peg board during the assembly of a wire harness, and are particularly well suited for use in an automated assembly of the electrical wire harness where a constant upward, downward or lateral tension is desired without altering the free ends of each wire of a bundled wire harness.

Abstract: An electronic coupler removal tool (100) that includes a housing (102), a wall (104), a hook member (106), an electronic coupler-receiving portion (108), and an electronic coupler-release mechanism (202), is provided. The housing includes a first surface (102a), a second surface (102b) and a third surface (102c). The wall extends substantially perpendicularly from the first surface. The hook member extends substantially perpendicularly from the wall and is configured to receive a cable portion (308) coupled to an electronic coupler (300). The hook member, the wall, and the first surface define the electronic coupler-receiving portion that is configured to slidably receive the electronic coupler. The electronic coupler release mechanism includes a plunger rod (204) having a first end (210) and a second end (212) and is movable with respect to the housing (102) to engage a locking tab (306) of the electronic coupler at least partially within the electronic coupler-receiving portion.

Abstract: A receiving device for components. The receiving device is designed to be adjusted in a controlled manner relative to a deposit point at least partly along a first, second, and/or third axis by at least one linear drive and/or move a support guided by the receiving device along one of the first and/or second axes by a drive. The receiving device has a position sensor which is paired with a component deposit point in order to detect a component which has only been partly deposited in a pocket of the support at the component deposit point, where the position sensor is connected to the receiving device laterally of the support such that the position sensor is moved directly together with the receiving device.

Abstract: A rotating electrical machine having holding surfaces on a pair of housings which firmly holds a stator core made of a core stack. The holding surfaces have a small-diameter first annular surface and a large-diameter second annular surface arranged at different locations in the axial direction. The surfaces in contact with inner and outer circumferential regions of a yoke hold the core. Two contacts between the housing and core are in different locations on a radial and axial direction. An outer peripheral side of the yoke where plate thickness is smaller and an inner peripheral side where plate thickness is larger are pressed individually in the axial direction. A firm holding feature suitable for configuration of the yoke is ensured to setting a difference in level between the contacts Eliminating problems about gaps created between layers of the core stack without any changes to the structure of the core stack.

Abstract: A method for inserting a wire into a longitudinal groove of a semiconductor chip for the assembly thereof, the groove containing a pad made of a bonding material having a set melting point, comprises: in a positioning step, placing a longitudinal section of the wire along the groove, in forced abutment against the pad; and, in an insertion step, exposing a zone containing at least one portion of the pad to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad at least partially melt, and causing the wire to be inserted into the groove. The present disclosure also relates to a piece of equipment allowing the insertion method to be implemented.

Abstract: A method for manufacturing an electrode belt that includes pressing a belt-shaped current collector foil with an electrode mixture layer along a longitudinal direction in a thickness direction of the electrode mixture layer so that the electrode mixture layer is formed on a part of the current collector foil, and stretching, by a stretching roll, a non-forming part of the current collector foil in which the electrode mixture layer is not formed and in which the current collector foil is exposed in respective ends in a width direction. The stretching roll includes a first roll opposed to the electrode mixture layer, and a pair of second rolls arranged in respective ends of the first roll in an axial direction and opposed to the non-forming part. A central axis of the first roll is deviated with respect to a central axis of the pair of second rolls.

Abstract: The present disclosure provides a method making a semiconductor structure with an antenna module. The semiconductor structure includes an antenna substrate with a first surface and a second surface opposite to the first surface; an antenna module is disposed on the first surface of the antenna substrate; and a redistribution layer is disposed on the second surface of the antenna substrate. The method of making the semiconductor structure with the antenna includes fabricating the antenna module and the redistribution layer on two opposite surfaces of the antenna substrate, the material of the antenna substrate for supporting the antenna module can be selected according to actual needs, to provide more options. Signal loss can be reduced through the selection of the antenna substrate; the redistribution layer is provided on the surface of the antenna substrate for bonding the semiconductor chips.

Abstract: A tool has a pneumatic cylinder driving unit, a stationary portion, a movable portion, a loading portion, a first heating portion, and a second heating portion. The movable portion is movably connected to a first and second stationary shaft of the stationary portion, the movable portion is fixedly connected to the pneumatic cylinder driving unit by a movable shaft, the movable shaft is driven to slide axially with respect to the first and second stationary shaft by the pneumatic cylinder driving unit, the loading portion is movably connected to the second stationary shaft of the stationary portion and slides between a stationary portion body and a movable portion body, the loading portion rotates around the second stationary shaft.

Abstract: A capacitor unit and a manufacturing method thereof are provided. The manufacturing method includes the following steps. An isolation layer is formed on a substrate. A first capacitor stacked structure and a second capacitor stacked structure are formed on the isolation layer. Electrode connectors are formed on the first capacitor stacked structure and the second capacitor stacked structure. The electrode connectors are exposed, so that the electrode connectors, the first capacitor stacked structure, the second capacitor stacked structure, the isolation layer, and the substrate are combined to form a capacitor integrated structure, wherein the isolation layer electrically isolates the substrate from the first capacitor stacked structure and the second capacitor stacked structure. The capacitor integrated structure is cut to form a first capacitor unit and a second capacitor unit separated from each other.

Abstract: A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.

Abstract: A method for manufacturing a capacitor includes a step of forming a case integrated with a terminal unit designed to be connected with an external terminal, and a step of housing a capacitor element in the case so that the terminal unit is electrically connected to the capacitor element. The step of forming the case includes heating a metal mold to a temperature less than or equal to a glass transition temperature of a thermoplastic resin that is a material for the case. The metal mold internally has a mold part that is a hollow part having a shape of the case. And the step of forming the case further includes, after the heating of the metal mold and inserting the terminal unit into the mold part, injecting the thermoplastic resin in a molten state into the mold part of the metal mold.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet containing a ceramic powder and forming an internal electrode pattern on the ceramic green sheet using a conductive paste containing conductive metal particles and an additive. A ceramic laminate is formed by stacking the ceramic green sheets on which the internal electrode pattern is formed. A ceramic body including dielectric layers and internal electrodes is formed by sintering the ceramic laminate. An average number of conductive metal particles in the internal electrode pattern in a thickness direction is more than 2 and 5 or less.

Abstract: An apparatus for manufacturing an electrode performs press-working of a strip electrode being conveyed. This manufacturing apparatus includes a press roll including a roll surface having a width that is twice or more a width of the strip electrode, a switch configured to switch a contact region of the roll surface contacting with the strip electrode during press-working, and a controller. When an abnormality of the roll surface is detected in a state where the contact region of the roll surface is a region located on the left side with respect to a center line of the roll surface, the controller controls the switch such that the contact region of the roll surface is switched to a region located on the right side with respect to the center line of the roll surface.