Abstract: A bonder includes a first chuck unit 1A, a second chuck unit 1B, a first base 21A, a second base 21B, and a first floating mechanism 3A. The first chuck unit 1A and the second chuck unit 1B are chuck units in a pair including respective suction surfaces for suction of bonding targets and are arranged while respective suction surfaces 11a and 11b face each other. The first base 21A and the second base 21B support the first chuck unit 1A and the second chuck unit 1B respectively. The first floating mechanism 3A applies gas pressure to a back surface 12a of the first chuck unit 1A to float the first chuck unit 1A from the first base 21A, thereby moving the suction surface 11a of the first chuck unit 1A toward the suction surface 11b of the second chuck unit 1B.

Abstract: A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

Abstract: A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.

Abstract: A multilayer ceramic capacitor includes a laminate including ceramic layers and internal electrode layers arranged in a stacking direction, and two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed. The laminate has a rectangular parallelepiped configuration or shape and includes two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces. On at least one of the four surfaces, the laminate includes a protrusion in which the exposure region protrudes outward.

Abstract: This invention describes an apparatus for assembling triple pane insulating glass units from a plurality of insulating spacer frames having sealant or adhesive applied to opposite sides of said spacer frames.

Abstract: A process for manufacturing finished wire and cable having reduced coefficient of friction and pulling force during installation, includes providing a payoff reel containing at least one internal conductor wire; supplying the at least one internal conductor wire from the reel to at least one extruder; providing the least one extruder, wherein the least one extruder applies an insulating material and a polymerized jacket composition over the at least one internal conductor wire, wherein the polymerized jacket composition comprises a predetermined amount by weight of nylon; a predetermined amount by weight of mineral oil in the range of 0.

Abstract: A method of installing a winding in a stator includes forming a first multi-conductor winding including a first plurality of terminal leads and a second plurality of terminal leads, forming a second multi-conductor winding including a third plurality of terminal leads and a fourth plurality of terminal leads, introducing the first multi-conductor winding into a plurality of stator slots of a stator body, introducing the second multi-conductor winding into the plurality of stator slots of the stator body radially inwardly of the first multi-conductor winding, and connecting the second plurality of terminal leads with the third plurality of terminal leads to form a twelve conductor stator winding.

Abstract: A circuit board includes: an insulating layer; a capacitor which is provided in the insulating layer and which includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including an opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a recess part at a position corresponding to the opening part; and a conductor via provided in the insulating layer, penetrating the dielectric layer, the opening part and the recess part, being in contact with the recess part, and being smaller than the opening part in plan view.

Abstract: A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.

Abstract: A cable processing device includes at least one processing unit for assembling a cable and a sorting unit that can be actuated with a selection signal to output a cable received from the processing unit at least on a first side or on a second side according to the selection signal.

Abstract: A manufacturing method of a core for a rotary electric machine includes: a step of forming a stator side release hole in at least a first portion of a portion of an electric steel plate in which a slot portion is formed; a step of forming a rotor side hole portion in at least a part of a portion of the electric steel plate in which a hole portion is formed; a step of forming a flattened portion; and a step of forming a rotor plate member and a stator plate member by blanking the electric steel plate.

Abstract: Provided is a method for manufacturing an iron core that enables reduction of variations in dimension of a plurality of metal plates that occur during pressing of the laminate of these metal plates. The method includes: a laminate preparation step of stacking a plurality of metal plates to prepare a laminate; a pressing step of giving a temperature gradient to the laminate and pressing the laminate with a pressing machine having a punch and a die; and a temperature-gradient removal step of removing the temperature gradient from the laminate. The pressing step gives the temperature gradient to the laminate so that the temperature rises from the punch-side to the die-side in the stacking direction of the laminate.

Abstract: A method for repairing a semiconductor chip and a device for repairing a semiconductor chip is provided, and the method for repairing a semiconductor chip includes: providing a plurality of light-emitting units, and at least one of the light-emitting units being a damaged light-emitting unit; next, removing the damaged light-emitting unit to form an unoccupied position; then, using a pick and place module to obtain a good light-emitting unit from a carrier board; then, a volatile adhesive material is formed on the bottom of the good light-emitting unit; next, the volatile adhesive material is used to adhere the good light-emitting unit to the unoccupied position; finally, the good light-emitting unit is heated so that the good light-emitting unit is fixed onto the unoccupied position.

Abstract: An adsorption device includes a magnetic plate and a limiting layer. A surface of the magnetic plate includes a first region and a plurality of second regions spaced apart from each other. The first region and each second region do not overlap with each other. The first region forms a magnetic pole of the magnetic plate, and each second region forms the opposite magnetic pole of the magnetic plate. The limiting layer covers the first region. Each second region is exposed to the limiting layer and configured for adsorbing a small-scale LED as a target object.

Abstract: A method for manufacturing a multilayer wiring board is disclosed. The Method comprises a step (I) of preparing printed wiring boards having both electrical connection pads for establishing an electrical connection between the boards and non-connection pads for not establishing an electrical connection between the boards on the same plane; and a lamination step (II) of overlaying the boards so that the electrical connection pads face each other, and laminating the boards so that the boards are bonded to each other through a conductive material provided between the facing electrical connection pads. In the step (I), to at least one of surfaces faced when the boards are overlaid in the step (II), an insulating film having through holes formed in positions corresponding to the electrical connection pads on the surface is attached (Ia), and the conductive material is provided in the through holes (Ib).

Abstract: An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.

Abstract: A method and a placement machine for equipping a carrier with components.

Abstract: A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.

Abstract: A positioning control device controlling multiple moving bodies including a disturbance non-interference-enabling compensator performing non-interference-enabling compensation of a disturbance of an feedback compensator and an operation amount of the moving body on the side affected by the disturbance is provided.

Abstract: A method and to a device for inserting a plurality of wires into a plurality of grooves of a component, such as a stator or rotor of an electric motor, in which the wires are inserted by gripping elements.