Abstract: A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

Abstract: A method of manufacturing an end effector assembly includes forming an insulative spacer of a non-conductive material, creating a rib on a surface of the insulative spacer, and metalizing the rib with a conductive material to integrally form a conductive strip on a surface of the rib.

Abstract: A method of manufacturing a stacked core includes: forming a stack by stacking a plurality of core members, each of the plurality of core members including one or more blanked members blanked by a die from a metal plate along a predetermined shape; removing one core member of the plurality of core members from the stack; supplying adhesive to the one core member removed from the stack; and stacking the one core member next to an adjacent core member of the plurality of core members so that the adhesive is placed between the one core member and the adjacent core member.

Abstract: A cut and clinch unit is provided with pair of slide bodies, and each slide body is configured from movable section and fixed section that slidably holds the movable section. An insertion hole is formed in the movable section. A pair of leads of a leaded component are inserted into the insertion holes of a pair of slide bodies, and the pair of leads are bent into an N shape by each movable section being slid. The cut and clinch unit is movable in the XY directions by operation of a moving device. Also, the distance between the pair of slide bodies can be changed freely. Accordingly, it is possible to mount leads at any position on a board in a state bent into an N shape, and to mount leaded components with various different lead separation distances on a board in a state bent into an N shape.

Abstract: Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.

Abstract: A mounting shaft device comprises a spline shaft including a supply passage for air pressure that extends through a shaft hole in a support, a conduit in communication with a valve and allowing the air pressure from the valve to be introduced to the supply passage, a component retainer disposed at an axial end of the spline shaft and configured to hold an electronic component by using the air pressure applied through the supply passage, a spline nut connected to the spline shaft through a spline mechanism, and a bearing supporting the spline shaft in the shaft hole in the support both in a linearly movable manner in an axial direction and in a rotatable manner about an axis thereof. The bearing, the conduit, and the spline nut are arranged on an axis of the spline shaft in this order from the component retainer.

Abstract: A manufacturing method of a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. An insulating layer is formed to cover a peripheral region of the stainless steel layer and expose a central region. A circuit structure layer is formed on the central region exposed by the insulating layer. A bottom surface of the circuit structure layer is connected to the first carrier board. A transferring procedure is performed to adhere a top surface of the circuit structure layer onto an adhesive layer of a second carrier board. The first carrier board is separated with the circuit structure layer to transfer the circuit structure layer onto the second carrier board, and expose the bottom surface of the circuit structure layer.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: In one aspect, forming a stacked strain gauge sensor with increased electrical resistance includes: forming multiple sensor layers, wherein the sensor layers include strain gauge sensor wires on substrates; forming holes in the substrates; stacking the sensor layers, one on top of another, to form a stack with the holes aligned in one or more locations forming through holes in the stack; and forming interconnects in the holes in one or more other locations interconnecting the strain gauges sensor wires between adjacent sensor layers to form a stacked strain gauge sensor. A stacked strain gauge sensor and method of use thereof are also provided.

Abstract: A manufacturing method for obtaining an interior permanent magnet-type inner rotor without thermal demagnetization due to shrink fitting to a rotating shaft includes: a shrink fitting step of heating a rotor core having slots and inserting a rotating shaft into a shaft hole to shrinkfit the rotor core; and a filling step of filling the rotor core slots in a residual heat state after the shrink fitting step with a flowable mixture of a binder resin heated to a flowable state and anisotropic magnet particles, in oriented magnetic fields This allows, in similar manufacturing steps, an inner rotor of which the magnetic poles are anisotropic bond magnets formed by solidifying the flowable mixture in the slots and a conventional inner rotor of which the magnetic poles are sintered magnets. This allows both the inner rotors concurrently and in parallel (mixed flow production) in an already existing IPM motor manufacturing line.

Abstract: In a preparatory process of a method of manufacturing a multilayer substrate, an insulating substrate is prepared, with a conductor pattern formed only on one surface of the insulating substrate. At that time, the conductor pattern is constituted of the Cu element, a Ni layer is formed on the surface of the conductor pattern that is on the side of the insulating substrate. In a first forming process, a via hole having the conductor pattern as the bottom thereof is formed in the insulating substrate. At that time, the Ni layer that is in the area of the bottom is removed. In a filling process, a conductive paste is filled in the interior of the via hole. In a second forming process, a stacked body is formed by stacking a plurality of the insulating substrates. In a third forming process, the stacked body is heated while being subjected to pressure.

Abstract: A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

Abstract: A tape curving attachments is provided with tape curving sections configured to curve component storage tape wound around a reel, the component storage tape being carrier tape with cavities in which components are stored and top tape attached to an upper surface of the carrier tape, such that the top tape side of the component storage tape has a smaller radius of curvature than the carrier tape side of the component storage tape, the tape curving attachment being attached to a feeder that pitch feeds the component storage tape from the reel.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.

Abstract: An antenna module includes: a dielectric substrate including a multilayer structure, the dielectric substrate having a first surface and a second surface, the second surface being opposite the first surface; an antenna pattern formed on the first surface side of the dielectric substrate; a RFIC provided on the second surface of the dielectric substrate, the RFIC supplying a radio frequency signal to the antenna pattern; and a power supply line that supplies power to the RFIC, wherein the thickness of the power supply line in the stacking direction (Z axis direction) of the dielectric substrate is thicker than the thickness of the antenna pattern in the stacking direction.

Abstract: Methods of fabricating acoustic resonators are disclosed. A back surface of a piezoelectric plate is bonded to a surface of a substrate. Thickness measurements are made at a plurality of positions on the piezoelectric plate. Excess material is removed from the front surface of the piezoelectric plate in accordance with the thickness measurements to improve a thickness uniformity of the piezoelectric plate. A conductor pattern is formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a plurality of resonators. Cavities are formed in the substrate such that portions of the single-crystal piezoelectric plate form a plurality of diaphragms spanning respective cavities, wherein interleaved fingers of each IDT of the plurality of IDTs are disposed on a respective one of the plurality of diaphragms.

Abstract: A manufacturing apparatus of a wiring board includes: a fixed die; a movable die configured to abut with the fixed die so as to form a cavity in which a resin substrate having a wiring gutter is to be molded; and an injection machine configured to inject molten resin into the cavity via the fixed die. The movable die includes a movable main mold, and a movable core having a nested structure in which the movable core is slidably accommodated in the movable main mold. A wall surface of the movable core has a projection portion that molds the wiring gutter. An injector configured to inject molten metal into the wiring gutter via the projection portion is provided inside the movable core.

Abstract: An adsorption device includes a substrate, a plurality of magnetic films, and a plurality of magnets. The substrate defines a plurality of receiving grooves spaced apart from each other. Each receiving groove defines a bottom wall and a side wall. Each magnetic film is in one receiving groove and covers the bottom wall and the side wall. The magnetic films are made of magnetic material. Each magnet is in one receiving groove. Each magnetic film is between the substrate and one magnet, a large number of magnetized LEDs of very small size are attracted on a one-to-one basis to the receiving grooves for transfer and placement of the LEDs onto a display panel which is in the course of being manufactured.

Abstract: An automatic toroidal core winding machine, including: a frame, control device, clamping and wire arranging mechanism, winding mechanism, wire delivering mechanism, feeding mechanism, automatic stripping mechanism and wire reclaiming device for reclaiming excessive wires around the shuttle, the winding mechanism including a shuttle and driving device for supporting and driving the shuttle to rotate, the shuttle includes a slider and wire storage and hooking aperture, and the frame includes a detecting and positioning mechanism used for positioning the ring opening, the slider and the wire storage and hooking aperture of the shuttle, and a wire hanging device for hanging the wire allowing the shuttle to store and wind the wire.

Abstract: A method of manufacturing a rotor of a rotating electrical machine includes a method of manufacturing a rotor of a rotating electrical machine including a magnet and a rotor core forming storage space for storing the magnet. The rotor core forms an opening connected to the storage space. The method includes a first step of covering at least part of the opening with a first jig and a second jig having a non-adhesive resin film, a second step of putting an adhesive into the storage space, a third step of curing the adhesive in a state of being in contact with the non-adhesive resin film to form a plane surface facing an end ring of the rotating electrical machine, and a fourth step of separating the first jig and the second jig from the adhesive.