Abstract: A component mounting robot system includes a component transfer robot which transfers a mounting component including a mounting portion to a base component's mounting position; and a jig which corrects the mounting portion's position of the mounting component transferred by the component transfer robot to mounting position, wherein the jig includes a guide portion which corrects the mounting portion's position of the mounting component to the mounting position, and wherein the component transfer robot includes a holding section which holds the mounting component so that a posture of the mounting component is changeable. In this configuration, it becomes possible to construct the component mounting robot system which can correct position of the mounting portion of the mounting component, by changing the posture of the body of the mounting component and guiding the mounting portion to the mounting position even in a case where the mounting component has a cylindrical shape.

Abstract: A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. The method includes printing layers, forming a stack of the layers, sintering the stack, dicing the stack and forming external terminations.

Abstract: A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.

Abstract: A board insertion device includes a holder; and an insertion guider which is slidably provided in the holder in an insertion direction of the board into the connector and includes a distal end portion protruding in the insertion direction from a first end surface of the board held in the holder and abutting against the connector during insertion of the board into the connector. Furthermore, the board insertion device includes an abutting portion; and a conversion mechanism converting a change of a relative position between the holder and the insertion guider into a movement of the abutting portion for changing a position of the ejector from a closed position to an open position. in which the conversion mechanism is provided in the insertion guider and engaged with the holder or is provided in the holder and engaged with the insertion guider.

Abstract: A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

Abstract: A method of making a subsurface antenna which has an assymetric radiation pattern. The assymetric radiation pattern radiates electromagnetic waves unequally into two regions.

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.

Abstract: A press-fit pin for a semiconductor package includes a shaft terminating in a head. A pair of arms extends away from a center of the head. Each arm includes a curved shape and the arms together form an s-shape. A length of the s-shape is longer than the shaft diameter. An outer extremity of each arm includes a contact surface configured to electrically couple to and form a friction fit with a pin receiver. In implementations the press-fit pin has only two surfaces configured to contact an inner sidewall of the pin receiver and is configured to contact the inner sidewall at only two locations. The shaft may be a cylinder. The s-shape formed by the pair of arms is visible from a view facing a top of the press-fit pin along a direction parallel with the longest length of the shaft. Versions include a through-hole extending through the head.

Abstract: A transfer unit includes a holding unit, and a driving unit configured to vertically move the holding unit. The holding unit includes a holding portion configured to hold a work, a movable portion configured to support the holding portion, a support portion configured to support the movable portion such that the movable portion is vertically displaceable, and a biasing portion configured to bias the movable portion downward with respect to the support portion. The support portion has a guide surface which guides displacement of the movable portion, and the movable portion has an abutting surface which abuts against the guide surface. Each of the guide surface and the abutting surface is a surface which tapers off upward or downward.

Abstract: A method of fabricating an integrated circuit includes the following steps. A first reticle is used to form a first pattern, wherein the first pattern includes a first feature and a first jog part protruding from and orthogonal to the first feature. A second reticle is used to form a second pattern, wherein the second pattern includes a second feature, and the first feature is between the second feature and the first jog part. A third reticle is used to form a third pattern, wherein the third pattern includes a third-one feature overlapping the first jog part and a third-two feature overlapping the second feature.

Abstract: A method includes affixing a capacitor sheet adjacent to core material of a device substrate, where the capacitor sheet covers a surface of the core material. The method also includes patterning first openings through both capacitor sheet and the core material, where the first openings are larger than a substrate pass through-hole. The method additionally includes filling the first openings with an electrically inert material. The method further includes patterning a second openings parallel to the first openings through the electrically inert material, where the second openings are at least as large as the substrate pass through-hole and having sidewalls enclosed within the electrically inert material.

Abstract: A terminal cassette assembly for a terminal crimping machine includes a cassette housing having a terminal reel chamber holding a terminal reel and a crimp tooling chamber holding crimp tooling with a terminal reel door and a crimp tooling cover, respectively. The crimp tooling includes lower tooling including an anvil and upper tooling including a wire crimper. At least one of the upper tooling and the lower tooling are held in position relative to the terminal crimping machine by the cassette housing when the cassette housing is coupled to the terminal crimping machine.

Abstract: An insulating glass unit (IGU) assembly line comprising a registration station capable of interleaving double and triple pane IGUs in accordance with an IOU production schedule. Visual indicators or prompts instruct operators at the assembly line in configuring a sequence of IGUs. Triple pane IGUs are assembled with minimal contamination of a center glass lite. A non-contact Bernoulli pad is used to lift a glass lite off from a horizontal or vertical support that conveys it from a glass washer to the registration station. Each of multiple pads has a capacity to lift approximately seven to ten pounds. Use of multiple pads per glass sheet or lite allows lites having dimensions up to 70 by 100 inches (assuming glass thickness of one quarter inch) to be assembled.

Abstract: The present invention relates to replacing conductors in a high-voltage power transfer system. The method provides, for example, a method for maintaining sections of electrically conductive phases in a three-phase power conductor line, wherein the three phases are parallel and spaced apart in an ordered sequence. The phases are strung between support structures and supported above the ground. Maintenance work, which include replacement or repair, is performed on sections of the three phases without interrupting a power load in any one of the three phases and without transposing the relative positions of the phases out of their ordered sequence.

Abstract: A free space coupling system comprising a waveguide horizontally positioned on an integrated circuit, and a silicon housing coupled to the waveguide, wherein the silicon housing comprises a reflective surface, a first port, wherein the first port is configured to receive light from an optic source positioned substantially parallel to the waveguide at a coupling point, and a second port, wherein the second port is oriented at about ninety degrees with respect to the first port, and wherein the second port is aligned with a grating port on the waveguide.

Abstract: A method of installing batteries in a telecommunications site includes obtaining a battery in a module with a plurality of cells in the module at a staging location; de-celling the battery to remove the plurality of cells from the module; handling the plurality of cells individually at the staging location; transporting the plurality of cells individually to the telecommunications site; and reassembling the battery by placing the plurality of cells back in the module and installing the module at the telecommunications site.

Abstract: An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with a second semiconductor device die. An energy-emitting device is disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Abstract: A method for constructing physiological electrode assembly with integrated flexile wire components is provided. A flexible backing is formed from a stretchable woven textile material, the flexible backing having a proximal flexible backing end and a distal flexible backing end. A set of flexile wires is integrated into the proximal flexible backing end to form a set of electrical contact surfaces shaped to interface with a monitor recorder on a side of proximal electrical backing end opposite the contact side of the proximal flexible backing end. An electrocardiographic electrode is positioned on the contact side of the distal flexible backing end. A further electrocardiographic electrode is positioned on the contact side of the proximal flexible backing end. One of the electrical contact surface of the set of electrical surfaces is connected to the electrocardiographic electrode.

Abstract: A method for producing an electronic component including a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.