Abstract: A pick-and-place machine module is provided. The pick-and-place machine module includes a nozzle and a collet disk. The nozzle includes a body, a head and a tubular element extending between the body and the head such that the head is communicative with the body via the tubular element to enable a pick-up of a component by the head. The collet disk is affixed to a surface of the body facing the head about the tubular element and is configured to reflect light incident thereon toward an area of the base surrounding the component.

Abstract: A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source is disposed adjacent to the secondary substrate to apply energy to the transfer location and affix the unpackaged die directly to the secondary substrate. A sensor detects a position and orientation of the secondary substrate with respect to the unpackaged die on the die holding substrate. A processor is in communication with the die separation device, the energy source, and the sensor. The processor is configured to cause actuation of the die separation device and the energy source according, at least in part, to transfer instructions and data received from the sensor.

Abstract: A method for manufacturing a multilayer ceramic capacitor including a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: An apparatus for performing a direct transfer of a die. The apparatus includes a first frame to hold the first substrate and a second frame to hold the second substrate. The apparatus further includes a transfer mechanism disposed adjacent to the first frame. The transfer mechanism includes a needle configured to press against the first substrate at a location collinear with the die. A controller, including one or more processors communicatively coupled with the first frame, the second frame, and the transfer mechanism, has executable instructions, which when executed, cause the one or more processors to perform operations including: determining a transfer position of the die on the first substrate via one or more sensors, and aligning the transfer position of the die with the needle of the transfer mechanism via movement of at least two of the first frame, the second frame, and the transfer mechanism.

Abstract: An interference-prevention Q-axis rotation height position is set as a height position at an intermediate point of raising operation of suction nozzle, and a height position at which the component does not interfere with central protruding member on the lower surface of rotary head. Performed is control of large component interference prevention mode, in which, after picking up the component using suction nozzle at a component pickup height position that is the lower limit height position of lowering operation, the direction of the component is corrected by raising the suction nozzle to the interference-prevention Q-axis rotation height position that is a height position at an intermediate point of raising operation of suction nozzle and then rotating the component held by suction nozzle by Q-axis driving operation, and subsequently raising suction nozzle to a maximum height position of the raising operation, and then moving rotary head in the XY direction.

Abstract: A manufacturing device that is used in a manufacturing method for a rotary electric machine is equipped with an insertion roller having an outer circumferential surface configured to contact a coil lead line in such a manner that the coil lead line is inserted into accommodating grooves of an insulator, a roller support section that rotatably supports the insertion roller, and a bending unit that performs a bending process to bend the coil lead line by coming into contact with the coil lead line so as to form a terminal part.

Abstract: A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

Abstract: A mounting device is provided with a mechanical chuck that picks up a component housed in a tray by gripping the component in a state with a cam follower contacting tray housing the component at a predetermined height. The mechanical chuck is provided with a first holding member including a first gripping member, and a second holding member including a second gripping member. The cam follower is a rotatable roller, and when the first holding member moves when picking up the component from tray, the cam follower rotates according to this movement in a state contacting tray.

Abstract: A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.

Abstract: Board conveyance device 24 is provided with a pair of conveyor belts 64 for conveying a board; and a lifter 70, 74, 78 that raises a board loaded on the pair of conveyor belts, and, in a state with board S raised by the lifter, a different board, board S?, is conveyed by the pair of conveyor belts. Also, a board work system includes such a board conveyance device and a board work device that performs work on the board raised by the lifter of the board conveyance device.

Abstract: A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

Abstract: A stator assembling method where each of the plurality of the concentrically wound coils has vertexes oriented outward in a axial direction in the planned coil end portions, and a distance in the axial direction between the vertexes of the planned coil end portions on both sides in the axial direction of each of the plurality of concentrically wound coils is gradually reduced toward the conductive wire mounted on the inner diameter side of the stator core from the conductive wire mounted on the outer diameter side of the stator core.

Abstract: A manufacturing method for a stator winding coil includes: a bulging portion forming step that forms a bulging portion on a conductor wire; a crank portion forming step that forms a crank portion on the central portion of the bulging portion; an oblique portion forming step that forms oblique portions on the conductor wire at two ends of the bulging portion; a rectilinear portion forming step that forms rectilinear portions on the conductor wire at opposite ends of the oblique portions from the bulging portion; and a circular arc forming step that forms the oblique portions into a circular arc shape after forming the rectilinear portions.

Abstract: An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

Abstract: A tool for connecting busbars has an hydraulic cylinder driving unit and an electric control unit. A stationary portion removably is connected to a second busbar, a movable portion is removably connected to a first busbar a loading portion is for clamping connecting rods. The movable portion is movably connected to a first and second stationary shaft of the stationary portion, the movable portion is fixedly connected to the hydraulic cylinder driving unit by a movable shaft, the movable shaft is driven to slide axially with respect to the first and second stationary shaft by the hydraulic cylinder driving unit, the loading portion rotates around the second stationary shaft. It is achieved that a plurality of connecting rods are simultaneously mounted to busbars and that two busbars are connected in a form of butt-and-butt connecting.

Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

Abstract: A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate by providing ceramic layers and internal electrode layers arranged in a stacking direction, and providing two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. In the preparing, forming the laminate to have a rectangular parallelepiped configuration or shape and to includes two longitudinal end surfaces, and four surfaces orthogonal or substantially orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transferring, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

Abstract: To place an insert cut out of film with no gaps in a cavity formed in a foil, after placing the foil on a supporting substrate, the cavity is punched into the foil by means of a tubular cutting punch comprising an inner pusher with a cutting edge in the required shaped of the cavity and the insert, so that the edge goes through the thickness of the foil and cuts a slug out of it; the punch is lifted with the slug held inside the punch, without moving the foil, the film is brought between the foil and the edge of the punch, the punch is lowered once again so as to cut the insert out of the film and then push the insert cut in that way in the cavity with a pusher, and the punch and the pusher are removed, with the insert held in place in the cavity.

Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.