Patents Examined by Minh N Trinh
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Patent number: 10403442Abstract: The present invention generally relates to a MEMS DVC having a shielding electrode structure between the RF electrode and one or more other electrodes that cause a plate to move. The shielding electrode structure may be grounded and, in essence, block or shield the RF electrode from the one or more electrodes that cause the plate to move. By shielding the RF electrode, coupling of the RF electrode to the one or more electrodes that cause the plate to move is reduced and capacitance modulation is reduced or even eliminated.Type: GrantFiled: June 21, 2017Date of Patent: September 3, 2019Assignee: CAVENDISH KINETICS, INC.Inventors: Robertus Petrus Van Kampen, Ramadan A. Alhalabi
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Patent number: 10398052Abstract: A self-contained circuit board actuator including a pivot bearing connectable to a circuit board and an actuator lever pivotably coupled to the pivot bearing. The lever is moveable between a closed position and an open position. A pair of opposed pawls extend from a first end of the lever and a latch notch is formed in the first end adjacent the pair of opposed pawls. The latch notch engages a catch tab on the pivot bearing when the lever is in the closed position. The lever is coupled to the pivot bearing by a pivot member and the lever is slidable along the pivot member between a latched position and an unlatched position. The lever includes a pivot bore to receive the pivot member and a resilient member is positioned in the pivot bore around the pivot member to urge the lever toward the latched position.Type: GrantFiled: October 5, 2016Date of Patent: August 27, 2019Assignee: Facebook, Inc.Inventor: Jon Brian Ehlen
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Patent number: 10395067Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.Type: GrantFiled: August 29, 2016Date of Patent: August 27, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, David C. Long, Michael T. Peets
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Patent number: 10398069Abstract: A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.Type: GrantFiled: March 25, 2016Date of Patent: August 27, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Seiji Goto, Takahiro Hirao
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Patent number: 10375832Abstract: An apparatus including a die including a device side with contact points and lateral sidewalls defining a thickness of the die; a build-up carrier coupled to the die, the build-up carrier including a plurality of alternating layers of patterned conductive material and insulating material, wherein at least one of the layers of patterned conductive material is coupled to one of the contact points of the die; and an interference shield including a conductive material disposed on the die and a portion of the build-up carrier. The apparatus may be connected to a printed circuit board. A method including forming a build-up carrier adjacent a device side of a die including a plurality of alternating layers of patterned conductive material and insulating material; and forming a interference shield on a portion of the build-up carrier.Type: GrantFiled: December 1, 2015Date of Patent: August 6, 2019Assignee: Intel CorporationInventors: Digvijay A. Raorane, Kemal Aygun, Daniel N. Sobieski, Drew W. Delaney
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Patent number: 10368395Abstract: A cooking plate includes a metal plate for cooking; a heating element, which is in contact with the metal plate and is configured to heat the metal plate; and a temperature sensing element which is integrated with the metal plate and which is configured to sense a temperature of the metal plate and outputs a sensing signal for control heating of the heating element.Type: GrantFiled: November 30, 2017Date of Patent: July 30, 2019Inventors: Eric Norman, Paolo Baruzzi, John Hsudan Yu
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Patent number: 10363096Abstract: A method of fabricating a microwave antenna assembly is disclosed. The fabrication method includes providing a proximal portion having an inner conductor and an outer conductor, the inner conductor extending at least partially therein. The method further includes providing a distal portion disposed distally of the proximal portion, with the inner conductor extending at least partially therein. A high strength material may be injected from an inflow slot to an outflow slot of the distal portion such that the material is disposed in-between the inner conductor and a ceramic layer. The material bonds the distal portion and the ceramic layer to the proximal portion while providing mechanical strength to the distal portion.Type: GrantFiled: June 15, 2016Date of Patent: July 30, 2019Assignee: COVIDIEN LPInventor: Kenlyn S. Bonn
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Patent number: 10362713Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: July 23, 2019Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
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Patent number: 10362689Abstract: A method of providing a rollable display device includes providing a display panel for displaying an image, a printed circuit board connected to an edge of the display panel, and a roller which the display panel is rolled onto or unrolled from. The roller has a cylindrical shape having an inner space, and the printed circuit board is disposed in the inner space.Type: GrantFiled: March 21, 2017Date of Patent: July 23, 2019Assignee: LG DISPLAY CO., LTD.Inventors: Seok-Hyo Cho, Chul Park
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Patent number: 10362719Abstract: A component mounting machine including a head having two right and left nozzle holders to which suction nozzles are detachably attached, and a nozzle station having multiple sockets for accommodating the suction nozzles. The multiple sockets are arrayed at the same interval as an interval of the right and left nozzle holders. The suction nozzles mounted on the right and left adjacent nozzle holders can be simultaneously returned to right and left empty sockets, and the suction nozzles accommodated in the right and left adjacent sockets can be simultaneously mounted on the right and left nozzle holders.Type: GrantFiled: April 2, 2014Date of Patent: July 23, 2019Assignee: FUJI CORPORATIONInventors: Jun Iisaka, Shigeto Oyama
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Patent number: 10356910Abstract: The invention provides a manufacturing method for flexible printed circuit board, by liquefying the flexible insulating material and the metal material, coating the liquefied materials and solidifying the coated layers to form respectively the flexible insulating layer and the anti-EMI layer of the anti-EMI structure. As such, an adhesive layer is eliminated to achieve reducing the thickness of the flexible insulating layer and the anti-EMI layer and the material consumption, resulting in reduced production cost, reduced thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.Type: GrantFiled: June 23, 2016Date of Patent: July 16, 2019Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Juan Chen
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Patent number: 10355565Abstract: In a method for manufacturing a stator of the present invention, positions of stamping out the first stator core and the second stator core are respectively set so that an angular difference between respective rolling directions thereof becomes 360 degrees÷(4×motor pole pair number), when laminating the first stator core which is not circular stamped out from a first electromagnetic steel sheet, and the second stator core which is not circular stamped out from a second electromagnetic steel sheet. For the second stator core, orientation of a shortest segment among virtual segments linking opposite sides or diagonals which pass through a center thereof is not orthogonal to the rolling direction, and at least two are stamped out alongside in a width direction.Type: GrantFiled: November 17, 2017Date of Patent: July 16, 2019Assignee: FANUC CORPORATIONInventors: Hidetoshi Uematsu, Akihiro Hosoda
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Patent number: 10330518Abstract: A liquid-surface detection device includes terminals and an electronic component that has a body portion and a lead portion projecting from the body portion and being connected to the terminals. A method for manufacturing the liquid-surface detection device includes arranging the electronic component in a casing that has a mounting surface and covers the terminals, and connecting the lead portion and the terminals. The mounting surface has a base surface with a planar shape, an island projecting from the base surface and a hole recessed from the base surface. The lead portion is placed in a positioning groove of the island. A curved surface of the body portion is supported by an edge of the hole. Accordingly, a yield can be increased.Type: GrantFiled: August 6, 2014Date of Patent: June 25, 2019Assignee: DENSO CORPORATIONInventor: Yoshifumi Terada
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Patent number: 10333373Abstract: A method for manufacturing a stator operatively associated with an inner and outer circumferential jigs including sequentially ordered steps of inserting segment coils, each constituting of a pair of straight portions connected with a connecting portion in a U-like shape, in slots of a stator core, rotating a twisting ring while distal end parts of the pairs of straight portions protruding on an opposite side to the connecting portions are engaged with ring grooves of the twisting ring to twist and shape in one direction the distal end parts located in odd-numbered positions from an outer circumferential side or an inner circumferential side in a radial direction and twist and shape the distal end parts located in even-numbered positions in an opposite direction to the one direction, and welding the distal end parts twisted in the one direction and the distal end parts twisted in the opposite direction.Type: GrantFiled: December 20, 2016Date of Patent: June 25, 2019Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Fujio Ando, Hirotsugu Iwamoto
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Patent number: 10329832Abstract: This invention describes a process flow and method to assemble triple IG units without contaminating the center glass lite. A non-contact vacuum pad is used to lift a glass lite off from a horizontal or vertical support that conveys it from a glass washer to an assembly station. Each of multiple pads has a capacity to lift approximately seven to ten pounds. Use of multiple pads per glass sheet or lite allows lites having dimensions up to 70 by 100 inches (assuming glass thickness of one quarter inch) to be assembled.Type: GrantFiled: July 14, 2016Date of Patent: June 25, 2019Assignee: GED Integrated Solutions, Inc.Inventors: William A. Briese, John Grismer, Timothy B. McGlinchy
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Patent number: 10327368Abstract: A panel device including a panel for performing at least one of input and output of information related to operation of a work machine, a panel-side support axis fixed to the panel, a connecting arm that is swingably held by the two support axes, a guide rail formed on the work machine side, a bolt that moves along the guide rail, and a regulating arm attached to the bolt and held so as to be oscillatable by the panel-side support axis. When the connecting arm is oscillated, the oscillation of the connecting arm and the angle of the panel is regulated by the regulating arm.Type: GrantFiled: March 17, 2014Date of Patent: June 18, 2019Assignee: FUJI CORPORATIONInventors: Masaki Murai, Toshihiko Yamasaki, Toshinori Shimizu
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Patent number: 10310568Abstract: A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet.Type: GrantFiled: March 31, 2016Date of Patent: June 4, 2019Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Thomas E. Stewart, Richard Rogers, Yefim Gelfond, Russell Brovald
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Patent number: 10312592Abstract: A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.Type: GrantFiled: March 29, 2016Date of Patent: June 4, 2019Assignee: Sumida CorporationInventors: Yasunori Morimoto, Yasuo Shimanuki, Keiji Oyagi, Masakazu Fukuoka
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Patent number: 10285315Abstract: A board work system provided with multiple mounters and arranged in a line, wherein each mounter includes supply device, the supply device being configured from at least one tape feeder that supplies electronic components, and tape feeder holding table on which at least one of the tape feeders is detachably loaded.Type: GrantFiled: September 12, 2013Date of Patent: May 7, 2019Assignee: FUJI CORPORATIONInventors: Jun Iisaka, Takayuki Mizuno
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Patent number: 10274126Abstract: A system and method for servicing a generator rotor of a turbine are presented. The system includes a support device for supporting the rotor. The support device has a surface. A contact point is established on the surface where the rotor contacts the surface. A location of the contact point along the surface may be variable based on a diameter of the rotor. The support device may be able to accommodate a plurality of different rotors having a plurality of different diameters.Type: GrantFiled: June 14, 2016Date of Patent: April 30, 2019Assignee: SIEMENS ENERGY, INC.Inventors: James B. Edwards, Cezar Cisloiu