Abstract: Cable processing equipment for processing cable cores of a multi-core cable includes separating elements that are introducible between the cable cores and are movable along the cable cores with combing effect. The separating elements are arranged in star shape and are movable in a radial direction relative to the longitudinal axis of the cable. The cable processing equipment further includes a forming tool for preshaping the core ends, which ends are separated by the separating elements, of the cable cores of the multi-core cable. The forming tool includes a forming die with core receptacles for receiving the cable cores and a guide sleeve for embracing the cable cores.

Abstract: A method for manufacturing a terminal with an electric wire includes: forming a conductor exposed portion by removing a resin coating of an electric wire; forming a wire-terminal connection portion by connecting a terminal fitting to a position of the conductor exposed portion; and supplying a sealing material from a nozzle to the wire-terminal connection portion. During supply of the sealing material, the nozzle is moved in X-, Y- and Z-directions or a relative position between the wire-terminal connection portion and the nozzle is changed in the X-, Y- and Z-directions.

Abstract: An apparatus for manufacturing an interior permanent magnet-type inner rotor and manufacturing method using the same. The apparatus including: a mold having a three-layer structure; the method including a shrink fitting step of heating a rotor core having slots; and a filling step of filling the rotor core slots in a residual heat state after the shrink fitting step with a flowable mixture of a binder resin heated to a flowable state and having anisotropic magnet particles, in oriented magnetic fields. This allows, in similar manufacturing steps, an inner rotor of which magnetic poles are anisotropic bond magnets formed by solidifying the flowable mixture in the slots and a conventional inner rotor of which the magnetic poles are sintered magnets. This allows both the inner rotors concurrently and in parallel (mixed flow production) in an already existing IPM motor manufacturing line.

Abstract: A vehicle body positioning and locking devices for use in assembling a vehicle body positioned on a movable vehicle support positioned at a vehicle build station. The locking device includes a remote vehicle locking device for selectively securing and locking a vehicle body to a support pallet. The support pallet is accurately and precisely positioned at a build station through alignment and inserting engagement of locating pads in at least one four-way and at least one two way receiver mounted to a build station foundation. A compliant body clamp design is included to provide a desired clamping force between the pallet and a vehicle body across a range of motion of the body clamp to accommodate vehicle build variances.

Abstract: A method for manufacturing a terminal with an electric wire includes: forming a conductor exposed portion by removing a resin coating of an electric wire; forming a wire-terminal connection portion by connecting a terminal fitting to a position of the conductor exposed portion; supplying a sealing material made of ultraviolet-curing resin from a nozzle to form a sealing portion covering the wire-terminal connection portion; and curing the sealing material by irradiation with ultraviolet rays from a UV light. During curing of the sealing material, a reflector is used to allow the ultraviolet rays to be reflected toward the sealing material supplied to the wire-terminal connection portion.

Abstract: An apparatus for inserting a magnet into a rotor iron core includes a magnet inserting unit configured to insert a permanent magnet into a magnet-insert hole formed along a lamination direction of a rotor iron core body in which a plurality of iron core pieces are laminated, and a guide member to be attached to the magnet inserting unit, and arranged in a space formed between the magnet inserting unit and the rotor iron core body and configured to communicate the magnet-insert hole of the rotor iron core body to a supply part for the permanent magnet formed in the magnet inserting unit.

Abstract: An electronic component board is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating plate, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion. Additional steps of the method include providing the metal plate, the insulation plate, and an electrical component, and electrically connecting the electrical component to the plurality of bus bars.

Abstract: A guarded coaxial cable assembly provides at least one bundled electrical cable with first and second concentrically aligned conductors, the bundle encapsulated in a flexible jacket that is abrasion resistant and wherein with respect to a jacket cross-section a height of the jacket is smaller than a width of the jacket.

Abstract: A rotary head includes a rotating body on which a plurality of suction nozzles that suck a component at a tip end are disposed in a circumferential direction, and revolves the plurality of suction nozzles by rotation of the rotating body, in which a wall portion with a wall surface along an axial direction of a rotary axis of the rotating body, is provided on a lower surface of the rotating body, and the wall portion is provided in the vicinity of an inner circumferential side of the plurality of suction nozzles such that a reduction in pressure on the inner circumferential side of the plurality of suction nozzles caused by the revolving of the suction nozzles is suppressed.

Abstract: There are provide a method of manufacturing a multilayer ceramic comprising: preparing a first ceramic green sheet on which a plurality of stripe-type first inner electrode patterns are formed to be spaced apart from one another; forming a ceramic green sheet laminate by alternately stacking the first ceramic green sheet and the second ceramic green sheet; forming first and second groove portions on at least one of the top surface and a bottom surface of the ceramic green sheet laminate; and cutting the ceramic green sheet laminate.

Abstract: A method for manufacturing busbar modules that includes placing a plurality of first linear conductors on one side and a plurality of second linear conductors on the other side across a long planar conductor, extruding an insulating cover material to cover the first linear conductors and join the first linear conductors to the planar conductor with the insulating cover material and to cover the second linear conductors and join the second linear conductors to the planar conductor with the insulating cover material, cutting the planar conductor along first, second and third cutting lines, forming a first busbar module by joining the first linear conductors and the plurality of busbars, and forming a second busbar module by joining the second linear conductors and the plurality of busbars.

Abstract: To provide a connection structure that can be crimped and connected in a desired crimping shape to the electric wire tip portion of an insulated wire without causing the deformation into an unintended crimping shape of the crimping portion of a crimp terminal. When crimping a conductor crimping portion (30a) of crimp terminal (10) to an electric wire tip portion (200a) of insulated wire (200), outer peripheral contact portions (613, 613) of a lower blade (61) of a crimping device (60A) and an outer peripheral contact portion (623) of an upper blade (62) are point-contacted to an outer periphery of a conductor crimping portion (30a) in a perpendicular cross section in a direction perpendicular to a longitudinal direction X and to a crimping direction Z so as to be left-right symmetrical with respect to a reference plane formed by the longitudinal direction (x) and the crimping direction (Z).

Abstract: A method is presented that improves reliability for the mechanical electrical connection formed between a grid array device, such as a pin grid array device (PGA) or a column grid array device (CGA), and a substrate such as a printed circuit board (PCB). Between adjacent PCB pads, the method increases a spacing pattern toward the periphery of the CGA, creating a misalignment between pads and columns. As part of the method, columns align with the pads, resulting in column tilt that increases from the center to the periphery of the CGA. An advantage of the method is that the column tilt reduces the amount of contractions and expansions of columns during thermal cycling, thereby increasing the projected life of CGA. Another advantage of the method is that it reduces shear stress, further increasing the projected life of the CGA.

Abstract: A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

Abstract: A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

Abstract: A method is described that is suitable for automated use of peg apparatus and an electrical wire harness peg board. The pegs are utilized on a wire harness peg board during the assembly of a wire harness, and are particularly well suited for use in an automated assembly of the electrical wire harness where a constant upward, downward or lateral tension is desired without altering the free ends of each wire of a bundled wire harness.

Abstract: Apparatuses and method for manufacturing coil members (230, 250) for insertion in slots of a core of an electric dynamo machine, wherein the coil members (230, 250) are formed by bending portions of an electric conductor (10). Portions of conductor of a predetermined length are fed through an aperture (80), where at least one engagement member (51) can move to engage and bend the conductor (10) so as to form the configuration of the coil member (230, 250).

Abstract: A transparent antenna is fabricated by combining a metal nanomesh structure and a graphene sheet. The nanomesh structure is formed on a surface, and the graphene sheet is placed over the nanomesh structure. The graphene sheet is adhered to the nanomesh structure to form a graphene nanomesh structure. The graphene nanomesh structure is shaped to form the transparent antenna that efficiently transmits and receives signals in a desired frequency range yet is optically transparent.

Abstract: An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. Two or more needles are disposed adjacent a second side of the wafer tape opposite the first side. A length of the two or more needles extends in a direction toward the wafer tape. A needle actuator actuates the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.