Patents Examined by Minh N Trinh
-
Patent number: 10561025Abstract: A method of manufacturing a polymer printed circuit board contains steps of: A. providing a material layer consisting of polymer; B. forming circuit pattern on the material layer; C. depositing metal nanoparticles on the LIG of the circuit pattern so as to use as a metal seed; D. pressing the circuit pattern; and E. forming a metal layer on the LIG of the circuit pattern. In the step of B, the circuit pattern includes laser induced graphene, and the laser induced graphene is porous. Thereby, the circuit pattern is adhered on the material layer securely and has outstanding electric conductivity after being pressed in the step D.Type: GrantFiled: January 10, 2017Date of Patent: February 11, 2020Assignee: BGT MATERIALS LIMITEDInventors: Kuo-Hsin Chang, Jia-Cing Chen, We-Jei Ke, Jingyu Zhang, Chung-Ping Lai
-
Patent number: 10555448Abstract: The component mounting device determines suction deviation (posture change) of the component from after suction of the component until prior to mounting of the component based on an immediately post-suction image which is acquired by imaging the suction nozzle from the side immediately after suction of the component and an immediately pre-mounting image that is acquired by imaging the suction nozzle from the side immediately prior to mounting of the component.Type: GrantFiled: February 25, 2014Date of Patent: February 4, 2020Assignee: FUJI CORPORATIONInventor: Hidetoshi Kawai
-
Patent number: 10555447Abstract: A component supply device including a component support which supports multiple components in a scattered state; a first component holding tool which holds a component of the multiple components which is supported by the component support; a first moving device which includes a motor an which moves the first component holding tool; and a placement section on which the components are placed in a lined up state by the first component holding tool moved by the first moving device. The placement section includes a first recessed section corresponding to a shape of the components, and a second recessed section which having a same shape as the first recessed section rotated by a predetermined angle and which overlaps a portion of the first recessed section. The first component holding tool places the components in both the first recessed section and the second recessed section.Type: GrantFiled: February 26, 2015Date of Patent: February 4, 2020Assignee: FUJI CORPORATIONInventors: Kazuma Ishikawa, Shunji Morikawa, Toru Matsumoto
-
Patent number: 10554006Abstract: A wire stripping die is configured to be coupled to a crimping tool. The stripping die includes a die body, a first ridge, and a second ridge. The die body includes a first side, a second side, and a groove extending at least partially between the first side and the second side. The groove extends along an axis. The first ridge protrudes from a surface of the groove toward the axis by a first distance. The first ridge extends along at least a portion of the perimeter of the groove and extends at least partially around the axis. The second ridge protrudes from the surface of the groove toward the axis, and the second ridge extends parallel to the axis along at least a portion of the groove.Type: GrantFiled: January 6, 2017Date of Patent: February 4, 2020Assignee: Hubbell IncorporatedInventor: Logan Trombley
-
Patent number: 10547154Abstract: The present invention relates to a manufacturing method for an electrical connector, comprising the following steps: providing a first strip, a second strip, and a plurality of grounding terminals, power terminals and signal terminals which are located between the first strip and the second strip; forming a first body and a second body onto the grounding terminals, the power terminals and the signal terminals by insert-molding, wherein each grounding terminal comprises an exposed upper contacting portion, an exposed lower contacting portion and a first connecting portion located between the first body and the second body; bending the first connecting portions, assembling a shielding plate into the accommodating space; and forming an insulation block onto the first body and the second body by an insert-molding.Type: GrantFiled: December 29, 2016Date of Patent: January 28, 2020Assignee: DRAPHO ELECTRONICS TECHNOLOGY CO, LTDInventors: Zhuping Wu, Yun Zhu, Zhihong Fang, Tadashi Kosuga, Yuhua Mao
-
Patent number: 10547153Abstract: A crimping hand tool used for crimping a plurality of wires of a cable into a jack is provided. The crimping hand tool includes a first body, a second body, a linking member, a crimping assembly, and a first base. Two opposite ends of the linking member are pivoted to the first and the second crimping bodies respectively. The crimping assembly slidably assembled to the first body is pivoted to the second body. The first base movably assembled to the first body is located on a moving path of the crimping assembly. The first base has a plurality of supporting areas that switchably face toward the crimping assembly. The wires are disposed on the jack temporarily, and at least one of the first and the second crimping bodies is forced to slide the crimping assembly toward the supporting area to crimp the wires into the jack.Type: GrantFiled: July 4, 2017Date of Patent: January 28, 2020Assignee: JETOOL CORP.Inventor: Kai-Yen Lin
-
Patent number: 10548243Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.Type: GrantFiled: June 1, 2016Date of Patent: January 28, 2020Assignee: Lockheed Martin CorporationInventors: Brian W. Kaplun, James S. Eiche, David L. Vos
-
Patent number: 10542650Abstract: A data processing device which processes electronic data used by a board working machine is disclosed. The data processing device includes a status information processing section which performs at least one of writing processing, editing processing, and reading processing of status information, with respect to the electronic data. The status information at least illustrates whether or not the electronic data has not been completed. Preferably, the status information illustrates any of (1) the electronic data has not been completed, (2) the electronic data has been completed, and is waiting for a test by the board working machine, (3) the electronic data has been tested by the board working machine, and is waiting for authorization, and (4) the electronic data has been authorized.Type: GrantFiled: September 2, 2013Date of Patent: January 21, 2020Assignee: FUJI CORPORATIONInventors: Teruyuki Ohashi, Shigenao Otane
-
Patent number: 10536060Abstract: A method for producing an electric rotary machine including a rotor magnetic mass formed by a stack of superimposed electrical sheets containing housings, and a plurality of permanent magnets inserted in the housings, the housings being provided with a plurality of lugs for locking the permanent magnets in the housings.Type: GrantFiled: December 22, 2014Date of Patent: January 14, 2020Assignee: MOTEURS LEROY-SOMERInventors: Alban Marino, François Turcat, Stéphane Dufau, Mario Pereira
-
Patent number: 10535969Abstract: A crimping tool for an electrical connector includes a frame defining an interior, a handle rotatably coupled with the frame, and a receptacle disposed within the interior of the frame and configured in size and shape to receive an electrical connector. The crimping tool further includes a push member, coupled with the handle, configured to apply a compressive force to an electrical connector disposed within the receptacle responsive to actuation of the handle relative to the frame and a blade coupled to the frame, to the receptacle, or to the push member, so as to be actuatable to cut excess wiring from an electrical connector disposed within the receptacle.Type: GrantFiled: January 4, 2017Date of Patent: January 14, 2020Assignee: IDEAL Industries, Inc.Inventor: Robert W. Sutter
-
Patent number: 10524401Abstract: A component mounting machine moves a mounting head from a supply position P1 to each of mounting positions P3 and P4 of a circuit board CB via an imaging position P2. Further, the component mounting machine performs control such that the mounting head moves in a direction of movement at the time of imaging that is either of an X-axis direction or a Y-axis direction when passing through the imaging position P2. The component mounting machine determines the direction of movement at the time of imaging, according to a first X-axis distance Lx and a first Y-axis distance Ly from the imaging position P2 to each of the mounting positions P3 and P4.Type: GrantFiled: March 27, 2014Date of Patent: December 31, 2019Assignee: FUJI CORPORATIONInventors: Jun Iisaka, Hidetoshi Ito, Hidetoshi Kawai, Shigeto Oyama, Naohiro Kato, Kuniyasu Nakane, Ryo Nagata, Keisuke Nagiri
-
Patent number: 10515763Abstract: A method of assembling a capacitor assembly is provided. The method comprises positioning a plurality of capacitors in respective sockets formed within a non-conductive matrix and electrically coupling the capacitors to a positive terminal plate and to a negative terminal plate.Type: GrantFiled: August 4, 2017Date of Patent: December 24, 2019Assignee: PRATT & WHITNEY CANADA CORP.Inventors: Kevin Allan Dooley, Joshua Bell
-
Patent number: 10510484Abstract: A method for producing an electrical coil device may include winding a strip conductor into a coil winding and subsequently dividing the coil winding into at least two partial coils by at least one cut through the coil winding, wherein the strip conductor remains connected as a doubly contiguous loop by existing remaining connections in the end regions of the strip conductor. An electric coil device is also disclosed, which includes at least two partial coils from a higher-level doubly contiguous strip conductor. The at least two partial coils may be produced by subsequent cutting of a coil winding wound by a single strip conductor.Type: GrantFiled: March 24, 2015Date of Patent: December 17, 2019Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Otto Batz, Dietmar Bayer, Michael Frank, Marijn Pieter Oomen, Peter van Hasselt
-
Patent number: 10505235Abstract: This invention discloses a recycling apparatus for waste lithium battery, comprising a main body, a lithium battery recycling device disposed in the main body, wherein, the lithium battery recycling device comprises a dissolution device disposed in the main body, wherein the dissolution device comprises dissolution cavities symmetrically disposed in two sides of the main body; a pushing cavity communicated with the inner wall of the upper side of the dissolution cavities; a pushing device disposed in the pushing cavity; wherein the lithium battery is put into one of the dissolution cavities for alkaline dissolving through the solution in the dissolution cavity and part of the metals are extracted. The lithium battery is then pushed to the other one of the dissolution cavities for further acidic dissolution through the pushing device. Thus the recycling of the metals in the waste battery will be realized.Type: GrantFiled: December 21, 2018Date of Patent: December 10, 2019Inventor: Congjie Ye
-
Patent number: 10499491Abstract: An obfuscated radio frequency circuit may be manufactured to include a metallization layer, and a dielectric layer under the metallization layer. The dielectric layer may be made up of a plurality of dielectric substrates having different dielectric constants to obfuscate functions of the circuit.Type: GrantFiled: November 30, 2016Date of Patent: December 3, 2019Assignee: THE BOEING COMPANYInventor: Robert Tilman Worl
-
Patent number: 10490347Abstract: A method for producing a monolithic electromagnetic component includes preparing a precursor from a ferrite material during an initial step; preparing elements including at least one coil having coil turns; embedding the elements including at least one coil having the coil turns in the precursor embedded in a mold; co-sintering the elements including at least one coil having the coil turns and the precursor compressed by the mold under a predetermined pressure, the predetermined pressure being generated under a load, wherein a pulsed electric current is generated during the co-sintering; discharging the pulsed electric current through the mold such that a temperature in the mold rises; and obtaining the monolithic electromagnetic component in which the precursor is secured to the elements including at least one coil having the coil turns.Type: GrantFiled: August 21, 2014Date of Patent: November 26, 2019Assignee: Centre National de la Recherche Scientifique (C.N.R.S.)Inventors: Frédéric Mazaleyrat, Karim Zehani, Vincent Loyau, Eric Laboure
-
Patent number: 10490532Abstract: An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second substrate adjacent to the first side of the first substrate. A needle is disposed adjacent to the first frame and extends in a direction toward the second side of the first substrate. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.Type: GrantFiled: January 27, 2017Date of Patent: November 26, 2019Assignee: Rohinni, LLCInventors: Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow
-
Patent number: 10491071Abstract: A method of manufacturing an electric machine includes conformally coating a portion of a stator assembly of the electric machine via an electrophoretic process using a coating slurry. The coating slurry includes a polymer precursor loaded with thermally conductive ceramic materials. The method includes curing the polymer precursor of the coated slurry to secure the thermally conductive ceramic materials within a polymer matrix to form a conformal coating on the portion of the stator assembly. The method also includes loading the stator coils into slots of the stator core to form the stator assembly, wherein the conformal coating electrically insolates the stator coils from the stator core of the stator assembly, and wherein an effective amount of thermally conductive ceramic materials, above a percolation threshold, are present in the conformal coating to form continuous thermal pathways across a thickness of the conformal coating.Type: GrantFiled: February 16, 2017Date of Patent: November 26, 2019Assignee: GENERAL ELECTRIC COMPANYInventors: Weijun Yin, Anil Raj Duggal
-
Patent number: 10477697Abstract: A mounting apparatus includes a Y-axis movable base 36 movable in a Y-axis direction, a Z-axis movable base 40 attached to the Y-axis movable base 36 and movable in a Z-axis direction, a mounting head 12 attached to the Z-axis movable base 40 and including a mounting tool 16 for sucking and holding a semiconductor chip, a pressurizing mechanism 20 attached to the Y-axis movable base 36 and arranged to apply a force in the Z-axis direction to the mounting head 12, and a pressure receiving member 22 provided independently of the Y-axis and Z-axis movable bases 36 and 40 and installed in proximity to the pressurizing mechanism 20 to receive a reaction force in the Z-axis direction from the pressurizing mechanism 20, the pressurizing mechanism 20 slidable on the pressure receiving member 22. This prevents the mounting apparatus from being increased in the total size while maintaining the mounting accuracy high.Type: GrantFiled: January 3, 2017Date of Patent: November 12, 2019Assignee: SHINKAWA LTD.Inventor: Kohei Seyama
-
Patent number: 10476140Abstract: A method for repair of a multifunctional wideband array includes processes and operations of assessing electrical and structural impairment to the multifunctional wideband array; cutting an opening in a superstrate of the multifunctional wideband array to expose an impaired backskin section of a lower electronics assembly of the multifunctional wideband array; replacing the impaired backskin section with a replacement backskin section; and repairing the opening in the superstrate. A system of multifunctional wideband array repair includes a core having longitudinal core strips and transverse core strips; a backskin having electronics connected to the core and providing electrical functionality enabling the core cells of the core to function as a phased array antenna aperture; a number of splice clips connecting longitudinal core strips to longitudinal repair core strips; and a section of the backskin electrically connected and structurally bonded to the repair core strips.Type: GrantFiled: March 14, 2016Date of Patent: November 12, 2019Assignee: The Boeing CompanyInventors: Manny S. Urcia, Andrew S. Niederschulte, Alec Adams