Abstract: To prevent the axial compressive force that acts on the rotor core from becoming unnecessarily large and to enable a high-quality magnet embedded core to be manufactured efficiently, a retaining jig (10) for a rotor core (2) including a magnet insertion hole (4) forming a through hole defining openings on end surfaces in an axial direction includes: a first plate (12) configured to contact against one of the end surfaces of the rotor core (2) and including a gate (20) configured to communicate with the corresponding opening of the magnet insertion hole (4); a second plate (14) configured to oppose another of the end surfaces of the rotor core (2); a closure member (26) coupled to the second plate (14) via a compression spring member (28) and configured to be capable of closing the opening of the magnet insertion hole (4) on the other of the end surfaces; and a coupling member (30) that couples the first plate (12) and the second plate (14) to each other such that the closure member (26) closes the opening and

Abstract: Methods for fabricating MEMS tuning fork gyroscope sensor system using silicon wafers. This provides the possibly to avoid glass. The sense plates can be formed in a device layer of a silicon on insulator (SOI) wafer or in a deposited polysilicon layer in a few examples.

Abstract: A device for inserting electrical conductors into a machine element of an electric machine comprises a collection receptacle for providing an assembly of one or several crowns formed from electrically conductive hairpins, and an inserting device for removing the crown assembly from the collection receptacle and for introducing the crown assembly into the machine element. An associated method comprises the steps of: providing, in a collection receptacle, an assembly of one or several crowns of hairpins; removing the crown assembly from the collection receptacle; and introducing the crown assembly into the machine element which, in particular, is a stator or rotor of an electric motor.

Abstract: A wire harness electric wire length correcting device, which corrects a design value of an electric wire length of an electric wire included in a wire harness, includes an electric wire identifying means including an identification mark, which is attached to an end portion of the electric wire, and which is to be cut off from the electric wire when the wire harness is installed on an installation target object, so as to use the identification mark to identify which electric wire an end cut off from the electric wire has been cut off from, a measuring means for measuring a length of the cut off end, and a correcting means for, for the electric wire identified by the electric wire identifying means, correcting the design value of the electric wire length of that electric wire, based on the length of the cut off end measured by the measuring means.

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

Abstract: Provided are methods of making a long-term implantable electronic device, and related implantable devices, including by providing a substrate having a first encapsulation layer that covers at least a portion of the substrate, the first encapsulation layer having a receiving surface; providing one or more electronic devices on the first encapsulation layer receiving surface; and removing at least a portion of the substrate from the first encapsulation layer; thereby making the long-term implantable electronic device. Further desirable properties, including device lifetime increases during use in environments that are challenging for sensitive electronic device components, are achieved through the use of additional layers such as longevity-extending layers and/or ion-barrier layers in combination with an encapsulation layer.

Abstract: A method for fabricating an asymmetric printed circuit board with minimized warpage. The method includes determining a first resin area and a second resin area in a stack of printed circuit board layers. The method further includes performing computer modeling to predict a warpage of the printed circuit board layers during a predicted use of the printed circuit board layers. The method further includes determining a first target coefficient of thermal expansion for the first resin area and a second target coefficient of thermal expansion for the second resin area based on the computer modeling. The method further includes differentially curing resin in the first resin area and the second resin area based on the first target coefficient of thermal expansion and the second target coefficient of thermal expansion. The method further includes forming an asymmetric printed circuit board from the stack of printed circuit board layers.

Abstract: A method of manufacturing an electronic component that includes preparing unfired multilayer bodies each including main surfaces opposite to each other in a stacking direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction. One of the side surfaces of each of the unfired multilayer bodies is bonded to an adhesive sheet, and the other side surface of each of the unfired multilayer bodies is polished by rotating a polishing surface of a rotary polishing machine while contacting the other side surface. An insulating layer is formed on the polished other side surface. In the polishing of the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other thereof to form a polish groove in the length direction.

Abstract: The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and form

Abstract: A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

Abstract: Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

Abstract: A method for fabricating bulk acoustic wave resonator with mass adjustment structure, comprising following steps of: forming a sacrificial structure mesa on a substrate; etching the sacrificial structure mesa such that any two adjacent parts have different heights, a top surface of a highest part of the sacrificial structure mesa is coincident with a mesa top extending plane; forming an insulating layer on the sacrificial structure mesa and the substrate; polishing the insulating layer to form a polished surface; forming a bulk acoustic wave resonance structure including a top electrode, a piezoelectric layer and a bottom electrode on the polished surface; etching the sacrificial structure mesa to form a cavity; the insulating layer between the polished surface and the mesa top extending plane forms a frequency tuning structure, the insulating layer between the mesa top extending plane and the cavity forms a mass adjustment structure.

Abstract: A method of replacing a brush holder includes positioning a handle on the brush holder while the brush holder is connected to a support, rotating the handle relative to the brush holder in a first direction that is clockwise or counter-clockwise to connect the handle to the brush holder, removing the brush holder from the support by pulling the handle with the handle attached to the brush holder, rotating the handle relative to the brush holder in a second direction that is opposite to the first direction while pulling a trigger on the handle that moves a core in the handle upward in a cavity in the handle, and removing the handle from the brush holder.

Abstract: Embodiments of the present disclosure provide a robot arm apparatus including a fastener for fastening a first electronic component to a second electronic component, and a movable part configured to move the fastener. The fastener includes an arm connected to the movable part, a head connected to the arm and configured to contact the first electronic component, and a lock configured to be in contact with the arm when the first electronic component is moved to a reference space, and to be spaced apart from the arm when the first electronic component is fastened to the second electronic component after the first electronic component is moved to the reference space.

Abstract: A method for reducing influence of a remote reference power noise on signal quality is provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.

Abstract: A method for manufacturing a power pin of a power interface is provided. The method may includes the steps of: providing a pin workblank, wherein the pin workblank includes a first surface and a second surface adjacent to each other; performing a fine blanking process for the first surface in a predetermined blanking direction, while burrs forming on the second surface; and adjusting a position of the pin workblank, performing another fine blanking process for the second surface in the predetermined blanking direction, to form a power pin of the power interface and to omit a process of removing the burrs on the second surface. Before the step of adjusting a position of the pin workblank, the method further includes a step of forming a chamfer or a round fillet at an edge of the second surface adjacent to the first surface of the pin workblank.

Abstract: A method for transferring a plurality of die operatively associated with a transfer apparatus to a glass substrate to form a circuit component. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.

Abstract: A manufacturing method of a core for a rotary electric machine including forming a bridge portion, forming a stator side hole portion in at least a first portion of a portion of an electric steel plate in which a slot portion is formed. Then forming a rotor side hole portion in at least a part of a portion of the electric steel plate in which a hole portion is formed; and forming a rotor plate member and a stator plate member by blanking the electric steel plate.

Abstract: The invention relates to a method for making a dielectric reflectarray antenna, and a dielectric reflectarray antenna made using such method. The method includes removing, from a substrate having a dielectric layer and a first outer metallic layer arranged on one side of the dielectric layer, the first outer metallic layer to form an intermediate substrate. The method also includes cutting the intermediate substrate to integrally form a dielectric reflectarray with an array of dielectric reflector elements of the dielectric reflectarray antenna.