Patents Examined by Minh Trinh
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Patent number: 10320256Abstract: A method is for manufacturing a stator of a rotary electric machine. The method includes; forming a stator core; forming each of cassette coils by concentrically winding rectangular wire for the specified number of turns, each of the cassette coils being formed by applying a shift amount with respect to an axis in a winding direction to a wire shape of at least one of the turns before being attached to the teeth; attaching each of the cassette coils to each of teeth while canceling the shift amount; and forming a wire coil of the rotary electric machine by connecting a winding terminal of one of the cassette coils to a winding terminal of another of the cassette coils.Type: GrantFiled: August 8, 2016Date of Patent: June 11, 2019Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Hiroshi Hoshina
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Patent number: 10305354Abstract: An apparatus for winding coils of dynamoelectric machines, wherein the apparatus includes means for inserting leg portions of a coil member in a plurality of slots of at least one core of a dynamoelectric machine, wherein each slot includes an insulation member lining the walls thereof. A passage member is provided with a plurality of passages and a plurality of support areas. Each passage is configured to receive a leg portion of a coil member, and each support area is arranged adjacent a respective passage. The apparatus further includes means to align the passage member with the at least one core to align the passages of the passage member with the slots of the core such that the plurality of passages each receive a respective leg portion of a coil member and corresponding support areas engage an end of a respective insulation member during insertion of the respective leg portions.Type: GrantFiled: June 28, 2017Date of Patent: May 28, 2019Assignee: ATOP S.P.A.Inventors: Stefano Niccolini, Massimo Ponzio
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Patent number: 10305018Abstract: A manufacturing method of an electronic component includes forming a body including first and second internal electrodes respectively exposed from first and second end surfaces of the body and dielectric layers disposed between the first and second internal electrodes; applying, on the first and second end surfaces of the body, a paste containing a metal powder and first glass; and sintering the body and the paste to convert the paste to first and second external electrodes including crystalline metal particles having a polyhedral shape and second glass and respectively connected to the first internal electrodes and the second internal electrodesType: GrantFiled: October 12, 2016Date of Patent: May 28, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO, LTD.Inventors: Jeong Ryeol Kim, Bum Suk Kang, Hyo Min Kang, Hang Kyu Cho, Chang Hoon Kim
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Patent number: 10306820Abstract: A packaging system of an electronic device, in which the electronic device is mounted on a circuit board, may comprise: a first jig having a groove configured to contain the electronic device, the first jig having a surface on which a plurality of aligning posts are prepared to protrude; a circuit board supporting member connected to the circuit board to support the circuit board, the circuit board supporting member including a plurality of first guide holes into which the aligning posts are inserted; and/or a second jig configured to apply pressure to the circuit board and including a plurality of second guide holes into which the aligning posts are inserted.Type: GrantFiled: February 16, 2015Date of Patent: May 28, 2019Assignee: Samsung Electronics Co., Ltd.Inventor: Byunggil Jeong
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Patent number: 10306772Abstract: An adhesive film including a substrate film and an adhesive agent layer formed thereon is adhered to the back surface side of a mounting region of a flexible substrate, and an electronic component is mounted on the front surface side. An adhesive agent in the adhesive agent layer contains silica fine particles having a primary particle diameter of less than 100 nm, and the adhesive agent layer has a shear storage elastic modulus at 160° C. of 0.15 MPa or more. When the anisotropic conductive film is disposed on the mounting region and the electronic component is mounted on the anisotropic conductive film by heating and pressing, the adhesive agent is not pushed out to a large extent, and conductive particles sandwiched between a bump on the electronic component and the electrode are pressed and squashed, improving an electrical connection between the electronic component and the electrode.Type: GrantFiled: September 19, 2016Date of Patent: May 28, 2019Assignee: DEXERIALS CORPORATIONInventor: Takayuki Matsushima
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Electronic component conveyance device and method of manufacturing taping electronic component array
Patent number: 10297399Abstract: As an electronic component conveyance device in which an electronic component is unlikely to jam in a conveyance path. A first magnetic force generation unit is provided lateral to a first sidewall in a midstream part. A second magnetic force generation unit is provided downstream of the first magnetic force generation unit and lateral to a second sidewall in the midstream part. The midstream part includes a first transition part connected with an upstream part and a second transition part connected with a downstream part. The first sidewall is parallel to a conveyance direction in the first transition part. The second sidewall extends in a direction different from the conveyance direction in the first transition part. The second sidewall is parallel to the conveyance direction in the second transition part. The first sidewall extends in a direction different from the conveyance direction in the second transition part.Type: GrantFiled: June 14, 2016Date of Patent: May 21, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Masaru Kakuho, Naoto Tanaka -
Patent number: 10283925Abstract: A method for forming an electrical connection in a pipe for transporting a fluid. The pipe comprises an internal hollow tube and a heating layer comprising first fibers made of carbon. There are performed a groove-formation step in which a groove is formed in the heating layer, an interface-preparation step in which a junction layer is placed on the heating layer of the groove, and a placement step in which a connection strip comprising second fibers formed of a second electrically conducting material is wound on the junction layer.Type: GrantFiled: December 2, 2014Date of Patent: May 7, 2019Assignee: Total SAInventors: Alexandre Lewandowski, Franck Rey-Bethbeder, Dominique Delaporte, Alain Lechon, Maurice Geli, Yann Buzaré
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Patent number: 10284058Abstract: At the time of manufacturing both a laminated rotor core 13 and a laminated stator core 14 by punching out a plurality of iron core pieces 11 and 12 from a same strip material 10 and laminating the punched out iron core pieces 11 and 12, respectively, a plurality of kinds of laminated rotor cores 13 and 13a are manufactured by further punching out a plurality of iron core pieces 11a from the strip material 10 and laminating the punched out iron core pieces 11a. Here, the plurality of kinds of the laminated rotor cores 13 and 13a can be used for different electric motors.Type: GrantFiled: September 24, 2015Date of Patent: May 7, 2019Assignee: MITSUI HIGH-TEC, INC.Inventor: Akihiro Hashimoto
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Patent number: 10271755Abstract: A method for constructing a stress-pliant physiological electrode assembly is provided. An electrode backing is formed from a stretchable woven textile material compatible to contact the skin on at least one surface. A pair of flexile wires is provided to serve as electrode circuit trace and electrode signal pickup. At least one of the flexile wires is sewn into the textile material which provides a stress-pliant malleability. Each of the flexile wires has an electrically-contacting area functioning for electric signal pickup. The electrically-contacting area may be sewn into the woven textile or affixed to the woven textile via conductive adhesives. The stress-pliant physiological electrode assembly is applicable for a wide array of physiological monitors, including ECG monitors, and especially is suitable for long-term wear. The method disclosed is both environmentally friendly and low-cost.Type: GrantFiled: October 2, 2017Date of Patent: April 30, 2019Assignee: Bardy Diagnostics, Inc.Inventors: Jason Felix, Jon Mikalson Bishay, Gust H. Bardy
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Patent number: 10271434Abstract: Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.Type: GrantFiled: August 29, 2016Date of Patent: April 23, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John R. Dangler, David C. Long, Michael T. Peets
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Patent number: 10256044Abstract: A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.Type: GrantFiled: January 9, 2017Date of Patent: April 9, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Bong Jun Juhng, Doo Young Kim, Ki Pyo Hong, You Na Kim, Hye Young Choi
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Patent number: 10257939Abstract: Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.Type: GrantFiled: August 29, 2016Date of Patent: April 9, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John R. Dangler, Phillip Duane Isaacs, David C. Long
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Patent number: 10243313Abstract: A cable compression die assembly is used in connection with a compression tool for compressing a stranded cable prior to crimping. Upper and lower compression dies each have a semicircular groove to compress the cable. A plurality of extending blocks guides each die into sliding engagement. The stranded cable will be compressed between the upper and lower compression dies to a reduced cable radius. Compressing generally reduces or eliminates air spaces between the stranded cable wire strands. A subsequent crimp connection forms a nearly monolithic structure to maximize current flow between two crimp connected compressed stranded cables.Type: GrantFiled: June 16, 2016Date of Patent: March 26, 2019Assignee: Thomas & Betts International LLCInventor: Cong Thanh Dinh
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Patent number: 10237980Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.Type: GrantFiled: December 16, 2014Date of Patent: March 19, 2019Assignee: Lumileds LLCInventors: Frederic Stephane Diana, Patrick Allen Bournes, Walter Daeschner, Yong Seok Choi, Axel Mehnert, Mohiuddin Mala
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Patent number: 10232186Abstract: A method includes placing a plastic connector block housing portion into a connector block cavity of a header; placing a coil spring into the connector block housing portion; and connecting a metallic termination member to the coil spring and positioning the metallic termination member to be exposed outside the plastic housing portion.Type: GrantFiled: May 12, 2016Date of Patent: March 19, 2019Assignee: Cardiac Pacemakers, Inc.Inventors: Moira B. Sweeney, Michael J. Kane, James Fouhy
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Patent number: 10236751Abstract: A method of manufacturing a stator core includes punching out core members from an electrical steel sheet in three rows arrangement side by side along a width direction of the electrical steel sheet. Each of the core members has connecting projections. The connecting projections project radially outward from an outer periphery of the core member. The punched out core members are stacked to form the stator core. Each of the core members in two of the three rows arrangement have a connecting projection angled at a first angle from the width direction of the electrical steel sheet. Each of the core members in a third row having a connecting projection angled at a different second angle from the width direction of the electrical steel sheet.Type: GrantFiled: March 25, 2016Date of Patent: March 19, 2019Assignee: TOSHIBA INDUSTRIAL PRODUCTS AND SYSTEMS CORPORATIOInventors: Takayuki Akatsuka, Toyonobu Yamada, Tadashi Morishima, Tooru Yamagiwa, Chidai Isaka, Motoyasu Mochizuki, Takashi Hanai, Youichi Seo
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Patent number: 10231343Abstract: In a method for manufacturing ceramic substrates and module components, an unfired mother ceramic substrate is cut at predetermined positions for division into separate unfired ceramic substrates. The cut unfired mother ceramic substrate is pressed such that pressure is applied parallel or substantially parallel to its main surfaces so that the cross-sectional end surfaces created in the cutting step are joined. The unfired mother ceramic substrate including end surface junctions, resulting from joining of the cross-sectional end surfaces, is fired. The fired mother ceramic substrate is broken along the end surface junctions to divide it into separate ceramic substrates.Type: GrantFiled: June 10, 2016Date of Patent: March 12, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Matsubara
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Patent number: 10224789Abstract: A wire conductor alignment apparatus aligns wire conductors of coil members provided in a core of a dynamo electric motor or generator for welding the ends thereof. The apparatus has a plurality of circumferentially arranged first passages and a plurality of circumferentially arranged second passages. Each first passages is overlapped with a second passage to form a pair, each pair of passages form a combined third passage, and each third passage is configured to receive at least one end portion of at least two wire conductors of a coil member of a dynamo electric machine. The apparatus also has an actuator for moving at least one of the plurality of first passages and the plurality of second passages relative to one another in a circumferential direction to cause a respective end portion of a wire conductor for welding thereof.Type: GrantFiled: August 24, 2016Date of Patent: March 5, 2019Assignee: ATOP S.P.A.Inventors: Rubino Corbinelli, Massimo Ponzio
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Patent number: 10224134Abstract: A method of manufacturing a reactor includes a pair of coils and a pair of core units of partial I-shaped cores with gap members butted together and mounted in the coils. The respective ends of the I-shaped cores are pressed against the ends of a pair of U-shaped cores. The U-shaped cores and the I-shaped cores are formed by pressing powder in movable dies that preheat any burrs formed during pressing to be positioned in a direction different from the winding axis direction to avoid any contact with the coil.Type: GrantFiled: December 1, 2015Date of Patent: March 5, 2019Assignee: TAMURA CORPORATIONInventors: Ryo Nakatsu, Toshikazu Ninomiya, Kotaro Suzuki, Tsutomu Hamada
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Patent number: 10219419Abstract: A support pin arrangement determination assisting method includes displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on the already mounted surface; inputting an arrangement position of the support pin to the displayed image; and displaying a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.Type: GrantFiled: January 29, 2014Date of Patent: February 26, 2019Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Hirokazu Takehara, Takaaki Yokoi