Patents Examined by Minh Trinh
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Patent number: 10123431Abstract: A microelectronic substrate may be fabricated having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material which can be utilized to detect defects during the fabrication process. In one embodiment, the microelectronic substrate may be fabricated by forming a substrate core, forming a hole to extend from a first surface to an opposing second surface of the substrate core, forming a conductive material layer on a sidewall(s) of the substrate core hole, disposing a fluorescent conductive fill material to abut the conductive material layer and fill the remaining substrate core hole, illuminating an exposed portion of the fluorescent conductive fill material, and detecting anomalies in the light fluoresced by the exposed portion of the fluorescent conductive fill material.Type: GrantFiled: June 1, 2016Date of Patent: November 6, 2018Assignee: Intel CorporationInventor: Yikang Deng
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Patent number: 10116033Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.Type: GrantFiled: February 11, 2016Date of Patent: October 30, 2018Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Patent number: 10117370Abstract: A method for populating circuit boards by equipment on a populating line. The method includes acts of providing the equipment comprising a number of component types sufficient to populate a setup family of circuit board types assigned to the equipment, acquiring a number of the circuit board types with assigned circuit boards configured to be populated on the populating line within the planning horizon, assigning the circuit board types to the fixed equipment setup family, determining an assignment quality from a number of orders during a planning interval, optimizing the assignment of the circuit board types to the fixed equipment setup family by a mixed integer programming until the assignment quality exceeds a predetermined amount, and populating the circuit boards on the populating line with the components from the plurality of shuttle tables by at least one populating robot.Type: GrantFiled: September 16, 2013Date of Patent: October 30, 2018Assignee: Siemens AktiengesellschaftInventors: Alexander Pfaffinger, Christian Royer
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Patent number: 10098689Abstract: A method of manufacturing a jaw member of a surgical forceps includes forming a jaw frame having a distal jaw support. The method also includes forming an electrically-conductive defining an aperture having a first diameter, forming a stop member including a body having a second diameter smaller than the first diameter and a shoulder having a third diameter greater than the first diameter. The method also includes inserting the stop member into the aperture such that the body extends through the aperture and the shoulder abuts a portion of the electrically-conductive plate surrounding the aperture, and overmolding an outer housing about at least a portion of the jaw frame, electrically-conductive plate, and stop member to secure the jaw frame, electrically-conductive plate, and stop member to one another.Type: GrantFiled: February 24, 2016Date of Patent: October 16, 2018Assignee: COVIDIEN LPInventor: Purvish Soni
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Patent number: 10096895Abstract: A method of manufacturing a stamped antenna includes providing a sheet of metallic material for a first stamping. A first stamping of the sheet of metallic material is performed to form at least one antenna that includes traces, contacts, a carrier connected to the traces, and at least one tie-bar connected between the traces. A pad is provided with at least one pressure sensitive adhesive area that is provided on the pad in substantially the same shape as the traces of the antenna. The pressure sensitive adhesive area is aligned with the traces of the antenna, and then bonded to the traces of the at least one antenna. A second stamping of the at least one antenna and the pressure sensitive adhesive is then performed to remove the at least one carrier and the at least one tie-bar connected to the traces.Type: GrantFiled: February 1, 2016Date of Patent: October 9, 2018Assignee: A.K. Stamping Company, Inc.Inventors: Arthur Kurz, Mark Andrews
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Patent number: 10084175Abstract: A method of manufacturing a battery pack is disclosed. The method includes placing first and second sets of battery cells in first and second battery cell holders of a battery system assembly press, placing a cooling duct in a gap between the first and second sets of battery cells, and applying a first and second forces to the first and second sets of battery cells to cause the first and second sets of battery cells to respectively press against first and second sides of the cooling duct. The method also includes, while applying the first and second forces, placing the first and second plurality of battery cells in a first tray configured to hold the first and second plurality of battery cells.Type: GrantFiled: July 18, 2017Date of Patent: September 25, 2018Assignee: Thunder Power New Energy Vehicle Development Company LimitedInventors: Francesco Mastrandrea, Peter Tutzer
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Patent number: 10079529Abstract: A method for manufacturing a core of a rotating electric machine includes arranging a permanent magnet in a receptacle of a core body and injecting an anchoring material into a gap between a wall surface of the receptacle and an outer surface of the permanent magnet. A liquid crystal polymer, more specifically, liquid crystal polyester is used as the anchoring material. The liquid crystal polymer is injected at a velocity of 100 to 300 millimeters per second.Type: GrantFiled: December 14, 2015Date of Patent: September 18, 2018Assignee: TOYOTA BOSHOKU KABUSHIKI KAISHAInventors: Yoshiaki Masubuchi, Masaki Sugiyama, Masaaki Takemoto, Masayuki Kito
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Patent number: 10076070Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.Type: GrantFiled: September 28, 2015Date of Patent: September 11, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Katsuhiko Itoh, Masanori Ikeda, Kenji Okamoto
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Patent number: 10065275Abstract: A component crimping apparatus includes a crimping tool that sucks a film-like component and presses a crimping section of the sucked film-like component against the substrate to crimp the film-like component to the substrate. The crimping tool includes a block holding portion that includes a guide member extending in one direction within a horizontal plane, first suction blocks that are provided movably along the guide member and that sucks an upper part of the crimping section of the film-like component, a second suction block that is provided movably along the guide member of the block holding portion and that sucks an upper part of a non-crimping section of the film-like component and a block fixation unit that fixes the first suction blocks and the second suction block to the guide member.Type: GrantFiled: September 25, 2015Date of Patent: September 4, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Kameda, Shinjiro Tsuji
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Patent number: 10070553Abstract: A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network element chassis is deployed; powering down backplane connectors for replacement while other backplane connectors remained powered; removing the powered down backplane connectors with a connector removal tool; inserting a new set of backplane connectors in place of the removed, powered down backplane connectors with a connector insertion tool; and powering up the new set of backplane connectors.Type: GrantFiled: February 24, 2016Date of Patent: September 4, 2018Assignee: Ciena CorporationInventors: Cindy Lee, Ryotaro Miyagawa, Trevor Meunier, Michael Reginald Bishop, Peter Saturley
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Patent number: 10070566Abstract: A support pin arrangement determination assisting method includes: displaying an image including a board image that indicates a shape and an arrangement of an already mounted component on an already mounted surface; inputting an arrangement position of a support pin to the displayed image; superimposing a pin arrangement image indicating the input arrangement position on the board image to create a composite image; and displaying the composite image. The composite image, a first pin arrangement image, and a second pin arrangement image are superimposed on the board image. The first pin arrangement image is generated by inputting an arrangement position in a state that the board is positioned at the first mounting work position, and the second pin arrangement image is generated on the basis of the first pin arrangement image with an assumption that the board is positioned at the second mounting work position.Type: GrantFiled: January 29, 2014Date of Patent: September 4, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hirokazu Takehara, Takaaki Yokoi
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Patent number: 10061448Abstract: A manufacturing method of a touch screen panel includes: forming touch electrodes on a substrate; forming an insulating layer on the touch electrodes; disposing an adhesive layer on the touch electrodes and the insulating layer, the adhesive layer including an adhesive protection film adhered on one surface of the adhesive layer facing away from the touch electrodes; and forming a conductive layer on the adhesive protection film.Type: GrantFiled: September 24, 2015Date of Patent: August 28, 2018Assignee: Samsung Display Co., Ltd.Inventor: Sang Min Baek
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Patent number: 10056189Abstract: The invention discloses a high voltage wire leading method for a stereoscopic wound core open ventilated dry-type transformer, which comprises the steps of fixing stereoscopic wound cores arranged in a triangular shape between an upper clamp and a lower clamp, winding A, B and C three phase coils on the stereoscopic wound cores and arranging a high voltage wire leading bracket on the upper clamp, wherein the high voltage wire leading bracket is provided with connecting terminals which respectively correspond to the A, B and C three phase coils; and each phase coil is respectively provided with a wire inlet terminal and a wire outlet terminal. In the high voltage wire leading method, each of the three A, B, and C phase coils is provided with two wire outlet terminals and the numbers of turns of the three phase coils are still equal, so that under the condition of not changing the numbers of the turns of the coils, the added wire outlet terminals make leading more conveniently and the lead structure simpler.Type: GrantFiled: October 29, 2014Date of Patent: August 21, 2018Assignee: HAIHONG ELECTRIC CO., LTD.Inventors: Kaixuan Xu, Xianqing Guo, Qingning Liang, Liqiong Long
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Patent number: 10058020Abstract: An electronic component mounting system includes: mounting line management apparatuses disposed in each of mounting lines and an integrated management apparatus connected to the mounting line management apparatuses. The integrated management apparatus includes a first collation unit which performs collation of an electronic component based on identification information for identifying the electronic component. The mounting line management apparatus includes a second collation unit which performs collation of the electronic component. When the identification information is read out by the identification information reading-out unit, the collation of the electronic component is performed by the first collation unit if the mounting line management apparatus can access the integrated management apparatus, and the collation of the electronic component is performed by the second collation unit if the mounting line management apparatus cannot access the integrated management apparatus.Type: GrantFiled: September 24, 2015Date of Patent: August 21, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yasuhiro Maenishi, Hagemu Yasojima, Hiroaki Kurata
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Patent number: 10046492Abstract: A method for producing a cable with a resin mold including a cable section comprising an electric wire and a sheath comprising a synthetic resin covering the electric wire, and a resin mold section into which a portion of the sheath is molded by a resin is provided. A portion of the cable section is received in a receiving space in a die formed with a molten resin inlet, an inflow passage, and a resin reservoir therein. A molten resin is injected from the inlet into the receiving space. A portion of the injected molten resin flows through the inflow passage and is retained in the resin reservoir. The portion of the sheath is molten by heat of the molten resin. The molten resin is solidified to thereby form a molded resin product. Its unnecessary portion solidified in the resin reservoir is removed from the molded resin product.Type: GrantFiled: September 25, 2015Date of Patent: August 14, 2018Assignee: HITACHI METALS, LTD.Inventor: Yukio Ikeda
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Patent number: 10050498Abstract: An apparatus for manufacturing stators of dynamoelectric machines, the stators being formed as an assembly of pole segments; the apparatus comprising a seat where the assembly of pole segments are seated. An engagement assembly engages first ends of the pole segments for translation of the pole segments from the seat to a transfer device. A first holding assembly comprises a first plurality of holding members for clamping the pole segments to hold the pole segments as an assembly of pole segments. The first holding assembly being arranged on the transfer device moveable to transfer the assembly of pole segments from a first position to a second position. A containing assembly is located at the second position and provided with a second plurality of holding members for holding the assembly of pole segments. The second plurality of holding members are positioned on the containing assembly to surround the assembly of pole segments that are located at the containing assembly.Type: GrantFiled: March 14, 2014Date of Patent: August 14, 2018Assignee: ATOP S.p.A.Inventors: Massimo Ponzio, Rubino Corbinelli, Stefano Niccolini
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Patent number: 10040150Abstract: A method and apparatus for marking positions for burglar alarm sensor elements on a door, the door attached to a frame having a header including comprising the steps of providing a marking apparatus the marking apparatus including an arm arm, a positioning member with a longitudinal centerline attached to the arm, and punch point attached to the positioning member, the punch point being aligned with the longitudinal centerline of the positioning member; at least partially opening the door; placing the positioning member in a hole in the header and closing the door; while the door is closed causing the positioning member to make a mark on the top of the door; and opening the door and removing the positioning member from the hole in the header; and causing an opening to be made in the door at the location of the mark.Type: GrantFiled: December 22, 2015Date of Patent: August 7, 2018Assignee: PUNCH POINT TOOLS, LLCInventor: Richard Joseph Morales, Jr.
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Patent number: 10038293Abstract: A method including providing a contact lead frame comprised of a sheet metal member, where the contact lead frame includes a plurality of first signal contacts and a plurality of second ground contacts, where the first signal contacts have a male termination end with a first effective thickness which is substantially the same as thickness of the sheet metal member, and stamping a male termination end of the second ground contact, located at a same side of the lead frame as the male termination end of the first signal contacts, to form a dual beam structure having a second effective thickness which is larger than the first effective thickness, where two beams of the dual beam structure are generally parallel to each other along a majority of length of the male termination end of the second ground contact.Type: GrantFiled: December 3, 2015Date of Patent: July 31, 2018Assignee: FCI USA LLCInventor: Stuart C. Stoner
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Patent number: 10032544Abstract: A terminal treatment apparatus for a coaxial cable including a core member having an inner conductor covered with an insulator, an outer conductor provided around the core member and formed of a plurality of wires, and a sheath covering an outer circumference of the outer conductor, includes a widening terminal to widen the outer conductor away from the core member by compressing a terminal-near portion of the exposed outer conductor from an outer circumferential side of the coaxial cable to deform the terminal-near portion of the exposed outer conductor.Type: GrantFiled: March 22, 2016Date of Patent: July 24, 2018Assignee: YAZAKI CORPORATIONInventors: Kenta Furuhata, Yasutsugu Shiraki
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Patent number: 10033146Abstract: A method of manufacturing an electrical wire connecting structure in which a terminal having a tube-shaped portion and a conductor portion of a covered electrical wire are crimped at the tube-shaped portion, and the tube-shaped portion has a conductor crimping portion corresponding to the conductor portion, and a cover crimping portion corresponding to a cover portion of the covered electrical wire, the method comprising the steps of a) forming the tube-shaped portion, b) inserting the covered electrical wire into a corresponding space, c) crimping a welded portion of the conductor, and d) compressing the cover crimping portion.Type: GrantFiled: February 24, 2016Date of Patent: July 24, 2018Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Akira Tachibana, Kengo Mitose, Kyota Susai, Takao Tateyama, Yukihiro Kawamura, Takashi Tonoike, Masakazu Kozawa, Takuro Yamada