Abstract: Embodiments of the present disclosure describe a method of fabricating a multi-channel modulator driver with an enclosure. After a substrate is provided, components of a multi-channel modulator driver are attached to the substrate. Herein, the components include first components associated with a first channel and second components associated with a second channel. Next, an enclosure is attached to the substrate to cover the multi-channel modulator driver. The enclosure has a wall disposed between the first components and the second components, and a top region coupled with the wall. The enclosure and the wall are composed of an electrically conductive polymer. The wall includes a first portion that has the electrically conductive polymer covered by a metal film and a second portion that has the electrically conductive polymer not covered by the metal film.

Abstract: A method of assembling a connector module is provided. The method of assembling includes abutting an engagement surface of a connector extending from a circuit board with corresponding engagement surfaces of first and second support members disposed within a housing. The method of assembling includes resisting movement of the connector towards a base of the housing at a first end of the connector through a substantially perpendicular extension from at least one of the first and second support members. The method of assembling includes constraining lateral movement of the connector through engaging a receptacle formed on a second end of the connector with a pin of the first support member.

Abstract: A method for making a component for use in an electric machine is provided. The method includes applying first and second portions of a first material to a first surface, applying a second material to the first portion of first material; bonding the second material to the first portion of the first material, removing the second portion of the first material to form a void defined by the first portion of the first material, applying a conductive material in the void, and applying an insulating layer to the second material, wherein the process for preparing the component further comprising the steps of: applying first and second portions of a third material to the insulating layer; applying a fourth material to the first portion of third material, and bonding the fourth material to the first portion of the third material.

Abstract: A structure of mounting a current sensor to a battery cable includes a battery cable, a thermal fusion bonding tape wound around an outer circumference of the battery cable, and a current sensor. The current sensor includes a housing including a current detecting part configured to detect a current flowing through the battery cable, and a holder configured to hold and compress a thermal fusion bonding tape mounting portion in cooperation with the housing to deform a cross-sectional shape of the thermal fusion bonding tape mounting portion into an elliptical shape. The thermal fusion bonding tape mounting portion is a portion where the thermal fusion bonding tape is wound around the battery cable. Upon a compression between the housing and the holder being released, the elliptical shape of the cross-sectional shape of the thermal fusion bonding tape mounting portion is maintained.

Abstract: A method is for making an electronic device including forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein, the multilayer circuit board including at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The method also includes filling the membrane switch recess with a compressible dielectric material, and positioning at least one biasing member in the membrane switch recess.

Abstract: A process for manufacturing a printed circuit board, comprising a first main circuit board having a first structure, comprises steps suitable for inserting one or more secondary printed circuit boards having a different structure from that of the main printed circuit board, comprising: defining one or more cavities suitable for receiving the one or more inserts; preparing the one or more inserts comprising, on at least one side intended to make contact with a wall of the cavity, etched features and a metallization, and one or more vias; inserting the one or more inserts into the one or more cavities in the main circuit board; placing a resin in the one or more cavities to ensure cohesion of the assembly formed by the main circuit board and the one or more secondary circuit boards; laminating the assembly formed by the one or more inserts placed in the main circuit board.

Abstract: An electronic component mounting system includes a component information change history storage unit that stores component information including operating parameters for numerical determination of an operation mode of an electronic component mounting operation unit and a change history of the component information, a mounting error recorder that detects a mounting error occurring during an electronic component mounting operation and records mounting error information relating to an occurrence situation of the mounting error, and a display unit that displays a transition of the mounting error.

Abstract: A tool for removing a ferrule alignment sleeve from a sleeve mount of a fiber optic adapter, wherein the sleeve mount defines an axial bore and radially inwardly extending fingers for retaining the ferrule alignment sleeve therewithin, includes a handle and a pin extending from the handle. The pin is configured to slidably receive the ferrule alignment sleeve, the pin defining longitudinal keys for mating with gaps defined between the radially inwardly extending fingers of the sleeve mount, wherein the tool can also be used as a ferrule alignment sleeve insertion tool if the pin is inserted into the axial bore in a different orientation and from an opposite end of the axial bore as compared to the removal function.

Abstract: An electronic component mounting system includes a component information change history storage unit that stores component information including operating parameters for numerical determination of an operation mode of an electronic component mounting operation unit and a change history of the component information, a mounting error recorder that detects a mounting error occurring during an electronic component mounting operation and records mounting error information relating to an occurrence situation of the mounting error, and a display unit that displays a transition of the mounting error on a screen of the display unit and reads past component information for designated date and time based on the designated date and time so that a correlation between change in the component information and the mounting error can be checked with ease and the component information including the operating parameter can be restored to a proper state.

Abstract: A battery pack assembly and a method of making the same. The method includes using lifters with a cammed conveyor delivery mechanism to facilitate edgewise stacking of generally planar battery cells. The lifter spacing and cam profile are designed in such a way as to orient individual battery cell tabs and cooling fin assemblies to keep them close together but without applying significant forces to the stackable components. Combining conveyor streams allows components to be processed in parallel and sequenced correctly onto a single conveyor. Use of lifter integrated conveyor belt with cams and guides for individual battery cell orientation and sequencing promotes high speed assembly without a need to change component directions. The use of high-speed component delivery high is compatible with allowing more component placement variation, while the edgewise orientation of the components being assembled permits the use of small manufacturing footprints.

Abstract: A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. An array of metal posts that provide vertical electrical connections are formed by using the same metal carrier that forms the recess, so that the predetermined distance and relative location between metal posts and pads/bumps of the electronic component can be maintained.

Abstract: A method for manufacturing a temperature measure unit of a thermometer to measure an object temperature and convert to an electric signal through the temperature measure unit that is sent to a central processing unit located in the thermometer to be processed and converted to an information obtainable by users through an output unit located in the thermometer, the method includes: providing a substrate with surfaces attached a first transmission circuit and a second transmission circuit in a spaced manner; providing a thermistor chip positioned against the substrate such that one side of the thermistor chip forms electric connection with the first transmission circuit and an opposite side forms electric connection with the second transmission circuit; and providing a transmission plate with desired electric conductivity and thermal conductivity to achieve thermal transfer and electric connection between the thermistor chip and the second transmission circuit.

Abstract: A manufacturing method of a molded photosensitive assembly of an array imaging module includes the steps of providing an enclosing element at a mold engaging surface of a first mold body of a mold; receiving the circuit board in the mold and positioning between the first mold body and a second mold body; introducing a fluid state mold material into the closed mold to fill the mold cavity and enclose the electronic elements; solidifying the mold material in the mold cavity and forming a molded base integrated with the circuit board and the electronic elements; and separating the first mold body and the second mold body and obtaining a molded photosensitive assembly which is an integrated body of the circuit board, the electronic elements.

Abstract: A method for manufacturing a wiring board includes preparing a core structure, forming on a first surface of the core structure a first buildup structure including insulation layers, and forming on a second surface of the core structure on the opposite side of the first surface of the core structure a second buildup structure including insulation layers and an inductor device. The insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation layers in the first buildup structure, and the forming of the second buildup structure includes forming the inductor device in the second buildup structure on the second surface of the core structure such that at least a portion of a conductive pattern formed in the core structure is included as a portion of the inductor device.

Abstract: The invention concerns a production line consisting of an automated system for the realization of the industrial wiring of IDC connectors. A first station includes a selection guide accommodating a series of IDC connectors, and a series of pushers for shifting the series of connectors to a paired closure guide for closing the connectors of a second station. The closure guide has a series of mobile spacer partitions interposed between each of several seats, configured to release the connectors by moving said partitions as soon as the connectors are crimped onto cable wires. A third crimping station comprising a series of punches spaced apart from each other at a pre-set distance on a mobile support, which can move to pull each connector the pre-set distance until it brings an adjacent punch into position at an adjacent connector to be crimped.

Abstract: Capacitor structures having first electrodes at least partially embedded within a second electrode, and fabrication methods are presented. The methods include, for instance: providing the first electrodes at least partially within an insulator layer, the first electrodes comprising exposed portions; covering exposed portions of the first electrodes with a dielectric material; and forming the second electrode at least partially around the dielectric covered portions of the first electrodes, the second electrode being physically separated from the first electrodes by the dielectric material. In one embodiment, a method further includes exposing further portions of the first electrodes; and providing a contact structure in electrical contact with the further exposed portions of the first electrodes.

Abstract: Method for producing a stator winding (18) of an electric machine (10), in particular an AC generator, wherein the stator winding (18) has at least n phase windings (120, 121, 122, 123, 124), and one phase winding (120, 121, 122, 123, 124) has a plurality of directly successive wound coils (82) with coil sides (88) and coil side connectors (91), wherein the coils (82) are divided into first coils (82.1) and second coils (82.2), with a forming tool (100), in which slots (105, 106; 105?, 106?) are provided which are suitable for accommodating the coils (82), wherein a first coil (82.1) is arranged in a slot (105; 105?), and a second coil (82.2) is arranged in another slot (105; 105?), characterized in that n?1 slots (105, 106; 105?, 106?) are arranged between the first coil (82.1) and the second coil (82.2).

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

Abstract: Method for making an electrical machine (10), especially a three-phase generator for vehicles, that comprises a stator (16) and a rotor (20). The rotor (20) comprises a first and a second claw pole (22, 23) from which claw pole fingers (24) respectively extend in the axial direction from claw pole roots (60). A centering point (74) for a tool is located on a rear radius (72) of the claw pole roots (60).

Abstract: A method of producing a ceramic component includes a) providing a main body having internal electrodes, outer edges of which are located on at least one first outer surface of the main body, b) contacting the first outer surface of the main body with a composition including an electrophoretically mobile insulating material and electrophoretically depositing the insulating material on outer edges of the internal electrodes on the first outer surface of the main body, and c) producing an insulating layer from the insulating material on the outer edges of the internal electrodes.