Abstract: The invention relates to a process for producing a stator for an electric machine, comprising the following steps in the given sequence: Providing a cylindrical stator body having several stator slots, inserting at least one first coil in the stator slots, the first coil having a first coil end on at least one face of the stator body, and inserting the first coil end in at least one molded body for electrically insulating the first coil end.

Abstract: Disclosed is a device for remotely racking a circuit breaker into and out of a circuit breaker cradle received within a circuit breaker module. The device comprises an actuator configured to rotate a breaker shaft in a first direction and an opposite second direction to rack the circuit breaker into and out of the circuit breaker cradle without the need for an operator to attend in the vicinity of the circuit breaker module.

Abstract: A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship.

Abstract: Methods for forming a motor core having separately processed stator and rotor laminations are disclosed. The stator and rotor laminations may be formed from a single electrical steel source, such as a sheet or coil. The methods may include forming and heat treating a first portion of the steel source to form stator laminations having a first microstructure (e.g., mean grain size) and magnetic and mechanical properties (e.g., core loss). They may further include forming and heat treating a second portion of the steel source to form rotor laminations having a second microstructure that is different from the first and magnetic and mechanical properties that are different from the stator laminations. The stator laminations may have improved core loss and permeability performance and the rotor laminations may have improved mechanical properties. By separating the processing, each core may have properties tailored to conditions that they will experience in operation.

Abstract: A cable clamp assembly quickly and efficiently secures to an exterior portion of a cable by clamping onto the cable with a predetermined amount of force so as to not cause damage to the cable. The cable clamp assembly is optimized for quick and efficient insertion and retraction of the cable from the cable clamp assembly. The cable clamp assembly includes a plurality of cable clamp arms that are arranged to surround a cable and simultaneously move towards a cable to apply force to the exterior section of the cable.

Abstract: An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

Abstract: A mounting assembly (100) for mounting a plug (10) of a bayonet circular connector, the plug (10) having a circular core (11) which supports a plurality of electric contacts (12) engageable with corresponding complementary electric contacts of a receptacle (13) of the bayonet circular connector and a bayonet blocking ring (14) which is mounted in a rotating manner on the core (11) and which is suitable for cooperating with blocking elements (15) arranged in the receptacle (13) in the mounting assembly (100). A tubular body (16) for supporting the core (11) is provided where the tubular body (16) is insertable in an opening (17) of a panel (18) or a wall, with fixing means for fixing the tubular body (16) to the panel (18) or to the wall, and maneuvering means (19) for maneuvering the bayonet blocking ring (14).

Abstract: A variable pitch punch apparatus (1) for punching holes in material. The apparatus comprises a rotary punch head (2) comprising at least one punch member (4a-c) to punch at least one hole in a material at least one desired location. The apparatus (1) further comprises a die head (6) comprising at least one die (7) corresponding to said punch member (4a-c). The apparatus (1) further comprises an actuator for providing a selective relative speed difference between the material and the rotary punch head (2).

Abstract: An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.

Abstract: The present invention is a method and apparatus for producing ready to use RFID devices in a convenient and economical manner. The apparatus of the present invention may be collocated with a manufacturer of consumer goods.

Abstract: A semiconductor manufacturing apparatus comprises a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips, a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator, a pickup unit connected to a movement control unit simultaneously picking up the plurality of semiconductor chips, and a control unit controlling movement and rotation of the pickup unit and controlling the suction control unit, the control unit is connected to the movement control unit. The pickup unit converts an interval of the plurality of semiconductor chips to a predetermined pitch and holds the pitch. The pickup unit moves the plurality of semiconductor chips from the stage to mounting positions of a supporting substrate and simultaneously adheres the plurality of semiconductor chips at the mounting positions by the control unit.

Abstract: A method for making joints in an electrical cable is disclosed. A first cable having polymeric insulation and a first bare conductor end and a second cable having polymeric insulation and a second bare conductor end are provided and joined create a conductor joint. A curable reaction mixture is applied over the conductor joint and cured to form a polymeric insulating sheath over the conductor joint and bonded to the polymeric insulation of each of the first and second cables. The reaction mixture includes a carbon-Michael acceptor compound, a carbon-Michael donor compound and a carbon-Michael reaction catalyst.

Abstract: A method of assembling a hydrophone is provided in which the method stacks ceramic rings, delrin washers, and LC-800 washers such that a top edge of a composite stack extends beyond a top of a hydrophone flange. By measuring the voltage on each ceramic ring while an end cap and a socket head cap screw are installed; the axial compression of each ceramic ring is quantified; thereby, providing an opportunity to equalize the axial compression of each ceramic ring to yield an accurately performing hydrophone.

Abstract: An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

Abstract: A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.

Abstract: A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder is instructed for each component terminal.

Abstract: An installation guide for a backshell installation guide is disclosed herein. The installation guide includes a first feature formed therein to receive at least a portion of the backshell to retain the backshell in the installation guide. The backshell guide also includes a second feature formed therein to align the installation guide with a portion of an equipment rack containing a circuit card to which the backshell is to be connected. The alignment feature positions mating connectors of the backshell in alignment with connectors of the circuit card facilitating interconnection of the mating connectors and the connectors by moving the installation guide toward the circuit card with the alignment feature engaged with the portion of the equipment rack.

Abstract: A printing system for printing substrates, in particular printed circuit boards, includes a printing device having at least one printing table and a printing template assigned to the printing table. The printing system further includes a first pair of first slide elements and a second pair of second slide elements for aligning a substrate on the printing table. The first pair of first slide elements can be displaced counter to one another along a first axis. The second pair of second slide elements can be displaced counter to one another along a second axis, which differs from the first axis. A drive device is assigned to each pair for simultaneously displacing the slide elements thereof.

Abstract: In a method of identifying a direction of stacking in a stacked ceramic capacitor, while density of magnetic flux generated from a magnetism generation apparatus is measured with a magnetic flux density measurement instrument, a stacked ceramic capacitor is caused to pass between a magnetism generation apparatus and the magnetic flux density measurement instrument and variation in magnetic flux density at least at the time of passage of the stacked ceramic capacitor is measured. Based on a result of measurement of magnetic flux density, a direction in which a plurality of internal electrodes are stacked in the stacked ceramic capacitor is identified.

Abstract: A manufacturing method of a piezoelectric element includes forming an adhesive layer of a lead electrode on a piezoelectric element main body of a vibration plate, forming a metallic layer of the lead electrode on the adhesive layer, removing the metallic layer to leave the adhesive layer in a portion that corresponds to an extended electrode of the lead electrode using etching, patterning the remaining adhesive layer as individual extended electrodes that correspond to the piezoelectric element main body using etching, joining a protective substrate onto the vibration plate in a state in which the piezoelectric element main body is accommodated inside an accommodation hollow section and the extended electrode is positioned further on an outer side of the vibration plate than the protective substrate, layering and forming a section of the wiring on the protective substrate and the extended electrode, and patterning the wiring as individual wiring for each extended electrode using etching.