Abstract: A method for manufacturing a stator for a rotating electrical machine by placing coils in a stator core, wherein each of a plurality of teeth formed in a radial pattern in an inner periphery of an annular yoke portion in the stator core has tip-end parallel side surfaces formed in its tip end portion having a constant width in a circumferential direction, has intermediate tilted side surfaces continuous with the tip-end parallel side surfaces and formed in its portion whose width in the circumferential direction increases closer to an outer periphery, and has base-end parallel side surfaces continuous with the intermediate tilted side surfaces and formed in its base end portion having a constant width in the circumferential direction.

Abstract: Provided is a method for manufacturing a battery wiring module including: a coating step of coating a first long side portion of a flat plate conductor and a plurality of linear conductors following the first long side portion by a first insulating resin portion and of coating a second long side portion of the flat plate conductor and a plurality of linear conductors following the second long side portion by a second insulating resin portion; and a cutting step of cutting the insulating resin portion so that the plurality of busbars is divided into a plurality of busbar groups and the plurality of linear conductors coated by any one of the first insulating resin portion and the second insulating resin portion and the busbar groups are separated.

Abstract: The present invention provides a method of manufacturing a receiver-in-canal assembly. The method comprises the steps of providing a receiver housing configured to be positioned in or at the ear canal of a user, and further being configured to comprise a receiver configured to output sound; providing a connector housing configured to be connected to a behind-the-ear part of a hearing aid; and providing an elongated tube configured for transfer of a signal from the connector housing to the receiver housing. In a further step the receiver housing and the connector housing are attached to opposite ends of the elongated tube. Subsequently, the tube is permanently deformed after attachment of the receiver housing and the connector housing to the tube by exposing it to heat in a first predetermined treatment period.

Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract: A method of assembling an integrated drive generator includes the steps of providing a bore in a center housing portion, pressing a bearing liner into the bore, with a portion of the bearing liner extending proud of a surface of the center plate, and machining the surface around and adjacent to the bearing liner to provide a machined surface parallel to the surface.

Abstract: Electronic component mounting method for mounting an electronic component on a plurality of board types includes: placing, on tray holding shelves, trays storing components for first and second board types, respectively; recognizing on which tray holding shelf the tray is placed by reading identification information from the trays. The method further includes: rearranging the trays in the tray feeder to a first tray arrangement adapted for the first board type, based on recognized placement position of the tray and the first tray arrangement data, before start of production of the board of the first board type; and rearranging the trays in the tray feeder to a second tray arrangement adapted for the second board type, based on the second tray arrangement data, before start of production of the board of the second board type.

Abstract: A voltage controlled oscillator comprises a negative resistance, a first inductor, a fixed capacitor, and a frequency control component. The frequency control component comprises at least one varactor and at least a second inductor connected in series with the at least one varactor. A magnitude of an inductance of the second inductor is selected such that the frequency control component has an effective capacitance range larger than a capacitance range of the at least one varactor.

Abstract: Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Abstract: A method for producing a crimp connection includes initially guiding a cable end of a cable with a gripper to a crimping press. For this feed movement the gripper is moved by an actuator in an axial direction along the cable axis. The cable end is thereafter connected with a crimp contact. During the crimping process the gripper is, for compensation for length extension of the cable during crimping, moved along the cable axis in a return movement in an opposite direction to the feed movement.

Abstract: An optical device includes a substrate including a waveguide array formed therein, each waveguide having a reflective surface; a lens array unit including a waveguide-side lens array arranged facing the waveguide array so each lens of the lens array is aligned with the corresponding reflective surface; and a connector unit including an optical transmission path-side lens array arranged and fixed so each lens of the lens array is aligned with the corresponding lens in the waveguide-side lens array, the plurality of inserted optical transmission paths aligned with the corresponding lens in the optical transmission path-side lens array.

Abstract: The disclosed embodiments relate to a communication device (200) that implements a subset of feature choices selected from a complete set of feature choices. An exemplary embodiment comprises at least one common hardware component (210) common to any subset of feature choices, and a base (102) that is adapted to accommodate installation of at least one optional hardware component (221) associated with at least one feature of the complete set of feature choices.

Abstract: A method for manufacturing an electric motor stator, including: attaching a hollow bracket to an end of a hollow stator core and allowing a lead connected to the winding to pass through an opening formed in a peripheral surface of the bracket to take out the lead to an outside of the bracket; placing a core material inside the stator core and the bracket; attaching a sealing member to an outer peripheral surface of the bracket so as to block the opening while allowing the lead to pass through the through-hole; and filling a molten resin into an annular space between the stator core and the core material and between the bracket and the core material, to form a resin unit.

Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.

Abstract: Technology is provided for circuit board actuator systems for ejecting and inserting a circuit board into a circuit board connector. The actuator system includes a cross-member attached to a circuit board and a pair of levers pivotably coupled to opposite end portions of the cross-member. Each lever is moveable between a closed position and an open position and includes an arm with an insertion pawl and an ejector pawl extending from the arm. The system further includes a pair of circuit board guides, each including a keeper and mountable adjacent a circuit board connector. The insertion pawls operate against the keepers to insert the circuit board into the connector when the levers are moved toward the closed position, and the ejector pawls operate against the keepers to eject the circuit board from the connector when the levers are moved toward the open position.

Abstract: A structural capacitor having a plurality of planar dielectric layers and a plurality of positive and negative electrodes with the positive and negative electrodes alternating between each dielectric layer and methods for making structural capacitors are provided. First and second spaced apart holes are provided through each dielectric layer as well as the electrodes so that the first holes in the electrodes register with the first holes in the dielectric layer and likewise for the second holes. The capacitor is formed by stacking the dielectric layers and electrodes on two spaced apart alignment pins with a positive alignment pin extending through the first holes and a negative alignment pin extending through the second holes in the dielectric layers and electrodes. These alignment pins maintain layer alignment during subsequent thermal and pressure processing to bond together the dielectric and electrode layers into an integral structural material.

Abstract: A method of manufacturing a battery pack is disclosed. The method includes placing first and second sets of battery cells in first and second battery cell holders of a battery system assembly press, placing a cooling duct in a gap between the first and second sets of battery cells, and applying a first and second forces to the first and second sets of battery cells to cause the first and second sets of battery cells to respectively press against first and second sides of the cooling duct. The method also includes, while applying the first and second forces, placing the first and second plurality of battery cells in a first tray configured to hold the first and second plurality of battery cells.

Abstract: A terminal connecting method including: removing a insulation film by a predetermined length from one end of a litz wire; inserting to a pressure fixing part a terminal part of the litz wire; compressing a first portion of the pressure fixing part with a first compression force to cause plastic deformation of an entirety of the pressure fixing part, and to temporarily fix the terminal part of the litz wire to the pressure fixing part; compressing a second portion of the pressure fixing part with a second compression force greater than the first compression force to locally cause plastic deformation of the pressure fixing part and the litz wire, the second portion being a part of the first portion; and pouring molten solder from a front end side of the pressure fixing part to firmly fix the litz wire to the terminal metal fitting.

Abstract: A stacked core includes a plurality of core pieces that are arranged in a stack. Each of the core pieces has a plurality of magnet insertion holes. A bridge is provided between a radially-outer end of each of the magnet insertion holes and an outer region of each of the core pieces, A radially-outer contour of the bridge is provided on a radially-inner side of a blanking-contour line of each of the core pieces.

Abstract: A method for providing a chassis is described. A chassis base that includes at least ninety-five weight percent of a first metal element that is one of Aluminum or Magnesium is provided. The chassis base is doped at an edge section, which extends around the circumference and that is located adjacent a center portion of the chassis base, with at least five weight percent of at least one second metal element that is selected from the group including Lithium, Titanium, Tungsten, Chromium, Hafnium, Lanthanum, and Ytterbium, such that the center portion is not doped with the at least one second metal element. The chassis base is heat treated such that the center portion includes at least ninety-five weight percent of the first metal element and the edge portion of the chassis base includes at least five weight percent of the at least one second metal element.

Abstract: Embodiments of the present disclosure describe a method of fabricating a multi-channel modulator driver with an enclosure. After a substrate is provided, components of a multi-channel modulator driver are attached to the substrate. Herein, the components include first components associated with a first channel and second components associated with a second channel. Next, an enclosure is attached to the substrate to cover the multi-channel modulator driver. The enclosure has a wall disposed between the first components and the second components, and a top region coupled with the wall. The enclosure and the wall are composed of an electrically conductive polymer. The wall includes a first portion that has the electrically conductive polymer covered by a metal film and a second portion that has the electrically conductive polymer not covered by the metal film.