Patents Examined by Minh Trinh
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Patent number: 8887380Abstract: A wire stop assembly is provided for a terminal crimping machine that crimps a terminal to a wire. The terminal crimping machine includes a crimping zone. The wire stop assembly includes a wire stop member having a stop surface configured to engage the wire to limit an amount of travel of the wire in the crimping zone. The wire stop member is movable relative to the crimping zone in a floating direction. A biasing mechanism is configured to exert a biasing force on the wire stop. The biasing force provides a resistance to the movement of the wire stop member in the floating direction.Type: GrantFiled: April 24, 2009Date of Patent: November 18, 2014Assignee: Tyco Electronics CorporationInventors: John Michael Wasilko, Kerry Joseph Stakem, Brian Keith Weaver
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Patent number: 8881373Abstract: An assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface may be provided. At least a first portion of the redistribution layer may be electrically connected to the IC through a first opening in the repassivation layer. Furthermore, a substrate having a first antenna terminal may be provided, and a second opening may be formed in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer with an etchant. The first opening and the second opening may be nonoverlapping. The assembly may be attached to the substrate with an adhesive.Type: GrantFiled: February 25, 2013Date of Patent: November 11, 2014Assignee: Impinj, Inc.Inventors: Ronald Lee Koepp, Ronald A. Oliver, Harley Heinrich, Jaideep Mavoori, Tan Mau Wu, Christopher J. Diorio
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Patent number: 8875369Abstract: A plug removal and/or installation system 400, which has a structural framework configured to support a removal assembly and that, allows approximately one axis motion of the removal device. The removal device is configured with a plug attachment device that is configured to pass through a lower framework structural opening. The structural framework is configured to movably self align so that the removal device exerts approximately a linear force on a plug 300 along an approximately single axis 335 parallel to a plug central axis.Type: GrantFiled: December 2, 2010Date of Patent: November 4, 2014
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Patent number: 8875380Abstract: A process of forming an encapsulated magnet assembly is provided, the process comprising welding a second portion of a housing cover formed of a non-magnetic material to a first portion of a housing cover formed of a magnetic material to provide a welded housing cover and subsequently heat-treating the welded housing cover at a temperature effective to relieve weld stress; disposing a magnet within a housing comprising at least one wall formed of the non-magnetic material and defining at least one aperture; and welding the heat treated welded housing cover to the housing such that the second portion of the housing cover is fixedly attached to the housing wall to hermetically seal the aperture. In one embodiment, the magnet of the encapsulated magnet assembly is a permanent magnet, and in an alternate embodiment an electromagnet. In one embodiment the encapsulated magnet assembly is a component of a stator-rotor assembly.Type: GrantFiled: November 5, 2010Date of Patent: November 4, 2014Assignee: General Electric CompanyInventors: Konrad Roman Weeber, Jeremy Daniel Van Dam, Mohamed Ahmed Ali
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Patent number: 8870472Abstract: A computer program product for fabricating an optical assembly, having a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code includes a first computer readable program code configured to horizontally position a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate; a second computer readable program code configured to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position; a third computer readable program code configured to vertically position a flip-chip bonder bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and a fourth computer readable program code configured to fixably mount the optical component to the substrate edge.Type: GrantFiled: November 14, 2012Date of Patent: October 28, 2014Assignee: International Business Machines CorporationInventors: Stefano Sergio Oggioni, Jonas R. Weiss, Bert Jan Offrein
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Patent number: 8869402Abstract: A method for manufacturing a tool equipment used in molding a panel for a fuselage of an aircraft from a composite material is provided. The method includes manufacturing a mold such that a fixed part includes a hub and an intermediary member. A plurality of removable modules which are able to be mounted on this fixed part are also manufactured and then fastened to the fixed part so as to modify an external surface upon which composite material is laid-up or draped during the molding of the panel.Type: GrantFiled: December 15, 2010Date of Patent: October 28, 2014Assignee: Airbus Operations (SAS)Inventors: Cédric Meyer, Jocelyn Gaudin
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Patent number: 8869379Abstract: A method of producing a rotor includes crimping and stacking a plurality of core pieces through crimping connecting portions to form a rotor stacked core having a magnet-insertion hole and inserting a permanent-magnet pieces into the magnet-insertion hole. Further, the method also includes clamping the rotor stacked core between an upper die and a lower die, and filling a resin into the magnet-insertion hole from a resin reservoir pot which is formed in the upper die or the lower die. Also, the resin may be filled into the magnet-insertion hole while placing the crimping connecting portions at a center of the resin reservoir pot.Type: GrantFiled: November 9, 2010Date of Patent: October 28, 2014Assignee: Mitsui High-Tec, Inc.Inventors: Hirotoshi Mabu, Kohei Yoshida
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Patent number: 8857045Abstract: A method of assembling a circuit board assembly is provided. The circuit board assembly includes a circuit board assembly fixture and a plurality of fixed circuits. The method includes coupling the plurality of fixed circuits to the circuit board assembly fixture. The plurality of fixed circuits includes at least one of a fully flexible circuit, a flexible circuit having stiffeners, and a rigid circuit. The fixture includes a plurality of supporting surfaces each including a first side, configured to receive at least one of the fixed circuits, and an opposite second side. The fixture includes at least one hinge, at least one fastening mechanism extending from the first side, and at least one retainer coupled to at least one of the plurality of supporting surfaces. The method includes folding the circuit board assembly fixture into a desired alignment.Type: GrantFiled: June 2, 2011Date of Patent: October 14, 2014Assignee: General Electric CompanyInventors: Ryan Adam Conger, Robert Ivan Rose, Dale Stewart Apgar, Robert Paul Stachow, Jr.
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Patent number: 8857022Abstract: A low capacitance density, high voltage MIM capacitor and the high density MIM capacitor and a method of manufacture are provided. The method includes depositing a plurality of plates and a plurality of dielectric layers interleaved with one another. The method further includes etching a portion of an uppermost plate of the plurality of plates while protecting other portions of the uppermost plate. The protected other portions of the uppermost plate forms a top plate of a first metal-insulator-metal (MIM) capacitor and the etching exposes a top plate of a second MIM capacitor.Type: GrantFiled: November 27, 2012Date of Patent: October 14, 2014Assignee: International Business Machines CorporationInventors: James S. Dunn, Zhong-Xiang He, Anthony K. Stamper
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Patent number: 8857051Abstract: A method for coupling a lead-in cable to an insulated conductor includes exposing an end portion of a core of the insulated conductor by removing at least a portion of a jacket and an electrical insulator surrounding the end portion of the core. A recess is formed in the electrical insulator at the end of the electrical insulator surrounding the end portion of the core. An end portion of a conductor of the lead-in cable is exposed by removing at least a portion of a sheath and insulation surrounding the end portion of the conductor. The end portion of the core is coupled to the end portion of the conductor. The end portion of the core and the end portion of the conductor are placed in a body filled with electrically insulating material.Type: GrantFiled: October 7, 2011Date of Patent: October 14, 2014Assignee: Shell Oil CompanyInventors: David Booth Burns, Robert Guy Harley, Patrick Silas Harmason, Francis Marion Stone, Jr., Edward Everett de St. Remey
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Patent number: 8850698Abstract: A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.Type: GrantFiled: November 10, 2010Date of Patent: October 7, 2014Assignee: ThalesInventors: Claude Drevon, Olivier Vendier, Walim Ben Naceur
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Patent number: 8850695Abstract: Printed circuit board (PCB) assembly tooling and methods are provided. Particular tooling includes a first tooling fixture having a first core component receiver to receive a first portion of a magnetic core to be coupled to a first side of a PCB. The tooling also has a second tooling fixture including a second core component receiver to receive a second portion of the magnetic core to be coupled on a second side of the PCB to the first portion of the magnetic core. The tooling also has an alignment component disposed on at least one of the first tooling fixture and the second tooling fixture. The alignment component enables alignment of the first tooling fixture and the second tooling fixture. When the first tooling fixture and the second tooling fixture are aligned, the first portion of the magnetic core and the second portion of the magnetic core are aligned.Type: GrantFiled: January 5, 2010Date of Patent: October 7, 2014Assignee: The Boeing CompanyInventors: Norman L. Call, Jose M. Chavez, Rodolfo Chavez
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Patent number: 8851395Abstract: Method for applying an electrical contact to a hole (2) of a metal wall portion (1), comprising the steps of providing a bush (12), a punch (11) with a shaft (16), an expansion portion (19) and a connecting portion (20) thereof, a pulling device (21) with an abutment portion (22) and a pulling mechanism (23) for engaging the punch (11) and to pulling it proximally with respect to the abutment portion (22), inserting the punch (11) in a passage hole (25) of the bush (12) so that the connecting portion (20) protrudes proximally from the bush and the expansion portion (19) is located on end (14), bush connecting the punch (11) to the pulling device (21), inserting the preassembled bush (12)-punch (11)-unit from a proximal side of the wall portion (1) distally in the hole (2) and activating the pulling device (21) to pull the punch (11) proximally through the bush, thereby radially expanding bush and permanently anchoring it in the hole (2).Type: GrantFiled: December 18, 2009Date of Patent: October 7, 2014Assignee: Cembre Ltd.Inventors: Kevin Ernest Woolley, Benjamin Ryan Mullaley
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Patent number: 8850690Abstract: A method of manufacturing an armature for an electric motor, includes: placing a commutator and a lamination stack on an armature shaft, winding magnet wire in slots in the lamination stacks to form coils, attaching ends of the magnet wire to the commutator, and molding plastic around the magnet wire and around the shaft of the armature at ends of the lamination stack. A spinning inertia of the armature is adjusted by adjusting at least one of a mass of the plastic molded and a distribution of the plastic molded. Alternatively and/or additionally, at least one of a resonant frequency and critical speed of the armature is adjusted by adjusting at least one of a geometry of the plastic molded, the physical properties of the plastic and the mechanical properties of the plastic.Type: GrantFiled: November 1, 2012Date of Patent: October 7, 2014Assignee: Black & Decker Inc.Inventors: Hung T. Du, Brandon L. Verbrugge, Joshua F. West, Michael R. Sell, Richard T. Walter, David J. Smith, Earl M. Ortt, John C. Stone, Howard T. White
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Patent number: 8850694Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.Type: GrantFiled: April 5, 2010Date of Patent: October 7, 2014Assignee: Palo Alto Research Center IncorporatedInventors: Eugene M. Chow, Jeng Ping Lu, Meng H. Lean, David K Biegelsen
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Patent number: 8844118Abstract: A method of manufacturing a motor for a power tool includes providing an armature configured to be coupled to a shaft. The armature includes a yoke and a first tooth and a second tooth that extend radially outward from the yoke to define a slot between the first tooth and the second tooth. Each of the first tooth and the second tooth include an inner end adjacent the yoke and an outer end opposite the inner end. The method further includes coupling a first wire guide member to the outer end of the first tooth, coupling a second wire guide member to the outer end of the second tooth, winding wire into the slot, after winding wire into the slot, compressing the wire radially into the slot, uncoupling the first wire guide member from the first tooth, and uncoupling the second wire guide member from the second tooth.Type: GrantFiled: October 23, 2009Date of Patent: September 30, 2014Assignee: Milwaukee Electric Tool CorporationInventors: Jeffrey C. Hessenberger, Alan Yeadon, Brandon Verbrugge, Michael Kolden, Dennis J. Cerney
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Patent number: 8844863Abstract: Device for mechanically decoupled retention of components perfused by hot gas in an aircraft, with a coupling member for coupling to a component emitting hot gas and to a component accepting hot gas, with a holder, with a flange, and with a bellows, the holder being fittable to a housing or frame connected to the component emitting hot gas, the bellows being fastened by one end to the flange and by the other end to the holder, and the coupling member being fastened to the flange. By virtue of the device, both an angular misalignment and radial and axial positional misalignment can be equalized.Type: GrantFiled: November 10, 2008Date of Patent: September 30, 2014Assignee: Airbus Operations GmbHInventor: Markus Piesker
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Patent number: 8844104Abstract: The present disclosure includes a machine tool system having multiple zones. The zones may be areas divided by physical barriers or virtual zones. The zones may include a first zone having a first kinematics arrangement and a second zone having a second kinematics arrangement. The first zone and the second zone may share one or more machine axis and at least one of the first zone and the second zone has at least one non-shared machine axis. The present disclosure also includes multi-interface machine tool systems.Type: GrantFiled: April 22, 2010Date of Patent: September 30, 2014Assignee: Hurco Companies, Inc.Inventor: Paul J. Gray
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Patent number: 8844124Abstract: An electronic component mounting system and method is disclosed that can provide accurate operation instruction to a machine operator. The electronic component mounting system comprises a plurality of machines interlinked in series. A main screen, making up an operation instruction screen, is displayed on a display panel belonging to an operation target machine to be operated by the machine operator while a first sub-screen and a second sub-screen of the operation instruction screen are respectively displayed on display panels belonging to two adjacent machines placed adjacently on both sides of the operation target machine among the plurality of machines. Thus, even when a unit device has a small width such that a size restriction is imposed a display panel, accurate operation instruction, with a sufficient amount of information, can be provided by displaying the operation instruction screen on multiple display panels.Type: GrantFiled: October 7, 2008Date of Patent: September 30, 2014Assignee: Panasonic CorporationInventors: Kazuhiko Itose, Kenichiro Ishimoto, Yoshiaki Awata, Hideki Sumi
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Patent number: 8844103Abstract: Methods for making feedthrough assemblies including a capacitive filter array are disclosed. Methods disclosed include attaching a perimeter wall of the capacitor filter array to an interior wall of a ferrule, depositing a thick film conductive paste within at least one passageway to form a conductive pathway, and heating the ferrule, capacitor filter array and the thick film conductive paste to convert the paste to a relatively solid material.Type: GrantFiled: November 30, 2011Date of Patent: September 30, 2014Assignee: Medtronic, Inc.Inventors: Rajesh V. Iyer, Simon E. Goldman, Thomas P. Miltich