Abstract: A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract: A method for fixing a piercing nut includes placing on a punching die a metal plate. A pilot portion is provided at a bearing surface of a nut main body of the piercing nut. A height from the bearing surface to an end face of the pilot portion is smaller than a thickness of the metal plate. The pilot portion is pressed to a first surface of the metal plate to be struck into the metal plate so that an inner peripheral surface of a punching opening portion of the metal plate engages with an outer peripheral surface of the pilot portion to fix the piercing nut to the metal plate. The end face is positioned between the first surface and a second surface of the metal plate. A punching slag is downwardly pushed to discharge the punching slag to a punching hole of the punching die.

Abstract: A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera.

Abstract: A method for forming a rotor assembly including a cast rotor frame includes positioning a preheated rotor core defining a plurality of passages in a mold cavity such that the mold cavity and the rotor core define the rotor frame including a plurality of conductor bars defined by the plurality of passages in fluid communication with first and second end portions of the mold cavity. Molten metal is quiescently introduced into the mold cavity through an ingate and simultaneously flowed through the plurality of passages prior to filling at least one of the first and second end portions of the mold cavity to form the cast rotor frame. Entrained air and impurities may be displaced from the passages by the flow of molten metal and vented or entrapped by a biscuit. The rotor frame and conductor bars thus formed may be characterized by high conductivity, negligible porosity, and minimal oxides.

Abstract: The invention describes a manufacturing method for an acoustic balanced-unbalanced (balun) or balanced-balanced thin-film BAW filter based on lateral acoustic coupling. In laterally acoustically coupled thin-film BAW filters (LBAW) one can realize transformation from unbalanced to balanced electric signal if the electrodes of the balanced port are placed on the opposite sides of the piezoelectric film. The manufacturing process is simpler than in the corresponding component based on vertical acoustical coupling. The device can also realize impedance transformation.

Abstract: A method for fabricating an optical assembly by placing a flexible portion of a substrate, including a waveguide, upon a horizontally movable stage of a flip-chip bonder. Then moving a clamp through an opening in the stage to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position and vertically downwardly moving a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide and mounting the optical component to the substrate edge. Then releasing the optical component from the bond head while moving the clamp downward through the stage opening and unbending the flexible portion of the substrate with the optical component mounted thereon.

Abstract: According to an aspect of the invention, there is provided a chip die 2 manipulator apparatus arranged for picking and placing of a chip die 2 in a chip manufacturing process, wherein an imaging system 11 comprising an arc form convex spherical mirror 13 arranged at a second off-axis position B and centered relative to the center position 5; a folding mirror 4 arranged in a light path between the convex spherical mirror 13 and the center position 5 for folding the light path to a third off-axis position C; and an arc form concave spherical mirror 15 arranged at the third off-axis position C having a curvature to image from at least one of the center position 5 and the component 2 on the image detection system 9. The imaging system 11 corrects for the angled image detection of the center position 5.

Abstract: A method (20) is described for making a stator (1) of an electric machine, the stator comprising a stator core (2), the stator core comprising a main body and a plurality of slots (8) which are axially extended inside the main body and are adapted to receive bar conductors. (5, 5?, 5?) of a bar stator winding. The method (20) comprises the steps of : inserting (23) at least one preshaped insulating sheet (10) inside at least one of said slots (8); hot shaping (26) said preshaped insulating sheet (10) inside the slot, along the entire axial extension of the slot (8) or along a substantial portion thereof, in order to confer form regularity and stability to said preshaped insulating sheet (10). Through the described process, it is possible to make stators with bar winding having a stator core with relatively high height and slot fill factor.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: Method for producing a distributed lap winding for polyphase systems, in particular for alternators, wherein, in a first step, a chain of laps is formed with a linking direction, characterized in that, in a further step, at least one lap is rotated with its lap sides at right angles to the linking direction such that at least one lap side of one lap is arranged alongside at least one lap side of another lap such that the at least one lap side of one lap and the at least one lap side of another lap are arranged at a position which corresponds to a slot position.

Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker.

Abstract: A grooved-ended resilient expansion joint is disclosed. The expansion joint has a resilient expansion member with a central resilient portion and two resilient axially disposed cylindrical ends. Each cylindrical end has a radially outwardly raised distal cylindrical gasket portion with at least one inside shoulder having an inner diameter sized substantially the same as an outer diameter of a pipe to be joined. Each cylindrical end also has a neck portion between the central portion and the gasket portion that is sized to receive a grooved-ended pipe nipple.

Abstract: A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.

Abstract: A method for manufacturing a laminated ceramic electronic component is provided in which a plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: A method of manufacturing a facade panel for the outer lining of a building in which tiling forming the outer surface of the panel is formed on the surface of the back panel meant to be the background of the facade panel. Tiling is attached to the back panel and the seams between the tiles are seamed with the help of a seam mass. A bottom panel on top of which a tile controller is set to adjust the locations of the tiles positioned upside down. The back panel is pressed on top of the tiles whereupon attachment spikes attached to the back panel penetrate the seams between the tiles. The tile seams are filled with a jagged rough mass and then filled with a hardening seam mass and attachment spikes attached to the back panel penetrate into the seam mass.

Abstract: A packaging structure for assembling to a printed circuit board (PCB) comprises a captive screw having a screw head, a threaded shank and a sleeve; and a fixture pressing against the screw head for a part of the threaded shank to expose from a distal end of the sleeve, and clamping the fixture on the sleeve.

Abstract: A method of manufacturing a stator core including stacking a plurality of teeth into a plurality of stacks, said teeth are obtained from a jigsaw pattern of said teeth, said teeth are substantially identical to each other in size, each said tooth is substantially T-shaped via two arms protruding sideways from a leg, said teeth substantially aligning with each other in each said stack; winding said stacks with a plurality of windings; placing said stacks along a perimeter of a polygonal inner surface of a ferromagnetic tube, said inner surface defining an inner space within said tube, each side of said polygonal inner surface corresponding to each said stack and contacting the bases of said legs of each said stack; inserting a shaft into said inner space, the top surfaces of said arms facing said shaft; vacuum encapsulating said inner space in an epoxy resin; removing said shaft.

Abstract: Method of manufacturing a fused silica crucible, including manufacturing a plurality of carbon electrodes for melting a vitreous silica object to be melted by arc discharge by rubbing the surface of a carbon electrode of the electrodes with a vitreous silica of the same type as the vitreous silica object to be melted, by at least one of: inserting a front end of the carbon electrode into a storage tank storing powdered vitreous silica, by at least one of rotating and reciprocating in an axial direction the storage tank and the carbon electrode relative to each other; rubbing the surface of the carbon electrode by ejecting powdered vitreous silica from a nozzle onto the surface of the electrode; rubbing the surface of the electrode with a vitreous silica grinder; and rubbing the surface of the electrode against a rotating surface of a portion of a fused vitreous silica crucible.

Abstract: A wire stop assembly is provided for a terminal crimping machine that crimps a terminal to a wire. The terminal crimping machine includes a crimping zone. The wire stop assembly includes a wire stop member having a stop surface configured to engage the wire to limit an amount of travel of the wire in the crimping zone. The wire stop member is movable relative to the crimping zone in a floating direction. A biasing mechanism is configured to exert a biasing force on the wire stop. The biasing force provides a resistance to the movement of the wire stop member in the floating direction.