Patents Examined by Minh Trinh
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Patent number: 8745855Abstract: A method for manufacturing an antenna device is provided. The manufacturing method includes forming an antenna circuit so that the resonance frequency of the antenna circuit will be lower than an oscillation frequency of the reader/ writer and affixing a magnetic sheet to an antenna coil via an adhesive. The antenna circuit includes the antenna coil that receives the magnetic field transmitted from the reader/ writer and a capacitor electrically connected to the antenna coil. The magnetic sheet is at a face-to-face position with respect to the antenna coil and is configured to change the inductance of the antenna coil. The adhesive is of a film thickness to change the inductance so that the resonance frequency of the resonance circuit will be coincident with the oscillation frequency depending on the spacing between the antenna coil and the magnetic sheet.Type: GrantFiled: January 30, 2012Date of Patent: June 10, 2014Assignee: Dexerials CorporationInventors: Katsuhisa Orihara, Satoru Sugita, Norio Saito, Masayoshi Kanno
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Patent number: 8745845Abstract: The present disclosure relates to devices and methods for implanting a prosthesis into a heart of a mammal, such as a person. The disclosure includes a prosthesis that acts as a pressure vent between the left and right atria of the heart. The disclosure also includes a mounting tool for mounting the prosthesis onto a loading tool, the loading tool useful for loading the prosthesis onto a device for delivering the prosthesis into the patient's heart. Control devices and methods for using these devices are also disclosed. The intracardiac pressure vents disclosed allow sufficient flow from the left atrium to the right atrium to relieve elevated left atrial pressure and resulting patient symptoms. The devices also limit the amount of flow from the right atrium to the left atrium to minimize the potential for thrombi or other embolic material from entering arterial circulation.Type: GrantFiled: November 24, 2010Date of Patent: June 10, 2014Assignee: DC Devices, Inc.Inventors: Matthew J. Finch, Stephen J. Forcucci, Edward McNamara, Hiroatsu Sugimoto
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Patent number: 8745834Abstract: A method of removing a stator coil (10) from a stator core (12) of an electrical generator, including vibrating an unbonded portion (50) of the coil (10) until a resin bond material (32) between a bonded portion of the coil (46) and a surface (34) of the core (12) fails due to high cycle fatigue to free the coil (10) from the core (12).Type: GrantFiled: April 6, 2012Date of Patent: June 10, 2014Assignee: Siemens Energy, Inc.Inventors: Keegan M. Ford, Benjamin T. Humphries
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Patent number: 8745854Abstract: A method of fabricating a microwave antenna assembly is disclosed. The fabrication method includes providing a proximal portion having an inner conductor and an outer conductor, the inner conductor extending at least partially therein. The method further includes providing a distal portion disposed distally of the proximal portion, with the inner conductor extending at least partially therein. A high strength material may be injected from an inflow slot to an outflow slot of the distal portion such that the material is disposed in-between the inner conductor and a ceramic layer. The material bonds the distal portion and the ceramic layer to the proximal portion while providing mechanical strength to the distal portion.Type: GrantFiled: November 7, 2011Date of Patent: June 10, 2014Assignee: Covidien LPInventor: Kenlyn S. Bonn
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Patent number: 8745851Abstract: A process for fabricating an ultra-low-resistance superconducting joint that has high shielding characteristics. The process includes: corroding copper on the outer surface at the end of a NbTi/Cu superconducting wire to form terminal NbTi superconducting filaments; inserting same number of NbTi superconducting filaments into each through hole of the niobium layer of a Nb/NbTi/Cu multilayer composite rod; pressing at the outside of the Nb/NbTi/Cu multilayer composite rod to combine the Nb/NbTi/Cu multilayer composite rod and NbTi superconducting filaments together to form a joint; and inserting the joint into a YBCO tube, and then filling the YBCO tube with molten bismuth-lead-tin-cadmium (BiPbSnCd) alloy solder to form a superconducting joint with high shielding and low resistance characteristics.Type: GrantFiled: June 30, 2010Date of Patent: June 10, 2014Assignee: Institute of Electrical Engineering, Chinese Academy of SciencesInventors: Qiuliang Wang, Xinning Hu, Shousen Song, Lijian Ding, Luguang Yan
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Patent number: 8745852Abstract: An RFID antenna assembly is made by first adhering a continuous aluminum foil between 1 ?m and 20 ?m thick by an adhesive film to a front face of a mounting layer, then providing on a back face of the mounting layer a film of contact adhesive, and then releasably securing to the mounting-layer back face a backing strip. The foil and the mounting layer but not the backing strip are then punched through so as to punch out antennas from the foil and identical pieces from the mounting layer. Finally the foil and mounting layer are stripped from around the punched-out antennas on the backing strip to leave on the backing strip a row only of the punched-out antennas and the respective pieces of the mounting layer.Type: GrantFiled: June 4, 2008Date of Patent: June 10, 2014Assignee: bielomatik Leuze GmbH & Co. KGInventor: Martin Bohn
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Patent number: 8745848Abstract: A method for forming rotor bar slots in an induction machine rotor includes providing a rotor body having an outer circumference, a central axial axis and a radial axis and forming opposed first and second rotor slot sidewalls having profiles diverging outwardly in opposite directions from the rotor radial axis. The opposed first and second rotor slot sidewalls are formed using a cutting tool having a first rotational axis oriented at a first angle outwardly diverging from the radial axis and with a second cutting tool having a second rotational axis oriented at a second angle outwardly diverging from the radial axis that is opposed from the first angle.Type: GrantFiled: August 30, 2011Date of Patent: June 10, 2014Assignee: Siemens Industry, Inc.Inventor: Nicholas G. Lang
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Patent number: 8739392Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.Type: GrantFiled: June 30, 2009Date of Patent: June 3, 2014Assignee: Intel CorporationInventors: Tod Byquist, Daniel P. Carter
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Patent number: 8739393Abstract: It is an object to provide an electronic component mounting method that makes it possible to assure stable pickup operation even when a dimensional error attributable to a difference in production lot exists in electronic components or carrier tapes. During electronic component mounting adopting a tape splicing technique for splicing a carrier tape 15 already loaded on a tape feeder to a newly loaded carrier tape 15A, when an optical sensor 30 has detected a joint J between the already-loaded carrier tape 15 and the newly-loaded carrier tape 15A, a height measurement device 12 performs measurement of a component pickup height targeted for components P housed in the carrier tape 15A in connection with the tape feeder for which the joint J has been detected. Component pickup height data showing a target lowering height to which pickup nozzles 10a are to be lowered are updated on the basis of the measurement result.Type: GrantFiled: May 11, 2011Date of Patent: June 3, 2014Assignee: Panasonic CorporationInventors: Shinji Yamamoto, Yasuyuki Ishitani
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Patent number: 8739383Abstract: Methods and apparatus for aligning a mirror block with a base plate to form a mirror assembly are disclosed. According to one aspect of the present invention, a method for forming a mirror assembly includes positioning a mirror block in contact with a base plate that has at least one alignment feature, and indexing a portion of an alignment tool with respect to the base plate. The method also includes applying at least a first force by moving the mirror block with respect to alignment feature. A determination is made as to when a first surface of the mirror block is substantially coplanar with a first surface of the alignment feature. The mirror block is coupled to the base plate when the first surface of the mirror block is substantially coplanar with the first surface of the alignment feature.Type: GrantFiled: April 20, 2010Date of Patent: June 3, 2014Assignee: Nikon CorporationInventor: Alton H. Phillips
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Patent number: 8739390Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.Type: GrantFiled: December 13, 2009Date of Patent: June 3, 2014Assignee: Massachusetts Institute of TechnologyInventors: Vladimir Bulovic, Corinne Evelyn Packard, Jennifer Jong-Hua Yu, Apoorva Murarka, LeeAnn Kim
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Patent number: 8732925Abstract: An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.Type: GrantFiled: April 10, 2012Date of Patent: May 27, 2014Assignee: Yen Technologies, LLCInventor: William S. H. Cheung
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Patent number: 8732941Abstract: In order to simplify the assembly of printed board connectors, there is provided an assembly aid that features one or more recesses in accordance with the dimensions of the printed board connectors, wherein one or more printed board connectors to be assembled on a printed board can be inserted into said recesses. The contact spacing on the printed board corresponds with the arrangement of the printed board connectors in the assembly aid such that an exact alignment of the printed board connectors is realized. The assembly aid remains on the printed board until the soldering process is completed, wherein this prevents, for example, flotation of SMD components.Type: GrantFiled: March 3, 2010Date of Patent: May 27, 2014Assignee: Harting Electronics GmbHInventors: Christian Schuetz, Guenter Pape
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Patent number: 8734709Abstract: An apparatus for converting a refurbishing machine into a reforming machine. The apparatus reforms a portion of a plastic container using induction heating. The apparatus includes a reform heating assembly that achieves a temperature of above about 500° F., heats the container via radiant and convection heating without contacting the container, and has a power and thermocouple connection to a first controller. The apparatus also includes a reform cooling assembly that has a forming die which contacts and reforms the container portion, a support housing a Peltier thermoelectric cooler, a heat sink facilitating heat transfer away from the forming die, and a power and thermocouple connection to a second controller. The method includes the steps of replacing heating assemblies of the refurbishing machine with the reform heating assembly and the reform cooling assembly, respectively, using the existing equipment utilities of the refurbishing machine.Type: GrantFiled: April 6, 2010Date of Patent: May 27, 2014Assignee: Graham Packaging Company, L.P.Inventor: Garrett R. Pennington
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Patent number: 8732946Abstract: A method for coupling ends of two insulated conductors includes coupling an end portion of a core of a first insulated conductor to an end portion of a core of a second insulated conductor. At least a part of the end portions of the cores are at least partially exposed. Electrically insulating material is placed over the exposed portions of the cores. A sleeve is placed over end portions of the two insulated conductors to be coupled. The sleeve includes one or more raised portions. The end portions include the exposed portions of the cores. The sleeve is coupled to jackets of the insulated conductors. The raised portions of the sleeve are mechanically compressed until the raised portions of the sleeve have a diameter substantially similar to a remainder of the sleeve. The compression of the raised portions of the sleeve compacts the electrically insulating material inside the sleeve.Type: GrantFiled: October 7, 2011Date of Patent: May 27, 2014Assignee: Shell Oil CompanyInventors: Patrick Silas Harmason, Charles D'Angelo, III
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Patent number: 8726487Abstract: This invention describes a process flow, method and apparatus to assemble triple IG units without contaminating the center glass lite. A non-contact vacuum pad is used to lift a glass lite off from a horizontal or vertical support that conveys it from a glass washer to an assembly station. Each of multiple pads has a capacity to lift approximately seven to ten pounds. Use of multiple pads per glass sheet or lite allows lites having, dimensions up to 70 by 100 inches (assuming glass thickness of one quarter inch) to be assembled.Type: GrantFiled: April 22, 2010Date of Patent: May 20, 2014Assignee: GED Integrated Solutions, Inc.Inventors: William Briese, John Grismer, Timothy B. McGlinchy
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Patent number: 8727566Abstract: A system and method of converting a light fixture from a fluorescent light fixture to an LED light fixture. Originally, the fluorescent light fixture has a sheet metal troffer, a fluorescent light power supply, and receptacles for retaining fluorescent tube lights. The conversion is accomplished in the following manner. A circuit board assembly is provided that has a plurality of LEDs mounted thereon. An LED power supply is also provided, as is thermally conductive adhesive. The fluorescent light power supply is removed from the light fixture and the LED power supply is installed in its place. The circuit board assembly is directly mounted to the sheet metal troffer with thermally conductive adhesive. The circuit board assembly is then connected to the LED power supply and the light fixture is ready for use.Type: GrantFiled: September 26, 2011Date of Patent: May 20, 2014Inventor: Oliver Szeto
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Patent number: 8720042Abstract: A stator manufacturing method which manufactures an insulated conductor coil and mounts this coil to the core, the insulated conductor coil being formed by deforming an insulated conductor into a shape having rectilinear in-slot conductor sections and coil end sections having bent sections, the conductor having an enamel layer formed on the outer periphery thereof and also having an extruded resin coating layer formed on the outer periphery of the enamel layer, comprises: a first step of forming the conductor coil by deforming the conductor to form the bent sections while the coating layer of the conductor is in a non-crystalline resin state; a second step of heating the extruded resin coating layer of the conductor coil to change into a crystalline resin state to a temperature higher than or equal to the glass transition temperature; and a third step of mounting the conductor coil to the core.Type: GrantFiled: June 23, 2010Date of Patent: May 13, 2014Assignee: Toyota Jidosha Kabushiki KaishaInventors: Hideaki Kimura, Hiroaki Urano
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Patent number: 8720040Abstract: A method of manufacturing a hollow waveguide including a metal pipe and a hollow region formed inside of the metal pipe includes pressure-bonding metal pipes each of which includes a metal material different from each other to form a metal-clad pipe including an inside metal layer and an outside metal layer, and polishing a surface of the inside metal layer.Type: GrantFiled: August 29, 2008Date of Patent: May 13, 2014Assignee: Hitachi Metals, Ltd.Inventors: Akihito Hongo, Tadashi Koike
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Patent number: 8720041Abstract: A method of assembling an induction rotor includes inserting a plurality of conductor bars into a stack of disks whereby distal ends of the conductor bars project from respective axial ends of the stack, placing first and second end rings onto the respective axial ends of the stack so that the ends of the conductor bars fit into slots in the respective end rings, and compressing the slots against the conductor bars by impacting at least one of the end rings. The method may include selectively adjusting an amount of end ring material being compressed by varying heights of respective areas of a top surface of the end ring and/or selectively adjusting an amount of end ring material being compressed by varying heights of respective areas of an impacting surface.Type: GrantFiled: May 1, 2012Date of Patent: May 13, 2014Assignee: Remy Technologies, LLCInventors: Andrew Meyer, Phil Tooley, Kevin Young