Abstract: Method for producing a laminated ceramic electronic component including: forming a laminated body by layering and press-bonding a plurality of ceramic green sheets to become a protective layer and a plurality of the ceramic green sheets with metal paste printed thereon, forming an extended part by printing and drying a conductive paste for the extended part on the main face of the laminated body, forming a laminated ceramic element by cutting off the laminated body with the extended part formed and separating the laminated body into fragments, and forming a curled part by applying a conductive paste for the curled part on said end face of said laminated ceramic element. In the step of forming the laminated body, the laminated body is press-bonded so that the main face of the lead part of the laminated body is positioned lower than the main face of the function part.

Abstract: The present invention relates to a positioning device for positioning an element to be crimped in a crimping tool, for example a wire end sleeve or an electrical connecting plug. The invention further relates to a crimping tool for crimping a connecting element to be situated in a pressing axis. To allow the element that will be crimped to be brought into the pressing axis, the positioning device has a retaining unit for retaining, about its periphery, the element that will be crimped. The retaining unit has a retaining opening which encompasses the pressing axis coaxially. The positioning device further permits the positioning of the element that will be crimped within the pressing axis, in order, in particular, to ensure the necessary insertion depth of the element to be crimped in the crimping tool. For this purpose, the positioning device of the invention has an axial stop, with which the position in the pressing axis of the element to be crimped can be defined.

Abstract: A method of chip mounting uses a manipulator to mount an electronic component in a vertically upward direction onto a downwardly-facing mounting surface of a printed circuit board held by a holding bed. The holding bed is located above the manipulator or sidewise relative to the manipulator for mounting by the manipulator onto the downwardly-facing mounting surface of the printed circuit board.

Abstract: A method of constructing a linear drive motor assembly is disclosed. In accordance with the method, a support plate and a platen with a plurality of teeth are provided. A honeycomb core comprising a commercially available, off-the-shelf honeycomb material is provided. The honeycomb core has a plurality of cells arranged in a planar array where the plurality of cells is defined by walls extending in planes substantially perpendicular to the planar array. The support plate is directly secured to one side of the planar array. The platen is secured directly to the other side of the planar array. A forcer having a motor stack is magnetically coupleable to the platen to form a linear drive motor.

Abstract: A system for removably securing a component to a base. The system includes a plurality of attachment means, each having a first attachment mechanism fixedly secured to the base, and a second attachment mechanisms fixedly secured to the component. Each of the first attachment mechanisms is configured to correspond to, and engage with, one of the second attachment mechanisms to securely fasten the component to the base. The plurality of first attachment mechanisms and the plurality of second attachment mechanisms are configured such that a gap is formed between the component and the base, and a void is formed between the plurality of attachment means when the attachment mechanisms are engaged, to create a leverage point directly above the void that allows the attachment mechanisms to at least partially disengage and the component to be removed from the base when a force is applied to the leverage point.

Abstract: A reaction container for manufacturing a capacitor element includes a container which accommodates electrolytic solution therein, a partitioning frame which can partition the inside of the container into a plurality of individual chambers, negative electrode members individually arranged in each of the individual chambers, and a constant-current source electrically connected to the cathode members. A passage, which enables movement of the electrolytic solution between each individual chamber and at least one individual chamber of the individual chambers adjacent to each individual chamber, is provided in a manner such that the passage can be opened and closed.

Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.

Abstract: An apparatus for manufacturing electronic parts is provided. The apparatus includes a head unit installed on a main body and configured to move up and down, a nozzle unit installed on the head unit and configured to move up and down, and a positioning unit sequentially displacing the head unit and the nozzle unit to a position where the electronic parts are on standby to suction the electronic parts using the nozzle unit. Thus, when the head unit is used to suction the electronic parts on standby at a standby position of the electronic parts, the head unit and the nozzle unit installed on the head unit are sequentially lowered, so that it is possible to relieve an impact occurring when the electronic parts are suctioned to the ends of nozzles.

Abstract: A workpiece transfer apparatus includes a nozzle unit and an imaging unit. The nozzle unit includes a tubular body, a suction hole opening at one end of the tubular body and an end face member of a transparent body sealing the other end of the tubular body. The imaging unit captures images of first patterns for positioning that are located on an upper surface of a workpiece. The size and shape of the suction hole fits within an outline of the upper surface of the workpiece. The end face member of the transparent body maintains a negative pressure inside the cylindrical body and permits optical penetration for the imaging unit. The imaging unit captures the image of the first pattern for positioning of the workpiece while the imaging unit views a suctioned surface of the workpiece through the transparent body and the suction hole.

Abstract: A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label. The system includes a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules. The stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch is disposed above the stamping opening A support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate. A suction device is provided for holding the RFID chip module on the stamping punch. A heating device for melting solder is present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.

Abstract: The present disclosure includes methods of forming capacitive sensors. One method includes forming a first electrode array of the capacitive sensor on a first structure. Forming the first electrode array can include: forming a dielectric material on a substrate material; forming an electrode material on the dielectric material; removing portions of the electrode material to form a number of electrodes separated from each other; and removing at least a portion of the dielectric material from between the number of electrodes. The method can include bonding the first structure to a second structure having a second electrode array of the capacitive sensor formed thereon such that the number of electrodes of the first electrode array face a number of electrodes of the second electrode array.

Abstract: A method for manufacturing a resonator is presented in the present application. The method includes providing a handle substrate, providing a host substrate, providing a quartz substrate comprising a first surface opposite a second surface, applying interposer film to the first surface of the quartz substrate, bonding the quartz substrate to the handle substrate wherein the interposer film is disposed between the quartz substrate and the handle substrate, thinning the second surface of the quartz substrate, removing a portion of the bonded quartz substrate to expose a portion of the interposer film, bonding the quartz substrate to the host substrate, and removing the handle substrate and the interposer film, thereby releasing the quartz substrate.

Abstract: In one aspect of the invention, a system for exchanging a milling chamber comprises a vehicle comprising a milling chamber supported by the underside of the vehicle. The underside comprises a track that interfaces with a guide of the milling chamber. The track and guide are configured to accommodate lateral movement of the milling chamber with respect to a length of the vehicle.

Abstract: A substrate accommodating tray pallet has a substrate in a horizontal state, includes openings for inserting substrate removal tools for raising the substrate, and is used for transferring substrate accommodating trays which can be vertically stacked, wherein: the substrate accommodating trays are to be mounted on an upper surface; and substrate removal tool insertion openings for inserting the substrate removal tools are positioned so as to oppose openings of the mounted substrate accommodating trays.

Abstract: A method of adjustment during manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the electrical signal between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.

Abstract: A seal protector assembly is provided. The seal protector assembly includes a cavity for encasing a seal. A plug or cap is removably attached to the protector seal. After shipment of the transmission, the plug or cap is removed. Once any potential damage to the seal during assembly has passed, the protector is then removed.

Abstract: An interior permanent magnet (IPM) rotary machine comprises a rotor comprising a rotor yoke having bores and a plurality of permanent magnet segments disposed in the bores of the rotor yoke, each permanent magnet segment consisting of a plurality of magnet pieces. The rotor is assembled by inserting the plurality of unbound magnet pieces in each bore for stacking the magnet pieces, and fixedly securing the stacked magnet pieces in the bore.

Abstract: The present invention relates to a method of establishing a press fit of a component with a mounting hole on a shaft. It aims at providing a method that allows exact positioning of the component to be mounted on the shaft as well as a flexible way of use. To this end, the method is so conceived that an inner surface of the mounting hole of the component and/or a circumferential surface of the shaft is/are partially fused so that calotte-shaped projections protruding beyond the inner surface of the mounting hole and/or the circumferential surface of the shaft will form, that the component and/or the shaft is/are subsequently cooled, so that the calotte-shaped projections will solidify, and that the component is then slipped onto the shaft until the mounting hole is positioned in a fastening area of the shaft. In addition, the present invention also relates to components for establishing a press fit of a shaft-hub connection.

Abstract: A method for manufacturing an antenna device may include a first step of forming an antenna circuit so that the resonance frequency of the antenna circuit will be lower than an oscillation frequency of the reader/writer. The antenna circuit includes an antenna coil that receives the magnetic field transmitted from the reader/writer and a capacitor electrically connected to the antenna coil. The manufacturing method also includes a second step of affixing a magnetic sheet to the antenna coil via an adhesive. The magnetic sheet is at a face-to-face position with respect to the antenna coil and is configured to change the inductance of the antenna coil. The adhesive is of a film thickness to change the inductance so that the resonance frequency of the resonance circuit will be coincident with the oscillation frequency depending on the spacing between the antenna coil and the magnetic sheet.

Abstract: Disclosed herein is a method of fabricating an antenna in which a flexible stamp is formed from a first wafer, the first wafer transferring a pattern to the flexible stamp, in which an antenna substrate is shaped into a three-dimensional contour with a second mold, in which the flexible stamp is positioned in the second mold to deform the flexible stamp into the three-dimensional contour, and in which a metallic layer on the flexible stamp is cold welded to create a set of antenna traces on the antenna substrate in accordance with the pattern. The antenna traces may then be electroplated.