Abstract: Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.

Abstract: The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a first cutting tool such that the assembly is cut through only partially along cutting lines in the thickness direction thereof, and transporting the partially severed assembly with a manipulator along a second cutting tool such that the cutting lines are severed almost completely. The invention also relates to a device for separating electronic components, and to a separated electronic component obtainable with the method.

Abstract: A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Abstract: Firstly, a flat conductor raw wire is formed in a rectangular cross-section and bent in a continuous meandering pattern in a same plane to include in-slot wire portions arranged in each slot of the stator core, coil-end wire portions arranged as a coil end outside the slots, and bent portions joining the in-slot wire portions and the coil-end wire portions. Thereafter, in a setting step, the bent portions located at the opposite ends of the in-slot wire portion are grasped by a pair of grasping tools and the in-slot wire portion is grasped by a twisting jig. Next, in a processing step, the bent portions are twisted and bent into crank-shape by displacing a predetermined axis to a predetermined direction while rotating the twisting jig about the axis. The flat conductor is obtained by performing the setting step and the processing step each of the in-slot wire portions.

Abstract: An electrical machine includes a stator and a rotor. The stator has a central opening that is configured to receive the rotor. The rotor includes a generally cylindrical first section comprising a first material mounted on an axially extending shaft within the central opening. The rotor further includes a second section having a second material of a predetermined thickness that is coated directly on at least a portion of the first section. The second material has a higher electrical conductivity relative to the first material.

Abstract: A method manufactures a capacitor having polycrystalline dielectric layer between two metallic electrodes. The dielectric layer is formed by a polycrystalline growth of a dielectric metallic oxide on one of the metallic electrodes. At least one polycrystalline growth condition of the dielectric oxide is modified during the formation of the polycrystalline dielectric layer, which results in a variation of the polycrystalline properties of the dielectric oxide within the thickness of said layer.

Abstract: The disclosed method produces a stator or rotor having a distributed wave winding, in which the wires are associated in pairs lying with straight segments in the same slots. Head portions of two successive straight segments of each wire of a pair protrude from opposite ends of slots. For forming two wire groups, a plurality of coil windings are simultaneously created by winding up n parallel wires with intermediate spacing onto a striplike former that is rotatable about its longitudinal axis. From each of the parallel wires one straight segment and one end turn are doubled by being bent over with the wire length of a head portion, and then head portions are formed and the wires interlaced. Finally, the two wire groups are wound onto one another and thereby intertwined with one another, and then introduced as an entire intertwined wave winding strand into the stator or rotor slots.

Abstract: A connection portion of a z-axis interconnector is assembled into contact with a plurality of aligned vias in a corresponding plurality of stacked printed circuit boards by gripping and pulling a leader portion of the interconnector connected to the connection portion, to move the interconnector into the final position with the connection portion contacting the aligned vias. The leader portion is severed from the connection portion after the interconnector is moved into the final position. A single pulling and cutting tool which accomplishes these functions preferably does so by a single pinch and cut device having opposing blades which partially penetrate into the leader portion to grip the leader portion, which fully penetrated through the leader portion to sever the leader portion, and which are moved toward and away from the plurality of stacked printed circuit boards to pull the interconnector and to reposition for severing the leader portion.

Abstract: A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.

Abstract: A method of stranded electrical wire connection involves stripping the insulation off the ends of stranded wire, inserting a metallic barrel member over the ends of the wire, applying ratcheting pressure to the barrel member to compress the barrel member over each end of the stranded wires, and then applying constant, irreversible ratcheting pressure to the wire containing barrel to substantially eliminate the spaces between the strands and to form a permanent barrel to wire connection between the lengths of wire. A shrink tube with an inner layer of adhesive is positioned over the permanent connection and the shrink tube, with its layer of adhesive, is heated, thus substantially eliminating any space between the shrink tube and the permanent connection. Utilizing the method of the present invention results in a permanent, waterproof connection between the stranded wire which eliminates all expansion and contraction within the permanent connection during use.

Abstract: A vacuum nozzle control apparatus includes a nozzle module having a vacuum hole, a vacuum providing module configured to provide a vacuum to the vacuum hole through a vacuum line, and a vacuum control module configured to selectively form the vacuum in the vacuum hole through the vacuum line, or release the vacuum formed in the vacuum hole through a release line branched off from the vacuum line to expose the vacuum hole to air.

Abstract: A method of manufacture of antenna electronics attachment is disclosed. A nutplate is coupled to a mounting plate via a plurality of embedded fastening structures such that mechanical-electronic coupling means allow in-service change-out of an electronic component coupled to the nutplate.

Abstract: A method of making a touch-responsive capacitive device includes providing a transparent substrate and forming anisotropically conductive first and second electrodes extending in corresponding first and second orthogonal length directions over the substrate. Anisotropically conductive first and second electrodes each with electrically connected micro-wires are formed on opposing sides of the transparent substrate. The anisotropically conductive first and second electrodes extend in corresponding first and second length directions.

Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.

Abstract: Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

Abstract: A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.

Abstract: A continuous housing (100) and integral antenna (102) and method (300) of forming a housing (100) and integral antenna (102), including: forming (305) an extrusion housing with a side opening defining a pocket configured to receive electrical components; removing (310) material of the extrusion housing in proximity to a wall portion of the extrusion housing; and forming (315) a desired antenna construction integral to the extrusion housing. Advantageously, the continuous housing (100) can form a wireless communication device, which is particularly adapted for mass production. This arrangement is adapted to allow a customer to design the look and feel of an electronic device.

Abstract: A rivet tool capable of measuring size of blind rivet has a body and multiple interchangeable nosepieces. The body further has multiple rivet body measuring holes formed through the body. Diameters of the rivet body measuring holes match rivet bodies of corresponding blind rivets. Accordingly, the rivet tool of the present invention employs the rivet body measuring holes to measure a size of a rivet body of a blind rivet to rapidly, conveniently and correctly obtain a size of a rivet body of a blind rivet and further to correctly choose a nosepiece with a matching size.

Abstract: A method for manufacturing a transmission electron microscope (TEM) micro-grid is provided. A support ring and a sheet-shaped carbon nanotube structure precursor are first provided. The sheet-shaped carbon nanotube structure precursor is then disposed on the support ring. The sheet-shaped carbon nanotube structure precursor is cut to form a sheet-shaped carbon nanotube structure in desired shape. The sheet-shaped carbon nanotube structure is secured on the support ring.

Abstract: A pair of connector removal pliers includes a first arm and a second arm which is pivotably connected to the first arm by a pin. A positioning member and a pressing member are respectively connected to the first and second arms. The positioning member has a rough surface and the pressing member has a protrusion extending therefrom which extends toward the positioning member. By operating two handles of the first and second arms to position one of two connectors between the positioning member and the pressing member, the technician can easily pull the other connector to separate the two connectors.