Patents Examined by Minh Trinh
-
Patent number: 8635760Abstract: In a method for producing a commutator ring for a commutator of an electric machine, the lamellae of a commutator ring are formed of an electrically conductive, deformable band material, and they have at least one recess running in the longitudinal direction of the band material, before a desired number of the formed lamellae are closed to form the commutator ring. After the closing of the lamellae to form the commutator ring, a reinforcing ring made of an electrically nonconductive, deformation-resistant material is introduced into the recess and is fixed in the recess by plastic deformation of the lamellae of the commutator ring.Type: GrantFiled: October 28, 2008Date of Patent: January 28, 2014Assignee: Robert Bosch GmbHInventors: Olaf Pflugmacher, Christian Anders, Wolfgang Hecht, Normen Sach
-
Patent number: 8635761Abstract: A method for printing an electrical conductor on a substrate has been developed. In the method, a reverse image of the electrical conductor pattern is printed on a substrate with an electrically non-conductive material to form a second pattern that exposes a portion of the surface area of the substrate. The entire surface area of the substrate is then covered with an electrically conductive material. The non-conductive material of the reverse image electrically isolates the electrically conductive material covering the reverse image from the electrically conductive material covering the second pattern.Type: GrantFiled: September 19, 2011Date of Patent: January 28, 2014Assignee: Xerox CorporationInventor: Yiliang Wu
-
Methods for manufacturing a radio frequency identification tag without aligning the chip and antenna
Patent number: 8635762Abstract: A method for attaching antennae to RFID tags is disclosed. Included is the use of RFID tags having asymmetrical interconnect system for one or more antennae, such that virtually any rotational orientation of the RFID tag will result in a successful antennae attachment. Two oversized and “L” shaped gold-bumped holes can be arranged on the same side of the ship in an opposing action, such that at least one axis of symmetry is formed. Accordingly, virtually all rotational orientations of the chip are then acceptable when attaching a pair of opposing pole antenna leads. Alternatively, a pair of poles can be located on opposing chips surfaces, such that antenna substrates can be attached to both the top and bottom of the chip to form a product “sandwich”, whereby the rotational orientation of the chip is irrelevant at an antenna attachment step.Type: GrantFiled: September 20, 2006Date of Patent: January 28, 2014Assignee: National Semiconductor CorporationInventors: Nikhil V. Kelkar, Sadanand R. Patil, Cheol Hyun Han -
Patent number: 8635766Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.Type: GrantFiled: December 27, 2010Date of Patent: January 28, 2014Assignee: Yamaha Hatsudoki Kabushiki KaishaInventors: Naoki Hanamura, Manabu Ihara
-
Patent number: 8631552Abstract: A plate joint for joining two plates together includes a first plate and a second plate, with each of the first plate and second plate having a first edge and an opposite and generally parallel second edge. The first plate and second plate are connected together in a generally orthogonal orientation relative to each other with a finger joint defined by a notch in each plate which interlock with each other. The first edge of the first plate and the first edge of the second plate each have a groove therein which axially align with each other in and end-to-end manner. A locking pin is press fitted into the grooves in each of the first plate and the second plate.Type: GrantFiled: December 20, 2010Date of Patent: January 21, 2014Assignee: SGL Carbon SEInventor: Jonathan Kuntz
-
Patent number: 8631549Abstract: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.Type: GrantFiled: March 18, 2011Date of Patent: January 21, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Kenichi Kawasaki, Makoto Ogawa, Shigeyuki Kuroda, Shunsuke Takeuchi, Hideyuki Kashio
-
Patent number: 8631559Abstract: A method of assembling an induction rotor includes inserting a plurality of conductor bars into a stack of disks, placing first and second end rings onto respective axial ends of the stack, thereby inserting ends of the conductor bars into corresponding slots in the respective end rings, compressing the slots against the conductor bars by impacting the end rings, and applying an electric current through the end rings and conductor bars. The compressing and the applying of current bond end rings and conductor bars together by simultaneous mechanical and electrical heat.Type: GrantFiled: May 1, 2012Date of Patent: January 21, 2014Assignee: Remy Technologies, LLCInventors: Andrew Meyer, Phil Tooley, Kevin Young
-
Patent number: 8627562Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. The base further incorporates a fixed anvil for engaging a third length of connector. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A connector seating holder is formed in the front of the tool. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head and a slide rod. A lock nut is threaded on the push head and is engageable with the slide rod to prevent rotation of the push head.Type: GrantFiled: July 29, 2011Date of Patent: January 14, 2014Assignee: IDEAL Industries, Inc.Inventors: Robert W. Sutter, Stephen J. Skeels
-
Patent number: 8627561Abstract: A lamp socket assembly tool includes an engaging end configured to engage a lamp socket inserted in an opening of a lamp housing, which may be a vehicle lamp housing. The tool includes a driving end operatively connected to the engaging end and configured to receive and transmit an axial and rotating force to the engaging end to assemble or disassembly a socket engaged by the tool relative to the housing. The tool includes a passage for receiving a connector portion of the socket such that the tool is not in contact with a connector interface. The passage may define an aperture through which a connector wire attached to the socket may exit or move freely during rotation of the socket by the tool. The engaging interface may substantially conform to a socket interface defined by a standardized filament lamp, such as an ECE H9 or H11 socket.Type: GrantFiled: February 29, 2012Date of Patent: January 14, 2014Assignee: GM Global Technology Operations LLCInventor: Jay H. Ovenshire
-
Patent number: 8627556Abstract: An embodiment of the present invention provides a method, comprising breaking an electrode into subsections with signal bus lines connecting said subsections and a solid electrode to improve Q.Type: GrantFiled: January 27, 2009Date of Patent: January 14, 2014Assignee: BlackBerry LimitedInventor: James Martin
-
Patent number: 8621741Abstract: A pre-assembled pipe coupling for joining and sealing two grooved-ended pipe segments without disassembling the coupling is disclosed. The coupling has a housing with upper and lower arcuate housing segments and left and right bridge segments. Each bridge segment has at least one set of dihedrally angled faces that engage corresponding faces each in the upper and lower housing segments. Drawing the upper and lower segments inwardly together along a first axis, presses each bridge segment inward along a second axis roughly tangential to the first axis. All segments are loosely pre-assembled with bolts and nuts into a coupling and all segments each have radially inwardly projecting lands that mate with end grooves in the pipes to be joined. The coupling also has a one-piece circular sealing gasket that has an inward circumferential and centrally positioned pipe stop that has an inner diameter smaller than an outer diameter of the pipes to be joined.Type: GrantFiled: November 29, 2010Date of Patent: January 7, 2014Inventor: Howard Hagiya
-
Patent number: 8621730Abstract: In a capacitor producing method, a bottom electrode, a thin-film dielectric, and a top electrode are deposited on a substrate so as to form a capacitor, wherein defects including particles and electrical short-circuits between the bottom electrode and the top electrode are detected before the capacitor is divided into capacitor cells. Next, defects such as particles and electrical short-circuits between the bottom electrode and the top electrode are removed before the capacitor is divided into capacitor cells.Type: GrantFiled: February 12, 2010Date of Patent: January 7, 2014Assignee: NEC CorporationInventors: Akinobu Shibuya, Koichi Takemura, Takashi Manako
-
Patent number: 8615884Abstract: A method of manufacturing a rolling bearing device which can improve operational efficiency and can enhance productivity thereof is provided. The method includes the steps of: applying an adhesive agent to fitting portions formed between inner rings of two rolling bearings which are arranged coaxially in a spaced-apart manner in an axial direction and a shaft which is fitted in the inner rings and fitting portions formed between outer rings of two rolling bearings and a sleeve which is fitted on the outer rings; bringing the inner rings and the shaft into fitting engagement and the outer rings and the sleeve into fitting engagement respectively; and welding, in a state where the inner rings to which the adhesive agent is applied in the adhesive agent applying step are brought close to each other due to pushing of the inner rings in the axial direction, the pushed inner rings to the shaft by laser welding using laser power which does not generate thermal deformation of the pushed inner rings.Type: GrantFiled: September 23, 2010Date of Patent: December 31, 2013Assignee: Seiko Instruments Inc.Inventors: Takayuki Kosaka, Kenji Suzuki
-
Patent number: 8607445Abstract: A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor “core” results. This “core” may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art.Type: GrantFiled: June 14, 2012Date of Patent: December 17, 2013Assignee: Endicott Interconnect Technologies, Inc.Inventors: Rabindra N. Das, Frank D. Egitto, John M. Lauffer, How T. Lin
-
Patent number: 8607424Abstract: A method and apparatus for a reverse metal-insulator-metal (MIM) capacitor. The apparatus includes a lower metal layer, a bottom electrode, and an upper metal layer. The lower metal layer is disposed above a substrate layer. The bottom electrode is disposed above the lower metal layer and coupled to the lower metal layer. The upper metal layer is disposed above the bottom electrode. The upper metal layer comprises a top electrode of a metal-insulator-metal (MIM) capacitor.Type: GrantFiled: March 11, 2011Date of Patent: December 17, 2013Assignee: Cypress Semiconductor Corp.Inventors: Vladimir Korobov, Oliver Pohland
-
Patent number: 8607436Abstract: A method for terminating and winding coils of a core (20) of a dynamo electric machine. The coils being formed from at least an electric wire (W) and the core (20) having a longitudinal axis (20?). The coils (19) are wound by relatively moving a wire dispenser (21) with respect to a core with relative motions of translation and rotation; at least a stretch of wire extends from the coil and the stretch of wire is provided with a portion (W4) for a termination connection to a termination structure (22) of the core (20) such as a tang. The method avoids waste cut wire in the apparatus. The core is provided with a groove (120) at an end to receive at least a wire in the path of the wire for the termination of the coils. The apparatus comprises a wire deflector positioned adjacent the end of the core, where the groove (120) is located, in order to intercept and align the wire with the groove (120).Type: GrantFiled: April 28, 2010Date of Patent: December 17, 2013Assignee: ATOP S.p.A.Inventors: Massimo Ponzio, Maurizio Mugelli
-
Patent number: 8601658Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.Type: GrantFiled: September 29, 2011Date of Patent: December 10, 2013Assignee: Massauchusetts Institute of TechnologyInventors: Vladimir Bulovic, Corinne Evelyn Packard, Jennifer Jong-Hua Yu, Apoorva Murarka, LeeAnn Kim
-
Patent number: 8602094Abstract: A method facilitates transmission of electric signals across well components which move relative to each other in a wellbore environment. The method utilizes well components which are movably, e.g. rotatably, coupled to each other via one or more conductive bearings. Each conductive bearing has a conductive rolling element which enables relative movement, e.g. rotation, between the well components while simultaneously facilitating transmission of electric signals through the bearing. The method also involves coupling portions of the bearing to each of the well components, and those bearing portions may be connected with electric leads to enable flow of electric signals through the bearing during operation of the system downhole.Type: GrantFiled: September 7, 2011Date of Patent: December 10, 2013Assignee: Schlumberger Technology CorporationInventor: Joachim Sihler
-
Patent number: 8601677Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.Type: GrantFiled: March 2, 2012Date of Patent: December 10, 2013Assignee: International Business Machines CorporationInventors: Fuad E. Doany, Andrew D. Perez, Niranjana Ruiz, Lavanya Turlapati
-
Patent number: 8595911Abstract: An extraction device for removing a vehicle fastener includes a housing, a body, and cam members. The housing has a camming surface and the body is slidably connected to the housing. The cam members are rotatably connected to the body. Slidable movement of the body and the housing relative to one another causes engagement between the camming surface of the housing and the cam members to cause the cam members to rotate. This rotation of the cam members results in the vehicle fastener being unfastened.Type: GrantFiled: March 30, 2010Date of Patent: December 3, 2013Assignee: Honda Motor Co., Ltd.Inventors: Jason Hendren, Deron Payne