Patents Examined by Minh Trinh
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Patent number: 8720045Abstract: A component mounting device which is provided with a transport unit which has a transport region and transports a substrate in the transport region; a plurality of supply regions which are lined up along the transport direction of the substrate due to the transport unit and are able to supply each component; a control unit which sets a mounting region which is a region where the component is mounted in the transport region of the transport unit according to the disposing of the supply region of the component which is necessary for the substrate out of the plurality of supply regions; and a mounting unit which takes out the component which is necessary for the substrate from at least one supply region out of the plurality of supply regions and performs mounting the component on the substrate in the mounting region which has been set.Type: GrantFiled: March 12, 2012Date of Patent: May 13, 2014Assignee: Sony CorporationInventor: Takeshi Nakamura
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Patent number: 8713776Abstract: An installation tool and method are disclosed for installing a combustion liner within a combustor. The installation tool comprises a frame and a pusher block. The frame includes a substantially horizontal member and a plurality of side members. The pusher block is disposed between the side members and may be configured to push against the combustion liner.Type: GrantFiled: April 7, 2010Date of Patent: May 6, 2014Assignee: General Electric CompanyInventor: John William Herbold
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Patent number: 8713788Abstract: Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).Type: GrantFiled: August 8, 2011Date of Patent: May 6, 2014Assignee: Microfabrica Inc.Inventors: Elliot R. Brown, John D. Evans, Christopher A. Bang, Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Morton Grosser
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Patent number: 8707548Abstract: An electronic component mounting apparatus includes a head unit, component supply device, camera unit, and controller controlling the head unit and component supply device. The component supply device has a holder holding electronic component accommodating tapes, each having storage cells arranged in a row, the storage cells storing electronic components, and a feeder forwarding the electronic component accommodating tapes and moving the storage cells to a suction area where the electronic component can be suctioned by the nozzle. The camera unit is fixed to a head support, and captures an image of the suction area. The controller analyzes the image of the suction area obtained by the camera unit. When the controller determines that a portion of the electronic component accommodating tape in the suction area is a spliced portion based on a result of the analysis, the controller determines that the electronic component accommodating tape is changed.Type: GrantFiled: May 22, 2012Date of Patent: April 29, 2014Assignee: Juki CorporationInventor: Tomotaka Abe
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Patent number: 8712678Abstract: Provided is a work measuring method by which a deviation quantity of a work measuring point from a reference position can be measured in a short time. A work surface is set as a reference point when the measuring point is positioned at the reference position, and a distance from a photographing device to a reference surface is set as a reference distance. A deviation quantity of the measurement point in a direction intersecting a photographing direction on the reference surface is measured by the photographing device, and a deviation quantity of the measuring point in the photographing direction is measured by a laser distance sensor. Then, based on the deviation quantity measured by the photographing device, the deviation quantity measured by the laser distance sensor, and the reference distance, a deviation quantity of the measuring point in a direction intersecting the photographing direction is calculated.Type: GrantFiled: March 23, 2009Date of Patent: April 29, 2014Assignee: Honda Motor Co., Ltd.Inventors: Mitsugu Takahashi, Takafumi Murakoshi, Masaru Maruo, Atsushi Osada, Hidetoshi Takahashi, Takao Shibayama
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Patent number: 8710399Abstract: The invention provides a device for producing a connection grid with an integrated fuse. The device includes a means for supporting the connection grid, a laser head, and a nozzle for supplying fuse wire. The means for supporting the connection grid is a support having a housing that is suitable for receiving a portion of the fuse in the space formed between two symmetrical arms of the connection grid. The support having an overall shape of a hollow half-cylinder, by a curved base and two lateral ribs standing on the base, and an upper surface of which is turned down by chamfering of the housing side. The laser head and nozzle are mechanically connected to a system of robotized shafts.Type: GrantFiled: September 30, 2008Date of Patent: April 29, 2014Assignee: Tyco Electronics France SASInventor: Alain Bednarek
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Patent number: 8701278Abstract: A device is provided to attach a connector having an internally threaded base and external threads to a cable having a casing. The device includes a body having a bore therethrough. At least a portion of the bore is threaded and the external threads on the connector are threaded into the threads of the bore until a stop surface in the bore is engaged by a portion of the connector. The device may then be turned to thread the base onto the casing of the cable.Type: GrantFiled: February 17, 2011Date of Patent: April 22, 2014Assignee: PDS Electronics, Inc.Inventor: Edward L. Merical
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Patent number: 8701275Abstract: A surface mounting apparatus includes a mounting head which is movable in X and Y directions and which mounts an electronic component on a positioned board, and a board recognizing camera is fixed to a base and which moves integrally with the mounting head. A correction jig includes a correction mark which is imaged by the board recognizing camera, and an imaging result is used to correct temporal change in an interior portion of the camera including an optical system, and is fixed to the base.Type: GrantFiled: May 21, 2009Date of Patent: April 22, 2014Assignee: Juki CorporationInventor: Hiroyuki Kagaya
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Patent number: 8701267Abstract: A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.Type: GrantFiled: November 5, 2010Date of Patent: April 22, 2014Assignee: Authentec, Inc.Inventors: Michael P. Goldenberg, Roger Schenk, Phil Spletter, Yang Rao
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Patent number: 8701276Abstract: The invention provides for a placement head for a die placing assembly of an assembler for assembling dice on a carrier. The assembler has an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, and a control system controlling the assembler. The placement head includes a first translation stage mounted on the die placement assembly, said first stage operatively displaceable along a first axis relative to the die placement assembly. The placement head also includes a second translation stage mounted on the first stage, the second stage displaceable perpendicular to the first stage.Type: GrantFiled: August 19, 2008Date of Patent: April 22, 2014Assignee: Zamtec LtdInventors: David Oliver Burke, Jan Waszczuk, Desmond Bruce Boyton, Craig Donald Strudwicke, Peter John Morley Sobey, William Granger, Jason Mark Thelander, Eric Patrick O'Donnell
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Patent number: 8701270Abstract: Methods of making squirrel cage rotors of aluminum based material end rings joined with high conductive and durable material (such as copper) conductor bars for use in electric motors. The methods include forming conductor bars by casting or other metal forming methods in the slots of laminate steel stack, or positioning the preformed or premade solid conductor bars in the longitudinal slots of the stacked laminated steel, with bar ends extending out of the laminated steel stack ends, optionally coating the extended part of the conductors (bars) with a latent exoergic coating containing Al and one or more conductor bar chemical elements, positioning the laminated steel stack having conductors (bars) in a casting mold that forms the cavity of both end rings of the rotor, filling the end ring cavities with aluminum melt, and allowing the end rings to solidify under pressure. Alternatively, the conductor bars and end rings can be made separately and mechanically joined together.Type: GrantFiled: January 21, 2010Date of Patent: April 22, 2014Assignee: GM Global Technology Operations LLCInventors: Qigui Wang, Mark A. Osborne, Eugene C. Tuohy
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Patent number: 8706285Abstract: A process for designing and fabricating a custom-fit implant, comprising: a) processing medical image data of a patient's pathologically defective or anatomically deformed area having a symmetrical part to construct a three-dimensional (3D) digital model; b) forming a mirror image of the left or right side of the three-dimensional (3D) digital model based on its axis of symmetry depending on which side the pathologically defective or anatomically deformed area is; c) overlying the mirror image on the original image to form a composite image with a non-overlapping area wherein the implant will be fitted; d) generating a digital implant by cutting off the non-overlapping area of the mirror image; e) designing mounting points between the digital implant and the pathologically defective or anatomically deformed area where the implant is mounted thereon; f) building a positive and a negative mold based on the digital implant to fabricate a custom-fit implant.Type: GrantFiled: December 11, 2008Date of Patent: April 22, 2014Assignee: Universiti MalayaInventors: Selvanathan Narainasamy, Victor S Devadass, Mangalam Sankupellay, Thyaganathan Seperamaniam, Somasundaram Nagappan, Senthil K Selvanathan, Nanchappan Selvanathan
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Patent number: 8696767Abstract: The present invention relates to a method to produce a solid electrolytic capacitor by forming a dielectric layer on an anode body comprising a valve-acting metal sintered body having fine pores and forming on the dielectric layer a conductive compound layer to form a cathode, wherein a cathode is formed by repeating the step of dipping the anode body into an inorganic compound solution, an organic compound solution or a conductive-polymer compound dispersion liquid which turns into a conductive compound layer to thereby laminate a conductive layer on the anode body, and the depth of the anode body to be dipped is increased with each dipping; and an apparatus to be used for the method. According to the present invention, a satisfactory cathode layer can be efficiently formed and a solid electrolytic capacitor having a large capacitance and a low equivalent series resistance can be produced.Type: GrantFiled: May 20, 2008Date of Patent: April 15, 2014Assignee: Showa Denko K.K.Inventor: Yoshinori Shibuya
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Patent number: 8689428Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.Type: GrantFiled: September 24, 2012Date of Patent: April 8, 2014Assignee: Smartrac IP B.V.Inventors: Oded Bashan, Guy Shafran
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Patent number: 8689435Abstract: A mounting system including: a storage that stores plural formats for each substrate including divisional information of a mounting apparatus indicating which of plural mounting apparatuses that divisionally mount plural electronic components on a substrate mounts what electronic component on the substrate and information on a deviation amount of an electronic component indicating how much each of the electronic components mounted on the substrate and inspected by an inspection apparatus is deviated from its regular position; and a controller that changes, according to a change of an assignment of mounting, the divisional information in a format corresponding to the substrate for which the assignment has been changed, and controls the mounting apparatus that has mounted the electronic component and has been specified from the mounting apparatuses to mount the electronic component on the substrate after correcting a deviation amount based on the information on a deviation amount.Type: GrantFiled: March 29, 2012Date of Patent: April 8, 2014Assignee: Sony CorporationInventor: Shinya Nishida
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Patent number: 8689417Abstract: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.Type: GrantFiled: April 19, 2011Date of Patent: April 8, 2014Assignee: AVX CorporationInventors: Kevin D. Christian, Gheorghe Korony
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Patent number: 8689439Abstract: In a method and system for forming tubing to achieve at least one predetermined performance characteristic relating to the flow of a flowable material therethrough, a relationship is determined between at least one material characteristic of the tubing material, at least one operating parameter of the tube forming machine, and the at least one predetermined performance characteristic of the tubing. Based on this relationship, at least one operating parameter for operation of the tube forming machine to achieve the at least one predetermined performance characteristic is determined. The at least one operating parameter is input into the tube forming machine and the machine is operated to achieve the at least one predetermined performance characteristic.Type: GrantFiled: October 1, 2010Date of Patent: April 8, 2014Assignee: Abbott LaboratoriesInventors: Mark D. Pfouts, Philip Anthony O'Donnell
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Patent number: 8683673Abstract: A method is provided, for manufacturing a stator for a rotary electric machine by shrink-fitting an outer cylinder to a core assembly where a cage-shaped wound coil is assembled with segment cores. The assembly is inserted into the outer cylinder having a diameter increased by thermal expansion caused by the heat from a heating unit, while the outer diameter of the assembly is being reduced by permitting the assembly to pass through a tapered guide unit. The guide unit has a portion whose diameter is larger than an outer diameter of the assembly, and a portion whose diameter is larger than an inner diameter of the outer cylinder and smaller than an inner diameter of the cylinder in the thermally expanded state, and a tapered through hole vertically passing through the guide unit. Thus, the size of the assembly is radially reduced, with a uniform diameter being obtained throughout the assembly.Type: GrantFiled: July 7, 2009Date of Patent: April 1, 2014Assignee: Denso CorporationInventors: Akito Akimoto, Keigo Moriguchi, Seiji Hayashi
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Patent number: 8684426Abstract: A method and apparatus for marking positions for burglar alarm sensor elements on a door, the door attached to a frame having a header including comprising the steps of providing a marking apparatus the marking apparatus including an arm, a positioning member with a longitudinal centerline attached to the arm, and punch point attached to the positioning member, the punch point being aligned with the longitudinal centerline of the positioning member; at least partially opening the door; placing the positioning member in a hole in the header and closing the door; while the door is closed causing the positioning member to make a mark on the top of the door; and opening the door and removing the positioning member from the hole in the header; and causing an opening to be made in the door at the location of the mark.Type: GrantFiled: December 9, 2010Date of Patent: April 1, 2014Inventor: Richard Joseph Morales, Jr.
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Patent number: 8683670Abstract: A method and tooling for partial disassembly of a bypass turbofan engine wherein the longitudinal axis of the bypass turbofan engine remains generally horizontal during disassembly. The low pressure turbine module is removed with a low pressure turbine module horizontal removal tool. An extended bearing nut tool may be supported by a stabilization member and may remove a bearing nut. An extended high pressure turbine shaft stretching tool may stretch a high pressure turbine shaft to release a high pressure turbine shaft nut. An extended bearing pulling tool may be used to pull a bearing while the low pressure turbine shaft remains in place. A modified measurement bridge may be used to measure the position of certain components while the low pressure turbine shaft remains in place. A nozzle jig may be used to assemble nozzles and feather seals to create a nozzle module.Type: GrantFiled: December 20, 2010Date of Patent: April 1, 2014Assignee: Turbine Tooling Solutions LLCInventor: Erik C. Thomas