Patents Examined by Minh Trinh
  • Patent number: 7946033
    Abstract: A method of manufacturing a lead terminal for an accumulator by plastic deformation on a cold-working apparatus that has a shaping station (2) and at least one deformation station (30. 40, 50, 60, 80) by shaping, at the shaping station, a slug (7) that has a longitudinal extension along a longitudinal axis such as to provide base (9) and contact (8) parts for the terminal and a size commensurate with the size of the terminal end piece to be manufactured; transferring the slug (7) to the deformation station (30, 40. 50, 60, 80); carrying out a first deformation of the slug (7) for inner and outer shaping of its base part (9); and carrying out a second deformation of the slug (7) for performing at least a further inner and outer shaping of the base part (9), the deformations being performed sequentially as progressive deformation steps.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: May 24, 2011
    Assignee: Accuma Plastics Limited
    Inventor: Folco Gibellini
  • Patent number: 7934307
    Abstract: A method of constructing a linear drive motor assembly is disclosed. In accordance with the method, a support plate and a platen with a plurality of teeth are provided. A honeycomb core comprising a commercially available, off-the-shelf honeycomb material is provided. The honeycomb core has a plurality of cells arranged in a planar array where the plurality of cells is defined by walls extending in planes substantially perpendicular to the planar array. The support plate is directly secured to one side of the planar array. The platen is secured directly to the other side of the planar array. A forcer having a motor stack is magnetically coupleable to the platen to form a linear drive motor.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: May 3, 2011
    Assignee: Baldor Electric Company
    Inventor: Glenn Sterling Trammell
  • Patent number: 7934308
    Abstract: The invention concerns a method for making a waveguide microwave antenna with corrugated horn, which consists in forming the corrugations of the horn on the outer surface of a synthetic material form block followed by surface metallization of the foam block configured to produce the antenna.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: May 3, 2011
    Assignee: Thomson Licensing
    Inventors: Ali Louzir, Dominique Lo Hine Tong, Florent Averty, Christian Person, Jean-Philippe Coupez
  • Patent number: 7935155
    Abstract: A method of manufacturing an electrode product where a compressible and deformable layer is densified and laminated to a layer of a material that is relatively resistant to stretching. The densification and bonding take place in a single step. A method as used in fabrication of electrodes, for example, electrodes for double layer capacitors, a deformable and compressible active electrode film is manufactured from activated carbon, conductive carbon, and a polymer. The electrode film may be bonded directly to a collector. Alternatively, a collector may be coated with a wet adhesive layer. The adhesive layer is subsequently dried onto the foil. The dried adhesive and foil combination may be manufactured as a product for later sale or use, and may be stored as such on a storage roll or other storage device. The active electrode film is overlayed on the metal foil, and processed in a laminating device, such as a calender. Lamination both densifies the active electrode film and bonds the film to the metal foil.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: May 3, 2011
    Assignee: Maxwell Technologies, Inc.
    Inventors: Porter Mitchell, Xiaomei Xi, Linda Zhong
  • Patent number: 7930819
    Abstract: It is intended to allow for readily performing a cover tape setting operation. In the present invention, a tape guide 110 for guiding a component supply tape 35 includes a front guide section 120 provided with an open surface 128 opened on one side thereof in a continuous manner in a tape feed direction, so as to allow a cover tape 37 to be taken in and out relative to the front guide section 120 through the open surface 128. This configuration makes it possible to perform the setting operation for the cover tape 37 through given operational steps, under a condition that the tape guide 110 remains fixed to a component supply unit 40.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: April 26, 2011
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventors: Masanori Yonemitsu, Osamu Araki
  • Patent number: 7926170
    Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: April 19, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chin-Jyi Wu, Chen-Der Tsai, Yun-Chuan Tu, Te-Chi Wong
  • Patent number: 7926154
    Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: April 19, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki Pyo Hong, Byeung Gyu Chang, Ji Hwan Shin, Gyu Man Hwang
  • Patent number: 7928848
    Abstract: This disclosure discloses an RFID tag producing apparatus comprising: a first antenna device that transmits and receives information to and from an RFID circuit element; a writing control portion that writes a command signal for commanding operation of at least one operating device so as to produce a command RFID tag; a second antenna device that transmits and receives information to and from the command RFID tag; a reading control portion that acquires the command signal; and a device control portion, based on information obtained by the reading control portion, that controls the at least one operating device.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: April 19, 2011
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Satoru Moriyama
  • Patent number: 7921540
    Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: April 12, 2011
    Assignee: Knowles Electronics, LLC
    Inventors: Mekell Jiles, David Earl Schafer
  • Patent number: 7918017
    Abstract: A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: April 5, 2011
    Assignee: Yamaha Hatsudoki Kabushiki Kaisha
    Inventor: Kazuhiro Kobayashi
  • Patent number: 7913368
    Abstract: A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: March 29, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Cheol Kim, Jun Rok Oh
  • Patent number: 7906743
    Abstract: A gradation twin-wire EDM manufacturing system includes a manufacture machine, a wire feeding bobbin set mounted on the manufacture machine, a wire receiving bobbin set mounted on the manufacture machine, a gradation electro-insulated roller mounted on the manufacturing machine, two wires detoured around the wire feeding bobbin set, the gradation electro-insulated roller and the wire receiving bobbin set, a RC electro discharge circuit connected to one wire, and a transistor RC electro discharge circuit connected to another wire. Therefore, only one manufacture process is needed for a quick manufacture of a workpiece, and thus saving the manufacturing time and enhancing the efficiency.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: March 15, 2011
    Assignee: National Taipei University of Technology
    Inventor: Dong-Yea Sheu
  • Patent number: 7900340
    Abstract: A method of fabricating an antenna including a plurality of radiating waveguides disposed so that their wave paths are parallel two by two and including a feed waveguide having a wave path forming a flat zigzag serpentine pattern. The feed waveguide is disposed against the radiating waveguides so that a longitudinal axis of the feed waveguide pattern intersects the radiating waveguides at an angle of substantially 90 degrees. The feed waveguide includes coupling elements on its face in contact with the radiating waveguides. The radiating waveguides are straight and the straight portions of the zigzag wave path in the feed waveguide form a non-zero angle with the wave paths of the radiating waveguides, so that the coupling elements feed the radiating waveguides.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: March 8, 2011
    Assignee: Thales
    Inventors: Jean-Paul Artis, Gérard Debionne, Jean-François Dupire
  • Patent number: 7900339
    Abstract: In a motor, an insulator covering an armature core has a lid covering an end surface of the armature core. The lid has an inner ring disposed radially inside slots of the armature core and an outer ring disposed radially outside the slots. Each of a plurality of slot insulators inserted into the slots has a blocking portion at a position in the inner ring.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: March 8, 2011
    Assignee: Nidec Corporation
    Inventor: Yusuke Makino
  • Patent number: 7895721
    Abstract: A method with which Quantum Batteries (super capacitors) can be produced from materials which consist of chemically highly dipolar crystals in the form of nanometer-sized grains or layers that are embedded in electrically insulating matrix material or intermediate layers, and are applied to a compound foil or fixed flat base. The materials are assembled so as to form wound capacitors or flat capacitors which are able to store electrical energy in a range of up to 15 MJ/kg or more without any loss due to the effect of virtual photon resonance.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: March 1, 2011
    Inventor: Rolf Eisenring
  • Patent number: 7895735
    Abstract: An element mounting apparatus includes a movable arm, an electromagnet, a first controller and a glue dispenser. The glue dispenser includes a plate body and a second controller. The plate body includes an inner space containing glue, a through hole defined therein, and a plurality of spaced glue outlets formed in the first surface and communicating with the inner space. The second end of the electromagnet engages the through hole to attract the magnetic element on the first surface of the plate body with the glue outlets surrounding, and repelling the magnetic element to the retainer. The second controller ejects glue out of the inner space of the plate body via the glue outlets, thereby adhesively mounting the magnetic element to the retainer.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 1, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chia-Hung Liao
  • Patent number: 7895738
    Abstract: Staking apparatus (22) and a method for staking one or more fasteners (44) of a part assembly (18) are provided by a conveyor (14), a lower lift and lock assembly (24) including a lower lifter (28) and a lower lock (30), and an upper press (26). Lower and upper staking punches (40, 60) of the lower lifter (28) and the upper press (26), respectively, provide the staking while at least one and preferably a plurality of springs (36) resiliently support a pallet assembly (16) on which the part assembly (18) is positioned.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: March 1, 2011
    Assignee: Porter Group, LLC
    Inventor: Richard T. Oliver
  • Patent number: 7886426
    Abstract: A stator manufacturing apparatus for manufacturing a stator efficiently includes a base plate, a plurality of radially inward displacing jigs disposed radially in an annular pattern on the base plate and which are radially displaceable toward and away from each other, a plurality of core holding jigs disposed radially inward of the radially inward displacing jigs and which are radially displaceable toward and away from each other, a movable plate disposed vertically upward of the base plate and which is vertically movable toward and away from the base plate, a cam disposed on the movable plate for displacing the radially inward displacing jigs radially toward each other when the movable plate is lowered, and a spacer holding jig for holding spacers that are inserted between adjacent separate cores.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: February 15, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventor: Hiroshi Sakakibara
  • Patent number: 7889035
    Abstract: Methods and systems provide pulsed-power to a load utilizing high temperature superconductors (HTS) within multiple pulsed-power devices. According to embodiments described herein, each pulsed-power device includes a HTS mounted on a rotor and an armature coil mounted on a stator. The rotor is positioned to allow a magnetic field within the HTS to induce a voltage in the armature coil when the rotor is rotating and to allow a magnetic field created by passing current through the armature coil to charge the HTS. Current created from the operation of a first pulsed-power device is routed to the armature coil in a second pulsed-power device to charge the associated HTS to a higher value. Subsequently, the second pulsed-power device is operated to produce current that is used to further charge the HTS in the first pulsed-power device. This bootstrapping procedure is repeated until all HTSs are fully charged.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: February 15, 2011
    Assignee: The Boeing Company
    Inventors: John R. Hull, Michael Strasik
  • Patent number: 7886414
    Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: February 15, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park