Patents Examined by Minh Trinh
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Patent number: 7946033Abstract: A method of manufacturing a lead terminal for an accumulator by plastic deformation on a cold-working apparatus that has a shaping station (2) and at least one deformation station (30. 40, 50, 60, 80) by shaping, at the shaping station, a slug (7) that has a longitudinal extension along a longitudinal axis such as to provide base (9) and contact (8) parts for the terminal and a size commensurate with the size of the terminal end piece to be manufactured; transferring the slug (7) to the deformation station (30, 40. 50, 60, 80); carrying out a first deformation of the slug (7) for inner and outer shaping of its base part (9); and carrying out a second deformation of the slug (7) for performing at least a further inner and outer shaping of the base part (9), the deformations being performed sequentially as progressive deformation steps.Type: GrantFiled: November 14, 2005Date of Patent: May 24, 2011Assignee: Accuma Plastics LimitedInventor: Folco Gibellini
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Patent number: 7934307Abstract: A method of constructing a linear drive motor assembly is disclosed. In accordance with the method, a support plate and a platen with a plurality of teeth are provided. A honeycomb core comprising a commercially available, off-the-shelf honeycomb material is provided. The honeycomb core has a plurality of cells arranged in a planar array where the plurality of cells is defined by walls extending in planes substantially perpendicular to the planar array. The support plate is directly secured to one side of the planar array. The platen is secured directly to the other side of the planar array. A forcer having a motor stack is magnetically coupleable to the platen to form a linear drive motor.Type: GrantFiled: August 22, 2008Date of Patent: May 3, 2011Assignee: Baldor Electric CompanyInventor: Glenn Sterling Trammell
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Patent number: 7934308Abstract: The invention concerns a method for making a waveguide microwave antenna with corrugated horn, which consists in forming the corrugations of the horn on the outer surface of a synthetic material form block followed by surface metallization of the foam block configured to produce the antenna.Type: GrantFiled: October 1, 2003Date of Patent: May 3, 2011Assignee: Thomson LicensingInventors: Ali Louzir, Dominique Lo Hine Tong, Florent Averty, Christian Person, Jean-Philippe Coupez
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Patent number: 7935155Abstract: A method of manufacturing an electrode product where a compressible and deformable layer is densified and laminated to a layer of a material that is relatively resistant to stretching. The densification and bonding take place in a single step. A method as used in fabrication of electrodes, for example, electrodes for double layer capacitors, a deformable and compressible active electrode film is manufactured from activated carbon, conductive carbon, and a polymer. The electrode film may be bonded directly to a collector. Alternatively, a collector may be coated with a wet adhesive layer. The adhesive layer is subsequently dried onto the foil. The dried adhesive and foil combination may be manufactured as a product for later sale or use, and may be stored as such on a storage roll or other storage device. The active electrode film is overlayed on the metal foil, and processed in a laminating device, such as a calender. Lamination both densifies the active electrode film and bonds the film to the metal foil.Type: GrantFiled: May 16, 2008Date of Patent: May 3, 2011Assignee: Maxwell Technologies, Inc.Inventors: Porter Mitchell, Xiaomei Xi, Linda Zhong
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Patent number: 7930819Abstract: It is intended to allow for readily performing a cover tape setting operation. In the present invention, a tape guide 110 for guiding a component supply tape 35 includes a front guide section 120 provided with an open surface 128 opened on one side thereof in a continuous manner in a tape feed direction, so as to allow a cover tape 37 to be taken in and out relative to the front guide section 120 through the open surface 128. This configuration makes it possible to perform the setting operation for the cover tape 37 through given operational steps, under a condition that the tape guide 110 remains fixed to a component supply unit 40.Type: GrantFiled: October 3, 2007Date of Patent: April 26, 2011Assignee: Yamaha Hatsudoki Kabushiki KaishaInventors: Masanori Yonemitsu, Osamu Araki
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Patent number: 7926170Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.Type: GrantFiled: August 17, 2009Date of Patent: April 19, 2011Assignee: Industrial Technology Research InstituteInventors: Chin-Jyi Wu, Chen-Der Tsai, Yun-Chuan Tu, Te-Chi Wong
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Patent number: 7926154Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.Type: GrantFiled: November 14, 2008Date of Patent: April 19, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Pyo Hong, Byeung Gyu Chang, Ji Hwan Shin, Gyu Man Hwang
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Patent number: 7928848Abstract: This disclosure discloses an RFID tag producing apparatus comprising: a first antenna device that transmits and receives information to and from an RFID circuit element; a writing control portion that writes a command signal for commanding operation of at least one operating device so as to produce a command RFID tag; a second antenna device that transmits and receives information to and from the command RFID tag; a reading control portion that acquires the command signal; and a device control portion, based on information obtained by the reading control portion, that controls the at least one operating device.Type: GrantFiled: July 18, 2008Date of Patent: April 19, 2011Assignee: Brother Kogyo Kabushiki KaishaInventor: Satoru Moriyama
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Patent number: 7921540Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).Type: GrantFiled: October 24, 2006Date of Patent: April 12, 2011Assignee: Knowles Electronics, LLCInventors: Mekell Jiles, David Earl Schafer
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Patent number: 7918017Abstract: A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).Type: GrantFiled: August 28, 2007Date of Patent: April 5, 2011Assignee: Yamaha Hatsudoki Kabushiki KaishaInventor: Kazuhiro Kobayashi
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Patent number: 7913368Abstract: A method of manufacturing a chip capacitor according to an aspect may include: preparing a capacitor lamination including a dielectric sheet formed of a composite having ceramic powder and a polymer mixed with each other, and first and second internal electrodes formed on both surfaces of the dielectric sheet at predetermined intervals; forming covering layers formed of an insulating material on both surfaces of the capacitor lamination; forming a first opening and a second opening in the capacitor lamination having the covering layers formed thereon to expose the first and second internal electrodes, respectively; forming plating layers in the first and second openings, the plating layers connected to the first and second internal electrodes; and dicing the capacitor lamination into chips on the basis of the first and second openings so that the plating layers formed in the first and second openings are provided as first and second external terminals.Type: GrantFiled: April 10, 2009Date of Patent: March 29, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Cheol Kim, Jun Rok Oh
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Patent number: 7906743Abstract: A gradation twin-wire EDM manufacturing system includes a manufacture machine, a wire feeding bobbin set mounted on the manufacture machine, a wire receiving bobbin set mounted on the manufacture machine, a gradation electro-insulated roller mounted on the manufacturing machine, two wires detoured around the wire feeding bobbin set, the gradation electro-insulated roller and the wire receiving bobbin set, a RC electro discharge circuit connected to one wire, and a transistor RC electro discharge circuit connected to another wire. Therefore, only one manufacture process is needed for a quick manufacture of a workpiece, and thus saving the manufacturing time and enhancing the efficiency.Type: GrantFiled: July 9, 2008Date of Patent: March 15, 2011Assignee: National Taipei University of TechnologyInventor: Dong-Yea Sheu
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Patent number: 7900340Abstract: A method of fabricating an antenna including a plurality of radiating waveguides disposed so that their wave paths are parallel two by two and including a feed waveguide having a wave path forming a flat zigzag serpentine pattern. The feed waveguide is disposed against the radiating waveguides so that a longitudinal axis of the feed waveguide pattern intersects the radiating waveguides at an angle of substantially 90 degrees. The feed waveguide includes coupling elements on its face in contact with the radiating waveguides. The radiating waveguides are straight and the straight portions of the zigzag wave path in the feed waveguide form a non-zero angle with the wave paths of the radiating waveguides, so that the coupling elements feed the radiating waveguides.Type: GrantFiled: June 26, 2008Date of Patent: March 8, 2011Assignee: ThalesInventors: Jean-Paul Artis, Gérard Debionne, Jean-François Dupire
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Patent number: 7900339Abstract: In a motor, an insulator covering an armature core has a lid covering an end surface of the armature core. The lid has an inner ring disposed radially inside slots of the armature core and an outer ring disposed radially outside the slots. Each of a plurality of slot insulators inserted into the slots has a blocking portion at a position in the inner ring.Type: GrantFiled: June 13, 2008Date of Patent: March 8, 2011Assignee: Nidec CorporationInventor: Yusuke Makino
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Patent number: 7895721Abstract: A method with which Quantum Batteries (super capacitors) can be produced from materials which consist of chemically highly dipolar crystals in the form of nanometer-sized grains or layers that are embedded in electrically insulating matrix material or intermediate layers, and are applied to a compound foil or fixed flat base. The materials are assembled so as to form wound capacitors or flat capacitors which are able to store electrical energy in a range of up to 15 MJ/kg or more without any loss due to the effect of virtual photon resonance.Type: GrantFiled: August 22, 2007Date of Patent: March 1, 2011Inventor: Rolf Eisenring
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Patent number: 7895735Abstract: An element mounting apparatus includes a movable arm, an electromagnet, a first controller and a glue dispenser. The glue dispenser includes a plate body and a second controller. The plate body includes an inner space containing glue, a through hole defined therein, and a plurality of spaced glue outlets formed in the first surface and communicating with the inner space. The second end of the electromagnet engages the through hole to attract the magnetic element on the first surface of the plate body with the glue outlets surrounding, and repelling the magnetic element to the retainer. The second controller ejects glue out of the inner space of the plate body via the glue outlets, thereby adhesively mounting the magnetic element to the retainer.Type: GrantFiled: December 23, 2008Date of Patent: March 1, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chia-Hung Liao
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Patent number: 7895738Abstract: Staking apparatus (22) and a method for staking one or more fasteners (44) of a part assembly (18) are provided by a conveyor (14), a lower lift and lock assembly (24) including a lower lifter (28) and a lower lock (30), and an upper press (26). Lower and upper staking punches (40, 60) of the lower lifter (28) and the upper press (26), respectively, provide the staking while at least one and preferably a plurality of springs (36) resiliently support a pallet assembly (16) on which the part assembly (18) is positioned.Type: GrantFiled: November 16, 2006Date of Patent: March 1, 2011Assignee: Porter Group, LLCInventor: Richard T. Oliver
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Patent number: 7886426Abstract: A stator manufacturing apparatus for manufacturing a stator efficiently includes a base plate, a plurality of radially inward displacing jigs disposed radially in an annular pattern on the base plate and which are radially displaceable toward and away from each other, a plurality of core holding jigs disposed radially inward of the radially inward displacing jigs and which are radially displaceable toward and away from each other, a movable plate disposed vertically upward of the base plate and which is vertically movable toward and away from the base plate, a cam disposed on the movable plate for displacing the radially inward displacing jigs radially toward each other when the movable plate is lowered, and a spacer holding jig for holding spacers that are inserted between adjacent separate cores.Type: GrantFiled: July 2, 2009Date of Patent: February 15, 2011Assignee: Honda Motor Co., Ltd.Inventor: Hiroshi Sakakibara
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Patent number: 7889035Abstract: Methods and systems provide pulsed-power to a load utilizing high temperature superconductors (HTS) within multiple pulsed-power devices. According to embodiments described herein, each pulsed-power device includes a HTS mounted on a rotor and an armature coil mounted on a stator. The rotor is positioned to allow a magnetic field within the HTS to induce a voltage in the armature coil when the rotor is rotating and to allow a magnetic field created by passing current through the armature coil to charge the HTS. Current created from the operation of a first pulsed-power device is routed to the armature coil in a second pulsed-power device to charge the associated HTS to a higher value. Subsequently, the second pulsed-power device is operated to produce current that is used to further charge the HTS in the first pulsed-power device. This bootstrapping procedure is repeated until all HTSs are fully charged.Type: GrantFiled: December 6, 2007Date of Patent: February 15, 2011Assignee: The Boeing CompanyInventors: John R. Hull, Michael Strasik
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Patent number: 7886414Abstract: A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.Type: GrantFiled: April 22, 2008Date of Patent: February 15, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Woon-Chun Kim, Sung Yi, Hwa-Sun Park, Hong-Won Kim, Dae-Jun Kim, Jin-Seon Park