Patents Examined by Minh Trinh
  • Patent number: 7735216
    Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: June 15, 2010
    Assignee: International Business Machines Corporation
    Inventors: Christopher M. Schnabel, Peter A. Smith, John E. Florkey, Richard P. Volant
  • Patent number: 7736397
    Abstract: A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: June 15, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Eun Lee, Yul Kyo Chung, Hyung Dong Kang, Hyun Ju Jin
  • Patent number: 7735206
    Abstract: A method for forming a capacitor dielectric includes depositing a zirconium oxide layer, performing a post-treatment on the zirconium oxide layer such that the zirconium oxide layer has a tetragonal phase, and depositing a tantalum oxide layer over the zirconium oxide layer such that the tantalum oxide layer has a tetragonal phase.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: June 15, 2010
    Assignee: Hynix Semiconductor Inc.
    Inventor: Jong-Bum Park
  • Patent number: 7730606
    Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: June 8, 2010
    Inventors: Ian J Forster, Patrick F King
  • Patent number: 7726005
    Abstract: The method of making an electromagnetically excitable core of an electrical machine with a multiphase winding (13) includes preparing a core (10) having a substantially parallelepiped shape, which is provided with a plurality of parallel grooves (N1 to N36; N1 to N48) in one side in a first step. In at least one subsequent step at least three phase windings (100, 200, 300) are laid in these grooves in such a manner that only one winding overhang is outside of the core.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: June 1, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Wolfgang Stroebel, Helmut Scheiffele
  • Patent number: 7726012
    Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: June 1, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroki Endo, Teruki Nishi
  • Patent number: 7726006
    Abstract: In manufacturing of the stator unit 2 according to one preferred embodiment of the present invention, a plurality of terminal pins are arranged in an axially spaced manner from a plurality of the coils during a twining process of the wires from the coils 232 to the terminal pins 241. Then, after the wire is twined to the terminal pins, the terminal pins connected to the coils are moved along the outer side face of the sleeve housing, functioning to as a guide portion 2201 for the terminal pins. By virtue of the configuration, the terminal pins 241 may be approximated to the coils without applying the tension on wire, and the stator unit may be made thin with preventing the open circuit of the wires.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: June 1, 2010
    Assignee: Nidec Corporation
    Inventors: Hiroyoshi Teshima, Kazumi Takeshita, Hideaki Konishi, Kiyoto Ida, Tsukasa Takaoka
  • Patent number: 7721422
    Abstract: A method of making a microelectronic assembly includes providing a conductive metal layer having a first surface and a second surface, and etching the first surface of the conductive metal layer to form conductive protrusions, whereby after the etching step, the second surface of the conductive metal layer defines a substantially flat, continuous surface. The method includes juxtaposing a layer of an insulating material with tips of the conductive protrusions, and pressing the conductive protrusions through the layer of an insulating material so that the tips of the conductive protrusions are accessible at a first surface of the layer of an insulating material.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: May 25, 2010
    Assignee: Tessera Interconnect Materials, Inc.
    Inventors: Tomoo Iijima, Masayuki Ohsawa
  • Patent number: 7716809
    Abstract: Provided is a method for making a double-walled yoke that allows an inner yoke (4) and outer yoke (3) to be integrally joined to each other both easily and securely. Such a yoke provides an adequate cross sectional area for a magnetic path of the yoke while minimizing the weight of the yoke. A tubular member (14) destined to be form the inner yoke and a cup-shaped member (13) destined to form the outer yoke are both fitted on a punch (7) and a drawing process is executed by using an appropriate drawing die (8). The outer yoke may have a small wall thickness as long as it is capable of retaining its shape during use or supporting a bearing for the motor. The inner yoke is required to be relatively small in size as long it is capable of forming a satisfactory magnetic path for the motor. A satisfactory magnetic path can be obtained if the yoke is provided with an adequate wall thickness so as to provide an adequate cross sectional area for the magnetic path.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: May 18, 2010
    Assignee: Mitsuba Corporation
    Inventors: Takahiro Miura, Masayuki Yoshizawa
  • Patent number: 7716818
    Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: May 18, 2010
    Assignee: Panasonic Corporation
    Inventors: Shinjiro Tsuji, Takahiko Murata, Keiji Fujiwara, Kozo Odawara
  • Patent number: 7707714
    Abstract: Production of microscopic and nanoscopic coils, by rolling up conductor layers during the removal of auxiliary layers from a substrate. By removing the auxiliary layer from the substrate, for example by virtue of a sacrificial layer situated in between being selectively etched away, the auxiliary layer folds back and, if appropriate, automatically rolls up upon continuation of the removal operation and a conductor track concomitantly rolls up in the process. The auxiliary layer may be formed by two layers having different lattice constants. It is possible to produce microcoils, microtransformers, or microcapacitors constructed from said microcoils, with diameters in the nanometers or micrometers range.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: May 4, 2010
    Assignee: Max-Planck Gesellschaft zur Forderung der Wissenschaften E.V.
    Inventors: Oliver G. Schmidt, Christoph Deneke
  • Patent number: 7707701
    Abstract: A method for manufacturing a piezoelectric element includes the steps of forming a first electrode above a substrate, forming above the first electrode a piezoelectric layer composed of a piezoelectric material having a perovskite structure, and forming a second electrode above the piezoelectric layer, wherein the step of forming the first electrode includes forming a lanthanum nickelate layer that is oriented to a cubic (100) by a sputter method, and a ratio of nickel to lanthanum (Ni/La) in a target used for the sputter method is greater than 1 but smaller than 1.5.
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: May 4, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Setsuya Iwashita, Koji Ohashi, Takamitsu Higuchi
  • Patent number: 7707706
    Abstract: A method is provided for producing a smart card comprising a chip module with at least one contacting area, the chip module arrangeable in a mounting location of a substrate, wherein one contacting loop is formed from a wire connector fed by a wire guiding unit for at least one of the contacting areas, respectively by attaching a first section of the wire conductor to a surface of the substrate outside the mounting location, wherein a second section of the wire conductor proximate to the first section is guided to form the contacting loop along with and protruding from the surface, wherein a subsequent third section of the wire conductor is attached to the surface outside the mounting location, wherein the chip module is inserted into the mounting location and wherein the second section is bent over and electrically contacted to the contacting area.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: May 4, 2010
    Assignee: ruhlamat GmbH
    Inventors: Matthias Koch, Bernd Gebhardt
  • Patent number: 7703198
    Abstract: A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: April 27, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Gyo Jeong, Yong Seok Choi, Ki Pyo Hong
  • Patent number: 7703191
    Abstract: This present invention discloses a cutting shield machine used for separating iron shells of connectors from a metal strip. The cutting shield machine includes a worktable, a separation apparatus located in the worktable, a carrying apparatus located in the worktable delivering the metal strip into the separation apparatus, a receiving box located in the worktable for receiving the iron shells from the separation apparatus, a crossing apparatus and a driving apparatus located in the worktable. The separation apparatus has a prop stand located in the worktable, a rotating portion with a columned portion capable of rotation and a pole are fixed in the prop stand in sequence in the transmission direction of the metal strip. The metal strip passes from the top of the rotating portion and the bottom of the pole or from the bottom of the rotating portion and the bottom of the pole.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: April 27, 2010
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Aijun Yan, Wei Wang, Yu Zhou
  • Patent number: 7703195
    Abstract: A method for the safe and easy installation of wall-mounted electrical switches utilizing a multi-functional tool. The tool is temporarily attached to a magnetically-attractive surface of a fixture using one or more magnets. The fixture may be safely held using the tool.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: April 27, 2010
    Assignee: PlugGrip Products, LLC
    Inventors: Bryan Cahill, Deborah Unser
  • Patent number: 7698803
    Abstract: A method of manufacturing a laminated stator core includes: forming a band-shaped yoke core piece having a shape that a yoke of the laminated stator core is developed in a straight line and having concave connection portions in the inner circumferential edge thereof by punching a metal plate; forming a laminated yoke body by winding and laminating the band-shaped yoke core piece in a spiral shape and coupling the laminated band-shaped yoke core piece in a caulking manner; forming a magnetic core piece having a convex connection portion at the base end thereof by punching a metal plate; forming a laminated magnetic body by laminating and coupling a predetermined number of the magnetic core pieces to each other in a caulking manner; and coupling the laminated yoke body and the laminated magnetic body to each other by winding a coil around the laminated magnetic body and then inserting the convex connection portions into the concave connection portions.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: April 20, 2010
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Yoshiaki Mitsui, Katsufusa Fujita
  • Patent number: 7698801
    Abstract: In a wire-processing machine, by a linear movement away from a first holding unit, a gripper applies to a gripping unit a pull-out force in the longitudinal axis of the wire. The pull-out force that is exerted on the wire is measured by, for example, a force sensor that is arranged on the holding unit or by the motor current of the motor that causes the linear movement. The gripper and the gripping unit together make measurement of the pull-out force possible also for medium-sized and large wires without the gripper needing to be constructed stronger, or its dimensions, or the gripper-arm drive, needing to be changed.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: April 20, 2010
    Assignee: Komax Holding AG
    Inventor: Alois Conte
  • Patent number: 7698810
    Abstract: A connector removal system includes a connector housing (1) forming contacts (10) therein and a contact extraction tool (3) for removing the contact of the connector housing. The connector housing has a mating face (200), a plurality of cavities (22) receiving corresponding contacts and a plurality of cantilevered flexible latches (26) retaining corresponding contacts. The latch forms an external side face of the housing. Each cavity has an open cavity entrance (220) located at a distal end thereof on the mating face and an opening (222) formed adjacent the entrance between the cavity and the external side face. The contact extraction tool includes a pair of registration posts (34) formed from an end edge thereof for positioning inside the entrances and an ejecting member (36) for deflecting said cantilevered flexible latch to disengage from said contact.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: April 20, 2010
    Assignee: Hon Hahi Precision Ind. Co., Ltd.
    Inventor: John P. Huss, Jr.
  • Patent number: 7694408
    Abstract: A method of manufacturing a yoke of an electric rotary machine is disclosed. The manufacturing method includes providing a cutout steel plate having one end formed with a plurality of concave portions and the other end formed with a plurality of protrusions, rolling the cutout steel plate into a cylindrical shape until a distal end of each protrusion faces the inlet of each concave portion, inserting the protrusions into the concave portions, respectively, in a circumferential direction, and conducting punch-caulking press on each protrusion at near-wall areas on both sides thereof in close proximity to indents of each concave portion to form localized expanding portions at the near-wall areas on both sides of each protrusion while causing the localized expanding portions to flow axially outward to be fitted into the indents of each concave portion, respectively.
    Type: Grant
    Filed: February 28, 2006
    Date of Patent: April 13, 2010
    Assignee: Denso Corporation
    Inventors: Kazuyuki Kitou, Yasuhiro Hideshima, Kiyokazu Futami