Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A method includes forming a plurality of photosensitive pixels in a substrate, the substrate having a first surface and a second surface, the second surface being opposite the first surface, the substrate having one or more active devices on the first surface. A first portion of the second surface is protected. A second portion of the second surface is patterned to form recesses in the substrate. An anti-reflective layer is formed on sidewalls of the recesses. A metal grid is formed over the second portion of the second surface, the anti-reflective layer being interposed between the substrate and the metal grid.

Abstract: A building automation system (BAS) includes building equipment located within a building and a BAS network configured to facilitate communications between the building equipment. The building equipment operate to affect a variable state or condition within the building. The BAS includes a BAS-BIM integrator configured to receive BAS points from the BAS network and to integrate the BAS points with a building information model (BIM). The BIM includes a plurality of BIM objects representing the building equipment. The BAS includes an integrated BAS-BIM viewer configured to use the BIM with the integrated BAS points to generate a user interface. The user interface includes a graphical representation of the BIM objects and the BAS points integrated therewith.

Abstract: A light emitting unit includes a reflective structure, a light transmitting body and a light emitting chip. The reflective structure has a recess formed by inner side surfaces thereof, and the reflective structure includes a side opening and a bottom opening corresponding to the recess. The side opening and the bottom opening are adjacent to each other, and the inner side surfaces are defined as a top surface and a surrounding side surface. The light transmitting body is disposed within the recess and doped with fluorescent powder. The light transmitting body includes a light emitting surface and an electrode exposing surface. The light emitting surface is corresponding to the side opening; and the electrode exposing surface is corresponding to the bottom opening. The light emitting chip is partially disposed within the light transmitting body and has a bottom, a top light emitting and side light emitting surfaces.

Abstract: A magnetic tunnel junction is disclosed wherein the reference layer and free layer each comprise one layer having a boron content from 25 to 50 atomic %, and an adjoining second layer with a boron content from 1 to 20 atomic %. One of the first and second layers in each of the free layer and reference layer contacts the tunnel barrier. Each boron containing layer has a thickness of 1 to 10 Angstroms and may include one or more B layers and one or more Co, Fe, CoFe, or CoFeB layers. As a result, migration of non-magnetic metals along crystalline boundaries to the tunnel barrier is prevented, and the MTJ has a low defect count of around 10 ppm while maintaining an acceptable TMR ratio following annealing to temperatures of about 400° C. The boron containing layers are selected from CoB, FeB, CoFeB and alloys thereof including CoFeNiB.

Abstract: A semiconductor device includes a first active region, a second active region, a first gate line disposed to overlap the first and second active regions, a second gate line disposed to overlap the first and second active regions, a first metal line electrically connecting the first and second gate lines and providing a first signal to both the first and second gate lines, a first contact structure electrically connected to part of the first active region between the first and second gate lines, a second contact structure electrically connected to part of the second active region between the first and second gate lines, and a second metal line electrically connected to the first and second contact structures and transmitting a second signal, wherein an overlapped region that is overlapped by the second metal line does not include a break region.

Abstract: A substrate processing apparatus includes a substrate transfer device that transfers a substrate accommodated in a substrate transfer container to a substrate holder; a substrate holder transfer stage that introduces the substrate holder into a reaction container; a substrate transfer controller that obtains a film thickness measurement result of the substrate, and determines a placing position of the substrate in the substrate holder by a model created in advance from the film thickness measurement result and a transfer position setting circuit; an information processing circuit that analyzes an eccentricity state from a film thickness variation state when a film thickness measurement result is newly obtained; a learning function circuit that updates the model from the eccentricity state; and an optimization function circuit that updates the placing position of the substrate by an updated model and the transfer position setting circuit.

Abstract: An apparatus for treating a substrate is disclosed. The apparatus for treating the substrate includes a housing having a treatment space inside the housing, a plate to support the substrate inside the housing, a heating member provided inside the plate to heat the substrate and including a plurality of heating zones, a temperature measuring member to measure a temperature of the substrate with respect to each of the plurality of heating zones of the heating member, and a control unit to control a temperature for the heating member in a dynamic section of a temperature change graph measured in the temperature measuring member. The control unit performs temperature control with respect to each of the plurality of heating zones of the heating member to uniformize the thickness of the thin film on the substrate.

Abstract: A substrate processing method includes generating a plurality of records each including a piece of recipe information in a substrate processing in association with control value information of a control target in the substrate processing, storing the plurality of records generated in the generating, acquiring recipe information input by an operator when performing the substrate processing, reading a record including recipe information identical to the recipe information acquired in the acquiring, and controlling the control target based on the control value information in the recipe information of the record read in the reading.

Abstract: There is provided a technique that includes a process chamber configured to process a substrate; a processing gas supply part configured to supply a processing gas to the substrate; a heater configured to heat the substrate; a transfer robot configured to transfer the substrate; a first power supply connected to at least one part selected from the group of the processing gas supply part, the heater, and the transfer robot; a first controller installed between the at least one part and the first power supply; a second power supply including two or more power sources configured to drive the first controller; and a second controller installed between the first controller and the second power supply and configured to allow power to be supplied to the first controller while setting a power ratio of each of the two or more power sources of the second power supply to a predetermined value.

Abstract: A flexible display apparatus includes: a substrate; a gate insulating layer including an inorganic layer disposed on the substrate; a gate line disposed on the gate insulating layer; an inter-insulating layer including an inorganic layer and covering the gate line; and a data line disposed on the inter-insulating layer, where the flexible display apparatus has a first region which is bendable and second regions at opposite sides of the first region, respectively, portions of the gate insulating layer and the inter-insulating layer in the first region are removed, and the gate insulating layer and the inter-insulating layer in the second region have a patterned structure.

Abstract: A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A surface of the p-type region perpendicular to a growth direction of the semiconductor structure includes a first portion and a second portion. The first portion is less conductive than the second portion. The device further includes a p-contact formed on the p-type region. The p-contact includes a reflector and a blocking material. The blocking material is disposed over the first portion and no blocking material is disposed over the second portion.

Abstract: A light emitting device including a substrate having a first surface and a second surface opposing the first surface, at least one of the first and second surfaces having a concave part extending to the inside of the substrate, a plurality of light emitting cells disposed on the first surface of the substrate, and a light shielding layer filling at least a portion of the concave part and disposed between the plurality of light emitting cells.

Abstract: A display device includes a first substrate including a display area and a peripheral area outside the display area, pixels arranged in the display area and each including an emission area defined by a non-emission area, a thin-film encapsulation layer covering the pixels and including at least one inorganic encapsulation layer and at least one organic encapsulation layer, a pattern layer above the thin-film encapsulation layer, the pattern layer including a first light-blocking pattern shielding at least a portion of the non-emission area, and a second substrate facing the first substrate and including a second light-blocking pattern shielding at least a portion of the non-emission area.

Abstract: A method for determining national crop yields during the growing season is provided. In an embodiment, a server computer system receives agricultural data records for a particular year that represent covariate data values related to plants at a specific geo-location at a specific time. The system aggregates the records to create geo-specific time series for a geo-location over a specified time. The system creates aggregated time series from a subset of the geo-specific time series. The system selects a representative feature from the aggregated time series and creates a covariate matrix for each specific geographic area in computer memory. The system determines a specific state crop yield for a specific year using linear regression to calculate the specific state crop yield from the covariate matrix. The system determines a national crop yield for the specific year using the sum of the state crop yields for the specific year nationally adjusted.

Abstract: A building automation system (BAS) includes building equipment located within a building and a BAS network configured to facilitate communications between the building equipment. The building equipment operate to affect a variable state or condition within the building. The BAS includes a BAS-BIM integrator configured to receive BAS points from the BAS network and to integrate the BAS points with a building information model (BIM). The BIM includes a plurality of BIM objects representing the building equipment. The BAS includes an integrated BAS-BIM viewer configured to use the BIM with the integrated BAS points to generate a user interface. The user interface includes a graphical representation of the BIM objects and the BAS points integrated therewith.

Abstract: A substrate processing apparatus includes a stage, a light source, an optical assembly, a light receiver, and controller circuitry. The stage includes a first placing surface on which a substrate is to be placed, and a second placing surface that surrounds the first placing surface and on which a focus ring is to be placed. The optical assembly focuses light from the light source on a lower surface position, which is a position of a lower surface of the focus ring placed on the second placing surface. The light receiver receives light from the lower surface position. The controller circuitry detects at least one of a presence and an absence of the focus ring on the second placing surface, based on light received by the light receiver.

Abstract: An organic light-emitting diode display is disclosed. In one aspect, the display includes a display unit located on the substrate and including a display area and a non-display area surrounding the display area, and a thin film encapsulation layer sealing the display unit. The display also includes a voltage line formed in the non-display area and surrounding the display area, a metal layer formed of the same material as the voltage line, and a dam surrounding the display area and contacting the voltage line. The voltage line includes a first voltage line disposed in one side of the display area. The first voltage line includes a pair of first end portions and a pair of first connectors respectively connected to the pair of first end portions and extending away from the display area. The metal layer is disposed between the pair of first connectors. The dam contacts the metal layer.

Abstract: Semiconductor structures and method for manufacturing the same are provided. The method for manufacturing the semiconductor structure includes forming a first fin structure including first semiconductor material layers and second semiconductor material layers alternately stacked over a substrate and forming an isolation structure surrounding the first fin structure. The method for manufacturing the semiconductor structure also includes forming a first capping layer over the isolation structure and covering a top surface and sidewalls of the first fin structure and etching the isolation structure to form a first gap between the first capping layer and a top surface of the isolation structure. The method for manufacturing the semiconductor structure also includes forming a protection layer covering a sidewall of the first capping layer and filling in the first gap.

Abstract: A dual side cooling power module includes: a lower substrate including a recessed portion on at least one surface thereof, a semiconductor chip formed in the recessed portion, lead frames formed at both ends of the lower substrate, and an upper substrate formed on the semiconductor chip, a portion of the lead frames, and the lower substrate.

Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.