Abstract: The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in a parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapted and the coolant outlet adapter may provide support for the VRM.

Abstract: Systems, devices, and methods that ensures that an ultrasonic fingerprint detection process is not interfered with by using a screen protector. An example screen protector for a mobile device is disclosed that is capable of an in-screen fingerprint detection. The screen protector includes a first layer made of a clear rigid material and configured to be touched by a user. The screen protector also includes a second layer beneath the first layer and made of a film. Additionally, the screen protector includes a third layer beneath the second layer and configured to contact the mobile device. The third layer includes a fingerprint conduit configured to facilitate the in-screen fingerprint detection.

Abstract: A fan control circuit for controlling at least one fan of a power supply device includes a load sensing unit, a temperature sensing unit, a control unit connected to the load sensing unit, the temperature sensing unit and the fan, and a mode switching unit. The load sensing unit generates a load signal according to an output condition of the power supply device. The temperature sensing unit senses the temperature in the power supply device and generates a temperature signal. The control unit comprises a low-speed operating mode for controlling the fan according to the load signal, a mute mode for controlling the fan according to the temperature signal, and a full-speed operating mode for controlling the fan to run in a rated rotational speed. The mode switching unit controls the control unit to adjust the rotational speed of the fan by one of the three modes.

Abstract: A temperature control system (300) for a variable frequency drive (10, 100) includes a sealed enclosure (310), a power electronic component (330) and/or a power magnetic component (320) positioned inside the sealed enclosure (310), and a controller (400) configured to control a temperature of the power electronic component (330) and/or the power magnetic component (320) relative to an internal air temperature (Tair) inside the sealed enclosure (310) prior to an electrical energy application and operation of the power electronic component (320) and/or power magnetic component (320) to prevent condensation induced electrical failure of the power electronic component (330) and/or power magnetic component (320) utilizing a cooling system (340) and/or a heating system (350).

Abstract: Systems and methods described herein can provide a thermal interface for an electronic device including: obtaining an enclosure and a circuit within the enclosure, wherein the circuit is disposed within the enclosure such that there is space between the circuit and an internal surface of the enclosure; and positioning a thermally conductive material in the space between the circuit and an internal surface of the enclosure such that the thermally conductive material is in physical contact with an outer surface of the circuit and the internal surface of the enclosure to provide heat transfer from the circuit to the enclosure.

Abstract: A sensor may detect a coolant leak at or near an appliance that is slidable between a seated position and an ejected position relative to a rack. In the seated position, a coolant supply line may be coupled with a conduit of the appliance to convey coolant past the appliance. A biaser can bias the appliance toward the ejected position, and a latch may secure the appliance in a seated position against the biaser. A releaser can release the latch in response to coolant leak detection by the sensor and permit the biaser to move the appliance toward the ejected position, for example, which may cause the conduit to become disconnected from the coolant supply line to cut off flow to the leak.

Abstract: A display device is disclosed. The display device includes a display panel, a vapor chamber positioned behind the display panel, a board, which is positioned behind the vapor chamber and is coupled to the vapor chamber, and an adhesive member disposed between the display panel and the vapor chamber so as to be coupled thereto, wherein the vapor chamber includes a first plate, which defines a front surface thereof and faces the display panel, a second plate, which defines a rear surface thereof and is coupled to the first plate, and fluid flowing in a space defined between the first plate and the second plate, and wherein the first plate includes a coupler, which is depressed rearwards from the first plate and to which the adhesive member is coupled.

Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack and have openings that permit exhaust air to flow from the computing devices through the air barrier into a hot aisle. The rack may be configured to be connected to other similar racks to form a vertical annular cylinder, which may be tapered, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular cylinder to improve airflow.

Abstract: Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

Abstract: A wearable display device includes a device body, a heat dissipation processing module, and an inflation actuation module. The device body includes a front cover, a side cover, a fillable gas bag, a circuit board, and a microprocessor. The heat dissipation processing module includes a first actuator corresponding to the microprocessor for performing heat exchange for the microprocessor. The inflation actuation module includes a base member, a gas communication channel, a second actuator, and a valve component. When the second actuator and the valve component are driven, the valve component is opened to control gas introduction of the second actuator, and the second actuator is actuated to transmit the gas to the gas communication channel for gas collection, and the second actuator further transmits the gas to the fillable gas bag for inflating the fillable gas bag, so as to allow a user to wear the wearable display device stably.

Abstract: An actuating breathable material structure is disclosed and includes a supporting main body, a plurality of actuating breathable units and a plurality of micro processing chips. The supporting main body is made of a supporting matrix. The plurality of actuating breathable units and the plurality of micro processing chips are compounded and are integrally formed with the supporting matrix into one piece. By controlling the actuation of the plurality of actuating breathable units through the plurality of micro processing chips, a breathing effect resulting from gas transportation in a specific direction is performed.

Abstract: A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board.

Abstract: A mobile device case is described. The mobile device case includes a housing configured to retain a mobile device and an active cooling system integrated into the housing. The active cooling system configured to use vibrational motion to cool a surface of the mobile device.

Abstract: A power electronics submodule for mounting on a cooling device, has first and second surface sections next to one another, a substrate with a housing and includes a connection element, conductively connected by a contact to a track of the substrate and a connection section, arranged parallel to the substrate, the substrate arranged on the first surface section, the housing has a housing section, with a first main surface, arranged on the second surface section, and a second main surface, situated opposite the first main surface. In a non-mounted state a first main surface of the connection section is a first distance from the second main surface of the housing section in the housing region of a fastening device.

Abstract: An adhesive layered backflow preventer laminate, for use in impeding airflow from flowing in a backflow direction through the backflow preventer and a corresponding cooling fan, includes a thin front support layer adhered to a thin backflow flap layer, having a plurality of backflow flaps, which is adhered to a thin rear support layer. Each of the structural layers is adhered to the adjacent structural layer using a respective double-sided adhesive layer, by way of a manufacturing process that avoids the use of costly injection molded parts and machined plastic parts and metal components such as springs and hinges.

Abstract: A display apparatus includes a heat dissipation sheet and a first plate disposed on the rear surface of a display panel, a printed circuit board disposed on one surface of the first plate, a component disposed on one surface of the printed circuit board, and a second plate disposed adjacent to the first plate. The first plate includes a bent extended portion and a coupling portion, and the bent extended portion is not in contact with the heat dissipation sheet.

Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.

Abstract: A backplane is for electrically connecting electrical components. An embodiment is directed to the backplane and to a method for producing the same. An embodiment of the backplane includes a carrier plate, conductor tracks, which extend on and/or in the carrier plate, and at least one cooling element arranged on a conductor track for cooling the conductor track.

Abstract: The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.