Abstract: A heatsink system includes a heatsink plate having a first set of slots defined in a first face thereof and a second set of slots defined in a second face thereof opposite the first face. The first and second sets of slots are configured to house phase change material (PCM) therein.

Abstract: An electronic device is provided. The electronic device includes a device body provided with an accommodation space and an opening communicated with the accommodation space, a function module having a first state and a second state, and an ejecting mechanism including a connecting rod, a slider detachably connected to the function module, a driving member, and a guide rail that is disposed on the slider. The driving member is disposed in the accommodation space, a first end of the connecting rod is hinged to the device body, a second end of the connecting rod slides along the guide rail, and the slider is configured to switch between a first position and a second position.

Abstract: A hinge constituent component according to the disclosure includes a plate-like portion extending along a length direction, a pair of rotating shafts or a pair of bearing portions provided at each of both ends of the plate-like portion in the length direction, and at least one protruding portion protruding from the plate-like portion in a width direction of the plate-like portion.

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin disposed to cover the first surface and the first component; a shield film covering at least a side surface of the first sealing resin; a first ground terminal mounted on the first surface; and a protruding portion formed to extend laterally at any position of the first ground terminal in a direction parallel to the first surface. The protruding portion is electrically connected to a portion of the shield film that covers the side surface of the first sealing resin.

Abstract: An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.

Abstract: A heat radiation module comprises: a bracket having an upper surface, a lower surface, and a first side surface for connecting the upper surface and the lower surface, and a second side surface facing the first side surface; and a heat dissipation passage disposed in the bracket, wherein the bracket includes a groove formed on at least one surface among the upper surface and the lower surface, the heat dissipation passage includes a first passage disposed between one side of the groove and the first side surface and a second passage disposed between the other side of the groove and the second side surface, and a part of the first passage overlaps the groove extending in a direction from the first side surface toward the second side surface.

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Abstract: An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.

Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Abstract: An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.

Abstract: A container type variable-frequency drive skid includes a container body, wherein a containing space is provided in the container body, a wiring unit, a voltage transformation unit and a frequency conversion unit are arranged in the containing space, a first cooling unit and a second cooling unit are further arranged in the containing space, the first cooling unit comprises an air duct and a first heat dissipation fan arranged in the air duct, the voltage transformation unit is located in the air duct, air flows through the air duct under the action of the first heat dissipation fan to cool the voltage transformation unit, the second cooling unit comprises a cold guide assembly and a second heat dissipation fan, and the cold guide assembly abuts against the frequency conversion unit.

Abstract: A vertically oriented, electrically conductive enclosure includes at least three shield members. A first member has a first floor and a first sidewall that extends away from the first floor around a periphery of the first shield floor. A second member is electrically coupled to the first member and has a second floor and a second sidewall. A first portion of the second sidewall extends away from the second floor in a first direction. A second portion of the second sidewall extends away from the second floor in a second direction opposite to the first direction and engages the first sidewall. A third member is electrically coupled to the second member and has a shield cover and a third sidewall. The third sidewall extends away from the shield cover about a periphery of the shield cover and engages the first portion of the second sidewall.

Abstract: A small cell access node includes a housing, a radio module, a power supply module, and one or more antennas coupled to the radio module. The housing includes a floor and at least one sidewall extending around a perimeter of the floor. An air intake section of the sidewall is located at a first lengthwise end of the floor and defines an air intake port. An air exhaust section of the sidewall is located at a second lengthwise end of the floor and defines an air exhaust port. The floor includes a two floor portions residing primarily in different planes and an angled transition portion interconnecting the two floor portions. The transition portion defines an air and water exhaust port to allow water that enters the housing through the air intake and air exhaust ports, such as from wind-driven rain, to drain out of the housing.

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

Abstract: A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board.

Abstract: A portable system for carrying a monitor and a computing device inside a case. The case can be made from two shells attached together by a hinge. A monitor can be housed in each shell, the monitors operatively connected to each other. The monitor and any other components in the first shell can be connected to the monitor and any other components in the second shell via cables fed through a conduit connecting the first shell to the second shell. The conduit is on the inside of the case to protect the cables when the case is in the closed configuration. One or both shells can further have an auxiliary door through which a thin component, such as a keyboard, tablet, laptop, and the like can be inserted into the case. One or both shells can be equipped with ports for power, and communicating and networking with other devices.

Abstract: A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Abstract: The embodiments of the application provide a tiling component and a tiled display screen. A connector on a tiling panel is positioned by a positioning portion, so that the connector is aligned. Then, a fixation is achieved by fixing a mortise and tenon structure. As a result, multiple tiling panels are efficiently and seamlessly tiled through the connectors. The tiling component provided in the embodiments of the application improves the installation efficiency of the tiled display screen and simplifies the installation means. Moreover, it is possible to guarantee the seamless design between display units.

Abstract: An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.