Abstract: A portable electronic device is disclosed. The portable electronic device may include a laptop computing device that includes a base portion and a display housing rotationally coupled to the base portion. The base portion includes a fan designed to drive heated air out of the base portion, thus cooling the portable electronic device. A dynamic (movable) air diverter is integrated into the base portion near the fan's outlet. The air diverter is designed to direct airflow from the fan outlet. Moreover, the air diverter can be repositioned by, for example, rotating the display housing relative to the base portion. As a result of the repositioned air diverter, the airflow from the fan outlet is redirected out of the portable electronic device through a different location. The air diverter can be positioned in different discrete locations, or alternatively, can move continuously with the rotational movement of the display housing.

Abstract: A base unit with a base dent region supports a main display unit having a main display panel. The main display unit is integrated in the base dent region and is rotatable about a base axis between a main loaded position and a main viewing position where the main display panel is visually accessible to a user from a predefined head position. The display device includes an auxiliary display unit which is integrated in a main dent region of the main display unit. The auxiliary display unit includes an auxiliary display panel which is designed to be visually accessible to the user from the predefined head position by rotating the main display unit about the base axis.

Abstract: A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.

Abstract: An electronic device includes a housing including a first housing and a second housing, a display extending from the first housing to the second housing, and a hinge structure including a hinge connected to the first housing and the second housing.

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

Abstract: A heat dissipating system for electronic devices includes a first heat dissipation device, a second heat dissipation device, and a thermal conduction component. The thermal conduction component is disposed around the first heat dissipation device and configured to thermally contact a heat source. The second heat dissipation device is disposed adjacent to the thermal conduction component. The first heat dissipation device is configured to generate a first working fluid toward the thermal conduction component, such that the heat transferred from the heat source to the thermal conduction component is dispersed in a plurality of directions directing away from the first heat dissipation device. The second heat dissipation device is configured to generate a second working fluid, such that the heat distributed adjacent to the second heat dissipation device is dissipated in at least one direction directing away from the second heat dissipation device.

Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Abstract: A cabinet air duct, a cabinet assembly and a photovoltaic inverter are provided according to the present application, where the cabinet air duct includes a cabinet and an air duct arranged in the cabinet. The cabinet is provided with an air inlet and an air outlet that are in communication with the air duct. The air inlet is arranged on a first side surface of the cabinet, the air outlet is arranged on a second side surface of the cabinet, and the first side surface and the second side surface are two opposite side surfaces of the cabinet.

Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.

Abstract: The present application provides a display panel and a display device. The display panel includes a panel main body and a heat dissipation layer disposed on one side of the panel main body. The panel main body includes a first body portion. The heat dissipation layer includes a first heat dissipation portion corresponding to the first body portion. A surface of the first heat dissipation portion on one side away from the panel main body is a non-flat surface, so that a contact area of the heat dissipation layer with an outside of the display panel is increased, to avoid display abnormalities on the display panel due to poor heat dissipation.

Abstract: An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

Abstract: The present disclosure provides a fan module and a case including the fan module. The fan module includes a fan, a fan bracket and a traction structure. The fan bracket includes: a fixed bottom plate for carrying and fixing the fan; and a connection structure, connected to the fixed bottom plate and used for being connected to a case through plugging. The traction structure is mounted on the fan bracket, and is used for pulling the fan bracket from the inside of the case to the outside of the case. In the present disclosure, the fan module is plugged into the case, and is pulled to the outside of the case from the inside of the case through a traction interface. In this way, the fan maintenance is implemented without disassembling the case or cutting off the power, the maintenance efficiency is improved, and the maintenance cost is reduced.

Abstract: An electronic device having an aluminum or copper foil heat dissipator includes a casing, an electronic structure disposed in the casing, and an aluminum or copper foil heat dissipator. A surface of the electronic structure has a heat source element. The aluminum or copper foil heat dissipator is a 3D aluminum or copper foil structure formed by stamping and includes a bottom, a surrounding portion, and a 3D space formed between the bottom and the surrounding portion. The bottom is thermal conductively coupled to the heat source element. A surface of the aluminum or copper foil heat dissipator is partially/entirely thermal conductively coupled to an inner surface of the casing. With the characteristics of aluminum or copper foil that is easy to expand into a 3D shape during processing and could closely fit the inner surface, the heat generated by the heat source element could be dissipated from the 3D aluminum or copper foil with a large contact area, achieving better heat dissipation effect.

Abstract: A display module includes a display panel and a support structure. The display panel includes a display portion and a bending portion connected to the display portion. The display portion includes a first non-bending area, a bending area, and a second non-bending area that are sequentially arranged in a direction away from the bending portion. The support structure is disposed on a non-light-emitting side of the display portion and includes a first flexible part and a rigid part, an orthographic projection of the first flexible part on the display panel is within the first non-bending area, and an orthographic projection of the rigid part on the display panel is overlapped with the first non-bending area, the second non-bending area, and the bending area.

Abstract: Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.

Abstract: Embodiments of the present invention are directed to systems, devices, and methods for data centers. In one example, a lockable enclosure for a data drive. The lockable enclosure includes a housing configured to house data drive circuitry and a port coupled to the housing and configured to connect to an external data device for transferring data from or to the data drive circuitry. The lockable enclosure also includes a sliding mechanism movable relative to the housing and configured to move within the housing between a position whereby the port is accessible to a position whereby the port is inaccessible.

Abstract: A fan cage, a fan module, and an electronic device are provided, where the fan cage includes a cage body having two surfaces and at least two ventilation ports and a latching mechanism arranged at the cage body, the two surfaces are located opposite to each other, the two ventilation ports are respectively located at the two surfaces, the latching mechanism is arranged at the cage body and comprises at least one latch movably protruding outwardly from one of the two surfaces.

Abstract: Described herein are DC-DC converters having various immersion-cooling features enabling high-power applications, such as cross-charging electric vehicles. For example, the inductor of a DC-DC converter may be formed using metal and insulator sheets stacked and wound into an inductor coil assembly. The metal sheet comprises grooves, extending parallel to the coil axis and forming coil fluid pathways through this assembly thereby providing immersion cooling to the inductor. An inductor-cooling liquid may be pumped through these fluid pathways while being in direct contact with the metal sheet, at least around the grooves. In some examples, these grooves are distributed along the entire length of the metal sheet. Multiple inductors may be used to enable operations of multiple converter units, e.g., operating out of phase. These inductors may be fluidically interconnectors and have the same cooling features.

Abstract: A cooling apparatus including a heat sink to which a heat generating body is joined, a main flow generation device configured to generate a main flow for cooling the heat sink, and an induced flow generation device configured to electrically generate an induced flow. The induced flow generation device is provided to a support member facing the heat sink.

Abstract: A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.