Patents Examined by Nickolas Harm
  • Automatic label stripping machine
    Patent number: 9199758
    Abstract: An automatic label stripping machine includes a base, a reel shaft rod, a label stripping unit, a control unit and a sensing unit. Labels can easily be stripped for use and a label reel can conveniently be assembled, replaced and reclaimed by means of the control unit and the sensing unit. In addition, the members of the automatic label stripping machine of this invention can be replaced and repaired conveniently.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: December 1, 2015
    Inventor: Hsiu-Man Yu Chen
  • Method for stripping a product substrate from a carrier substrate
    Patent number: 9186877
    Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: November 17, 2015
    Assignee: EV Group GmbH
    Inventors: Friedrich Paul Lindner, Jurgen Burggraf
  • Bridge splicer and method of splicing conveyor belts
    Patent number: 9188192
    Abstract: A belt splicer (80) for butt-welding conveyor belts with longitudinal walls and methods for splicing belts. The belt splicer (82, 83) has bridges supporting belt clamps (88) above clamp jaws (12, 13). The bridges are attached at opposite ends to the corresponding jaws. Slots (96) along intermediate spans of the bridges allow the belt clamps to be adjustable positioned along the bridges. Adjacent belt clamps can be positioned with a space between them to accommodate the walls.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: November 17, 2015
    Assignee: Laitram, L.L.C.
    Inventors: Warren E. Cancienne, Jr., Bryan M. Dillenkoffer, Steven P. Matherne
  • Peeling system, peeling method, and computer storage medium
    Patent number: 9165758
    Abstract: A peeling system includes: a carry-in/carry-out station that loads/unloads substrates to be processed, support substrates, or stacked substrates in which these are made to adhere; a peeling process station that carries out prescribed processing on substrates to be processed, support substrates and stacked substrates; and a transport station provided between the carry-in/carry-out station and the peeling process station. The peeling process station has a peeling device that peels the stacked substrates, a first washing apparatus that washes peeled substrates to be processed, and a second washing apparatus that washes the peeled support substrates. The pressure inside the transport station is a positive pressure in relation to the pressure inside the peeling device, the pressure inside the first washing apparatus, and the pressure inside the second washing apparatus.
    Type: Grant
    Filed: December 26, 2011
    Date of Patent: October 20, 2015
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Naoto Yoshitaka, Yasuharu Iwashita, Masataka Matsunaga
  • Peel-off apparatus, peel-off system, peel-off method and computer storage medium
    Patent number: 9162435
    Abstract: Disclosed is a peel-off apparatus comprising: a first holding unit configured to hold a first substrate of a superimposed substrate; a second holding unit configured to hold a second substrate of the superimposed substrate; and a moving unit configured to move a part of outer periphery of the first holding unit to be separated from the second holding unit. The first holding unit includes: a plate type elastic member connected to the moving unit; and a plurality of adsorbing units provided in the elastic member to adsorb the first substrate. An outer periphery adsorbing unit which becomes a peel-off beginning point includes: a pad member whose adsorbing surface of the first substrate is open to form a hollow portion; and a support member fitted into the hollow portion of the pad member having a hardness higher than that of the pad member.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: October 20, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Masaru Honda, Ryoichi Sakamoto
  • Device for separating a substrate from a carrier substrate
    Patent number: 9138978
    Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: September 22, 2015
    Assignee: EV Group GmbH
    Inventors: Markus Wimplinger, Friedrich Paul Lindner
  • Delamination apparatus and inline thermal imaging system
    Patent number: 9132620
    Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, an acceptor substrate positioned on the lower supporting member, and a donor film laminated along with the lower supporting member via the acceptor substrate interposed therebetween according to the edge of the acceptor substrate, a gripper positioned at an end side of the stage to grip the end of the donor film and moving in a direction away from the acceptor substrate, and a peeling roll positioned on the donor film, including a supporting region supporting a portion of the donor film positioned between the acceptor substrate and the gripper, and including a peeling roll main body rotating itself in a direction of the gripper and a blind selectively covering the supporting region.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: September 15, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventor: Kyung-Hyun Ahn
  • Method and device for recycling labeled plastic articles
    Patent number: 9126354
    Abstract: A method and a device for recycling labeled plastic articles are described. Accordingly, the labels are detached from the plastic articles and the plastic articles treated in this way are sorted in particular automatically. During sorting, plastic articles from which the labels have not been properly detached are sorted out and again subjected to the treatment for detaching the labels.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: September 8, 2015
    Assignee: KRONES AG
    Inventor: Thomas Friedlaender
  • Substrate separation apparatus and method
    Patent number: 9125295
    Abstract: An apparatus for separating a first substrate and a second substrate which are in contact with each other, includes an upper transfer part which fixes the first substrate and transfers the first substrate in a positive X-axis direction in an XY coordinate system comprised of an X axis and an Y axis which perpendicularly intersect each other and a lower transfer part which is disposed under the upper transfer part with a gap therebetween and fixes and transfers the second substrate, wherein the lower transfer part comprises a first transfer section which transfers the second substrate in the positive X-axis direction, and a second transfer section which transfers the second substrate in the positive X-axis direction as well as a negative Y-axis direction.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: September 1, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Jun Lee, Young Woo Lee, Joon Hyung Kim
  • Room temperature debonding composition, method and stack
    Patent number: 9117861
    Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: August 25, 2015
    Inventors: Venkat Dukkipati, Kei Kawasaki, Larry Rhodes, Toshihiro Sato
  • Film peeling device
    Patent number: 9108397
    Abstract: A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: August 18, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyu-Bum Kim, Jae-Seok Park, Jin-Han Park, Dong-Sul Kim
  • Devices and methods of operation for separating semiconductor die from adhesive tape
    Patent number: 9111984
    Abstract: The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: August 18, 2015
    Assignee: FREESCALE SEMICONDUCTOR INC.
    Inventors: Audel A. Sanchez, David F. Abdo, Michael L. Eleff
  • Method for creating an overlap by sheet welding
    Patent number: 9096015
    Abstract: The present invention relates to a method and apparatus for forming overlaps by welding a main sheet 2 and an additional sheet 5. The welding takes place by heating the contact area, which is made of a thermoplastic material, to a melting temperature, and it is based on performing differentiated heating on each of the outer surfaces 4,7 of the sheets 2,5.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: August 4, 2015
    Inventor: Jordi Carbonell Puig
  • Delamination apparatus and inline thermal imaging system
    Patent number: 9099688
    Abstract: A delamination apparatus includes a stage mounted with a lower supporting member, a donor film laminated to the lower supporting member, and an acceptor substrate sealed between the lower supporting member and the donor film, a first gripper positioned at an end side of the stage, the first gripper being configured to grip an end of the donor film and to move with the end of the donor film away from the acceptor substrate, and a first filling roll positioned over the donor film, the first filling roll being configured to blow ions toward the donor film while rotating toward the first gripper.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Kyung-Hyun Ahn
  • Wire handling for vehicle glazing panel cut out
    Patent number: 9095988
    Abstract: A dispensing system for dispensing cutting wire to be used in a glazing panel cut out procedure has a mounting device with a docking station for docking a wire store device. The wire store device mounts on the docking station in order to dispense the wire. The mounting device can have a rotary means operable to pay out cutting wire from the system. The rotary means is controllable to adjust the applied torque required to operate the rotary means.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: August 4, 2015
    Assignee: BELRON HUNGARY KFT-ZUG BRANCH
    Inventor: William Finck
  • Method of splicing composite core
    Patent number: 9090026
    Abstract: A method of splicing together a first composite core and a second composite core can include: positioning a first flange of the first composite core adjacent to a second flange of the second composite core, applying an adhesive, and locating a first magnet and a second magnet to provide a pressure on the adhesive.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: July 28, 2015
    Assignee: Bell Helicopter Textron Inc.
    Inventors: James D. Hethcock, Jonathan A. Freeman
  • Method for disassembling bonded body, and adhesive
    Patent number: 9067398
    Abstract: Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: June 30, 2015
    Assignee: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Yoshitsugu Goto
  • Labeling system
    Patent number: 9051072
    Abstract: A labeling system may include a labeling device which applies labels to objects, for example, containers, and a loading device which is arranged upstream of this labeling device and which supplies the labeling device with labels The loading device may comprise a transport device which transports a second label strip and comprises at least two carriers for first label strips wound onto label rolls The carriers may be arranged next to one another on holding devices. A joining unit may be provided which can be displaced between the carriers in a first movement direction and which joins sections of the first label strips, which are arranged on the carriers, to sections of the second label strips, which are guided in the transport device.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: June 9, 2015
    Assignee: KRONES, AG
    Inventors: Erich Eder, Roland Ederer, Dieter Hafner
  • Method for detaching a semiconductor chip from a foil
    Patent number: 9039867
    Abstract: A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3<H2; lowering of the plates until all plates are lowered, and moving away of the chip gripper, wherein the chip gripper touches the semiconductor chip before lowering the last three plates.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 26, 2015
    Assignee: Besi Switzerland AG
    Inventors: Ernst Barmettler, Fabian Hurschler, Brian Pulis
  • Chip sorting apparatus
    Patent number: 9011638
    Abstract: A method of chip sorting comprises providing a chip holder having a first surface; providing multiple chips on the first surface; providing a chip receiver having a second surface, wherein the second surface faces the first surface; attaching the multiple chips to the second surface; decreasing an adhesion between the multiple chips and the first surface; and separating the multiple chips from the first surface after the step of decreasing the adhesion between the multiple chips and the first surface.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: April 21, 2015
    Assignee: Epistar Corporation
    Inventors: Chen-Ke Hsu, Liang Sheng Chi, Chun-Chang Chen, Win-Jim Su, Hsu-Cheng Lin, Mei-Ling Tsai, Yi Lung Liu, Chen Ou