Abstract: A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate.

Abstract: A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.

Abstract: According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck.

Abstract: A device for removing a protective film off a sheet such as tickets or the like is described. The device has at least one removal or scraping roll of the protective film and at least one drawing or pulling roll of the sheet opposite the scraping roll and between which the sheet passes. The device also has a base and a roll unit mobile or removable with respect to the base and including the scraping roll and the drawing roll.

Abstract: A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: The present invention provides a polarizing sheet removing tool and removing method. The tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. The present invention uses a tool on which a piston device and adhesive dissolving liquid are provided so that in removing a polarizing sheet, the adhesive dissolving liquid can be guided by a guide tube toward a blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A film stripping mechanism, comprising: a base; a platform disposed on the base and having a substrate to be stripped of film placed thereon; a blade disposed above an upper surface of the platform and capable of contacting the substrate to be stripped of film placed on the platform, the platform and the blade being movable relative to each other so as to strip off a film on the substrate to be stripped of film; an automatic alcohol-spraying module contacting the blade for spraying outwards alcohol and allowing the alcohol to flow toward the substrate to be stripped of film along the blade. The film stripping mechanism can improve the yield rate of film stripping and the stripping efficiency, and reduce breakage rate of the substrates.

Abstract: A synthetic quartz glass substrate having a resist film coated thereon is treated by immersing it in a terpene-containing solvent until the resist film is released, and rinsing the substrate with water.

Abstract: Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

Abstract: An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

Abstract: Disks stuck together in a stack are separated by placing the disks on a shaft of a vibratory apparatus and vibrating the shaft to vibrate the disks by contact of the disks with the vibrating shaft to separate them and also constrain the disks with the shaft as the disks are vibrated.

Abstract: A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.

Abstract: Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×107 Pa or more as measured by dynamic viscoelastic measurement.

Abstract: A supply group of a packing band from reels, with an automatic change of the reel for an object-packing machine, includes a supply conveyor along which the packing band runs, a device for transversally cutting the band located at a start of the supply conveyor, a device for supporting one reel of the band of slim packing material and a device for supporting a second reel of band of slim packing material. The group includes a first entry conveyor of the first band from the first reel to the supply conveyor, a second entrance conveyor of the second band from the second reel to the supply conveyor, a device for advancing for introducing or extracting the front end of the first band to or from the supply conveyor, and a device for advancing for introducing or extracting a front end of the second band into or from the supply conveyor.

Abstract: A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

Abstract: End portions of a sheet-shaped rubber member are manually and firmly joined together. A pair of opening/closing members is arranged to sandwich and move along the end portions. An opening/closing mechanism opens/closes the pair of opening/closing members between an open position and a closed position where the end portions are joined together. A pair of guiding rollers is provided to one opening/closing member and guides each of the end portions to a joining position. A pressing roller is provided to the other opening/closing member and presses each of the end portions onto the guiding roller. A pair of joining rollers is provided to the pair of opening/closing members, respectively, and sandwiches each of the end portions guided by the pair of guiding rollers. The joining rollers roll on each of the opposing end portions and abut and join the end portions to each other.

Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

Abstract: A method for disconnecting a first mechanical part from a second magnetic mechanical part, the first mechanical part being adhered to the second magnetic mechanical part by an adhesive film along a connecting area. In the method, a magnetic field is generated at least within the connecting area so as to generate, by induction, eddy currents in the second magnetic mechanical part, to soften the adhesive film and enable disconnection of the first and second mechanical parts.