Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Abstract: A reactive material stack is formed above a surface of a base substrate. The reactive material stack includes metals which when subjected to heat energy or electrical energy can undergo a solid state reaction that provides an intermetallic compound. The intermetallic compound that forms has a smaller unit volume than the initial reactive material stack and, as such, induces a tensile stress within the base substrate which, in turn, initiates crack formation within the base substrate. This represents an initial stage of spalling. The crack formation can be propagated along a fracture plane within the base substrate by continued spalling.

Abstract: A film peeling method for a film-coated flat wire that is performed by a film peeling device including: a rotational holder that can rotationally convey in a perpendicular direction to a rotational axis; a positioning mechanism that positions a film-coated flat wire in a longitudinal direction; and a working section that is provided in plural, aligned at specified intervals, and works an end portion of the film-coated flat wire, the method includes: holding the film-coated flat wire that is cut in a specified length in advance by the rotational holder; rotationally conveying the film-coated flat wire that is held by the rotational holder in the perpendicular direction to the rotational axis; positioning the conveyed film-coated flat wire by the positioning mechanism; and working the end portion of the film-coated flat wire by the working section.

Abstract: A film peeling apparatus that peels a film attached to a substrate includes a chamber, a transfer unit, and first peeling rollers. The transfer unit is disposed in the chamber to transfer the substrate. The first peeling rollers are disposed in the chamber, each of the first peeling rollers includes a first electrostatic chuck to adsorb a first film attached to the substrate. The first peeling rollers roll the adsorbed first film to peel the first film from the substrate.

Abstract: A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.

Abstract: A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target.

Abstract: The subject invention includes methods and apparatus for joining treads. Such methods include the step of providing a first tread portion and a second tread portion for forming a joined tread, each tread portion comprising a section of tire tread extending lengthwise from a terminal end. Additional steps include providing a first fixture configured to retain the first tread portion and a second fixture configured to retain the second tread portion and securing the first tread portion into the first fixture and securing the second tread portion into the second fixture, each of the first and second fixtures being arranged within the first and second fixtures such that the terminal end of each tread portion is in communication with a joining side of each fixture. The methods further include directing the terminal ends towards each other and into forceful engagement with an elastomeric joining material arranged between the terminal ends.

Abstract: A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

Abstract: A film peeling apparatus is provided. The film peeling apparatus comprises: a film peeling roller which is sticky; at least one peeling belt which is non-sticky; at least one first rotation shaft which is configured to drive the peeling belt to rotate, wherein when the film peeling roller rotates, the film peeling roller sticks to the film peeling belt and a release film such that the release film is peeled from an original film.

Abstract: A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly.

Abstract: A polarizing sheet removing tool includes a handle and a blade mounted on the handle. The handle includes a main body, a piston device mounted on the main body, and a guide tube mounted on the main body. The main body forms therein a channel for containing an adhesive dissolving liquid. The piston device is mounted inside the channel. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid contained in the channel to the blade. In removing a polarizing sheet, the adhesive dissolving liquid can be guided by the guide tube the blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: A method is provided for removing a polarizing sheet with a tool that includes a handle including a main body forming therein a channel for receiving adhesive dissolving liquid, a piston device mounted inside the channel, and a guide tube mounted on the main body, and a blade mounted to the handle. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid from the channel to the blade. The polarizing sheet is removed by lifting up a portion of the polarizing sheet and placing the blade against bonding adhesive between the polarizing sheet and a substrate to which the polarizing sheet is attached to allow the adhesive dissolving liquid to be guided by the guide tube toward the blade for subsequently flowing toward and dissolving bonding adhesive.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: Provided are a substrate separation apparatus and method. The substrate separation apparatus includes: an upper transfer part which fixes the upper substrate and transfers the upper substrate in a positive X-axis direction in an XY coordinate system composed of an X axis and a Y axis intersecting each other; and a lower transfer part which is installed under the upper transfer part with a gap therebetween and fixes and transfers the lower substrate, wherein the lower transfer part includes: a lower holding unit on which the lower substrate is placed; and a lower guide unit which includes path guides for guiding movement of the lower holding unit, wherein the path guides include a first path guide which is parallel to the X axis and a second path guide which is continuous with the first path guide and contacts a straight line having a negative slope in the XY coordinate system.

Abstract: Techniques are disclosed for a cutting apparatus that can be used to cut a target layer within a display module, e.g., a liquid crystal display that includes a protective cover glass. The cutting apparatus includes a platform that supports a track. The cutting apparatus also includes a linear slide that is configured to both hold the display module in place and travel along the track, where the movement of the linear slide along the track is driven by a mass that is in free fall. The cutting apparatus further includes a cutting wire, where the cutting wire is positioned relative to the target layer and oscillates to cut the target layer as the linear slide moves along the track. Additional techniques are disclosed and directed toward a method for operating the cutting apparatus described above.

Abstract: A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.

Abstract: A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly.

Abstract: The present invention describes a dispenser of protective covers for the sole of a shoe. The sole covers are disposed on a sheet that is placed within the dispenser. The dispenser comprises a series of roller supports that are adapted to position the sheet of solve covers onto an exposed platform. A user steps the exposed platform in order to apply the cover to the user's footwear and remove the sole cover from the sheet. The top of the sole cover includes an adhesive that enables the cover to adhere to the sole of the user's shoe, thereby enabling a user to walk around the house while reducing the likelihood that the user would spread dirt therein.

Abstract: Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit.