Abstract: A coaxial connector arrangement for transferring high frequency microwave signals between a coaxial cable and a further device is disclosed. In many present systems, the connector arrangement whereby microwave signals are passed from a coaxial cable to a device or the like at high frequencies has a tendency of radiating. Not only do the radiative emissions lose power, but this radiation can combine with the desired signals to form intermodulation products which further lose signal power and also distort the signal. The mating faces of the connector provide a malleable raised line portion which is disposed about the central conductor whereby a continuous line contact is defined on the mating components about the inner conductor, thereby preventing emission of high frequency signals which may interact with the intended signals.

Abstract: A module for radio frequency signal circuits includes an electrically conductive housing. Coax connectors are secured to the rear face of the housing. A circuit board is contained within the interior spaced between sidewalls of the housing. A ground side of the circuit board includes a layer of electrically conductive material which is electrically connected to the housing. Coax cables extend within the interior of the housing from the coax connectors and between the ground side of the circuit board and an opposing sidewall. An opposite side of the circuit board contains circuit components inner connected with one another through a plurality of circuit paths. The components include directional couplers connected in series to combine branch circuits with each branch circuit having a separate attenuator.

Abstract: A high efficiency radio frequency (RF) impedance matching network containing an "L-type" inductor-capacitor (LC) circuit where the capacitor is a variable capacitor coupled from an input port to ground and the inductor is a variable inductance inductor coupled from the input port to an output port. A blocking capacitor is provided between the inductor and the output port and a ceramic capacitor is coupled in parallel across the variable capacitor. The impedance match is tuned by physically adjusting tuning elements of both the inductor and capacitor. The variable inductor contains an improved inductor tuning element that optimizes current flow in the tuning elements and inductor. To further improve the efficiency of the matching network, the assembly uses an improved enclosure interior finish and various circuit optimization techniques that reduce contributions to match loop resistance.

Abstract: A multiple band termination circuit, comprising a first resistor coupled in signal communication with an input and an open stub to form a nominal termination at a high frequency band, and a second resistor coupled in series to the first resistor with a high impedance transmission line, the second resistor and the first resistor cooperating together to form a nominal termination at a low frequency band.

Abstract: A multilayered balun transformer in which not only loss can be suppressed but also phase difference or level difference between balanced signal terminals can be suppressed and which become easy to design. In the multilayered balun signal transformer, a coil 4 and a capacitor C1 are formed in a dielectric by a multilayered structure to thereby form a high-pass filter 6. A low-pass filter 9 is formed from another combination of a coil 7 and a capacitor C2. The high-pass filter 6 and the low-pass filter 9 are arranged lengthwise in the direction of multilayer so that the capacitors C1 and C2 are present on extensions of magnetic flux generated in the inside of the coils 4 and 7 respectively.

Abstract: A high power water load for microwave and millimeter wave radio frequency sources has a front wall including an input port for the application of RF power, a cylindrical dissipation cavity lined with a dissipating material having a thickness which varies with depth, and a rear wall including a rotating reflector for the reflection of wave energy inside the cylindrical cavity. The dissipation cavity includes a water jacket for removal of heat generated by the absorptive material coating the dissipation cavity, and this absorptive material has a thickness which is greater near the front wall than near the rear wall. Waves entering the cavity reflect from the rotating reflector, impinging and reflecting multiple times on the absorptive coating of the dissipation cavity, dissipating equal amounts of power on each internal reflection.

Abstract: A line coupler is provided having a bus line piece, at least one transformer, two electrically shielded housings and a coupling site. The transformer is equipped with two primary and two secondary winding terminals. The two primary winding terminals are connected to the pair of coupling elements located at the coupling site. Each coupling element is connected to one of the bus line wires contained in the bus line piece. The secondary winding terminals are connected to branch line wires, which are brought out from the secondary electrical shielded housing. The two electrically shielded housings are electrically connected to each other by two connectors, these connectors also allow the two housings to be releasably connected.

Abstract: A nonreciprocal circuit device that avoids the problems of increased loss and narrowed frequency bandwidth when used with a low power supply voltage. An isolator (nonreciprocal circuit device) has a plurality of center electrodes (2 through 4) disposed so as to intersect and having a ferrite (5) disposed in alignment with the point of intersection, to which a DC magnetic field HDC is applied. An impedance conversion circuit (6) is added to the port of any one of center electrodes (2 through 4), setting the input impedance Zi to 2<Zi<12.5 ohms.

Abstract: The present invention provides for high speed signal buses in printed circuit boards. For high speed operation, each signal line of a bus has substantially the same electrical length as the other signal lines and forms a loop in two halves, each half electrically shielded from the other half. Each signal line has a first and a second terminal, with each terminal connected to a reference bias voltage through a first resistance which matches a loaded characteristic impedance of the signal line. The reference bias voltage is set at a midpoint of signal voltage swings on the signal line. Such high speed buses have particular applications to high speed memory systems with DRAMs.

Abstract: Interconnections are made through a planar circuit by a monolithic short-circuited transmission path which extends from a circuit portion of the planar circuit to the opposite side. The opposite side is ground sufficiently to remove the short-circuiting plate, thereby separating the previously monolithic conductors, and exposing ends of the separated conductors of the transmission path. Connection is made between the exposed conductors of the transmission path and the registered contacts of a second planar circuit by means of electrically conductive, compliant fuzz buttons. The transmission path may be a coaxial path useful for RF.

Abstract: A waveguide feed is fabricated by first creating a lead frame (10) from a piece of conductive material. The lead frame (10) is shaped by bending arms (22) and probe portions (18) on the lead frame (10) into a desired shape. The lead frame (10) is then placed in a mold and dielectric molding material is added around relevant portions of the lead frame (10). After the dielectric molding material has solidified, excess molding material and extraneous portions of the lead frame (10) are removed from the molded feed assembly. The assembly can then be connectorized and inserted into a waveguide.

Abstract: A power divider/combiner is formed from multimode dielectric waveguides in hich energy in a single mode is translated into a plurality of modes in the multimode waveguide, each mode is separately amplified and applied to another multimode waveguide that combines the modes in phase at the output thereof.

Abstract: A radio-frequency power amplifier includes a multiple-FET chip that is flip-mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The network includes a coplanar waveguide having an elongate waveguide signal conductor for each gate terminal on the FET chip with a distal end spaced from the connection region and a proximal end in the connection region. The distal ends are connected to a single base input conductor. The proximal ends are flip-mounted to respective ones of gate terminals of the FET chip. A capacitor couples each of the input signal conductor distal ends to an adjacent ground conductor. The signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip flip-mounted to the coplanar transmission line conductors, and may be formed as coplanar waveguides with open-ended signal conductors or as overlay capacitors.

Abstract: An E-H matching apparatus includes an E-plane branch waveguide connected to an E-plane of a waveguide body, an H-plane branch waveguide connected to an H-plane of the waveguide body, and plungers provided in the E-plane branch waveguide and the H-plane branch waveguide, respectively. The plungers are moved to establish impedance matching between the waveguide and a load. The H-plane branch waveguide has a bend portion formed in close proximity to the waveguide body.

Abstract: A flat flexible electrical cable includes a pair of pseudo-twisted conductors on a flexible dielectric substrate. Each conductor includes alternate straight and oblique sections. The straight sections of the conductors are generally parallel to each other and of uniform width. The oblique sections of the conductors cross each other at a crossover point. Each oblique section of each conductor is reduced in width uniformly in a direction from the straight-to-oblique transfer point of the respective conductor to the crossover point of the conductors.

Abstract: A power amplifier (517) for amplifying an operating signal includes an amplifier (538), an amplifier (540), and a power combiner (518) with harmonic selectivity. The power combiner (518) includes a transmission line section (541), a transmission line section (545), and a resistor (554). The transmission line section (541) is coupled to an amplifier output of the amplifier (538), and the transmission line section (545) is coupled to an amplifier output of the amplifier (540) and to the transmission line section (541). A capacitor (546) is coupled in parallel to a transmission line section (542) of the transmission line section (541), and a capacitor (548) is coupled in parallel to a transmission line section (544) of the transmission line section (545).

Abstract: The waveguide window assembly disclosed herein is particularly adapted for use in conjunction with a waveguide housing of a high expansion material such as aluminum. The window is formed of a glassy material having a relatively low coefficient of thermal expansion and is provided with a frame of a material having a matching coefficient. The housing is provided with an opening for receiving the frame with substantial clearance. A wall member is interposed between the frame and the edges of the opening with solder filling the space between the wall member and the frame and also the space between the wall member and the edges of the opening, the wall member being constructed of a material having a coefficient of thermal expansion which is intermediate those of the housing material and the frame material.

Abstract: Inexpensive and reliable apparatus for blanking the signal path between an antenna and a transmitter or a receiver to protect them from harmful radiation in the absence of power forms supplied thereto. The apparatus is preferably formed as a printed circuit waveguide switch window having a plurality of parallel conductors, such as metal wires or printed circuit traces, disposed on a dielectric substrate. The waveguide switch window is secured between two sections of waveguide. The conductors have a predetermined separation and width that are designed to appear as a solid metal surface that rejects radiation over a wide bandwidth. A bias terminal is coupled to the plurality of conductors, and insulating material is disposed between the bias terminal and the conductors to insulate the top portion of the grid array from the adjacent waveguide. The lower portion of the grid array is grounded to the adjacent waveguide.

Abstract: A ribbon and a bonding wire are connected respectively to a high-frequency input and output of a microwave circuit, the width of the ribbon and/or the thickness of the bonding wire being varied continuously or discontinuously at a portion other than a portion used for bonding. By applying the ribbon and bonding wire to a microwave circuit package including a metallic substrate and sealing therein an MMIC mounted to the metallic substrate, desired high-frequency characteristics of the MMIC can be obtained.

Abstract: The invention provides an impedance matching and power control system not resorting to mechanical control for a device for high frequency plasma treatment. An impedance matching unit 14 inserted in the terminal end of a power feed line 3 extending from a high frequency power oscillator 1 to a plasma chamber 2 comprises phase detecting means 17, a load-associated detector 19 having the function of detecting voltage, current, and phase angle, and an arithmetic and output section 21, whereby the impedance matching unit delivers a frequency control signal corresponding to the detected phase and a power signal representing the consumed power of the plasma chamber as calculated from the voltage, current and phase angle.