Patents Examined by Peter DungBa Vo
  • Patent number: 10790159
    Abstract: The systems and methods described herein provide for the fabrication of semiconductor package substrates having magnetic inductors formed in at least a portion of the through-holes formed in the semiconductor package substrate. Such magnetic inductors are formed without exposing the magnetic material disposed in the through-hole to any wet chemistry (desmear, electro-less plating, etc.) processes by sealing the magnetic material with a patterned sealant (e.g., patterned dry film resist) which seals the magnetic material prior to performing steps involving wet chemistry on the semiconductor package substrate. Such beneficially minimizes or even eliminates the contamination of wet chemistry reagents by the magnetic material should the magnetic material remain exposed during the wet chemistry processes. The patterned sealant is removed subsequent to the semiconductor package processing steps involving wet chemistry.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Chong Zhang, Yikang Deng, Junnan Zhao, Ying Wang
  • Patent number: 10785879
    Abstract: A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: September 22, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tatsuya Katoh, Masanori Ito, Masaki Kutsuna
  • Patent number: 10785865
    Abstract: A method for manufacturing an interconnect structure is provided. The method includes the following steps. An opening is through a substrate. A low-k dielectric block is formed in the opening. At least one first via is formed through the low-k dielectric block. A first conductor is formed in the first via.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jiun-Yi Wu, Chien-Hsun Lee, Chewn-Pu Jou, Fu-Lung Hsueh
  • Patent number: 10784832
    Abstract: A film bulk acoustic resonator (FBAR) and a method of fabricating the FBAR are disclosed. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the invention, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: September 22, 2020
    Assignee: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
    Inventor: Xiaochuan Wang
  • Patent number: 10780482
    Abstract: Disclosed is a tube-propelling apparatus for a tube bending machine. The apparatus comprises a main tube-propelling base mounted on a slide rail mechanism of a tube bending machine tool, wherein a penetrating hole though which both a fixing sleeve and a core rod pass is provided on the main tube-propelling base, the rear end of the fixing sleeve is fixed in the penetrating hole, and the front end of the fixing sleeve is provided with a tube clamping apparatus. The propelling apparatus further comprises a surplus material auxiliary propelling base mounted on the slide rail mechanism of the tube bending machine tool, wherein the surplus material auxiliary propelling base is provided with a through-hole coaxial with the penetrating hole of the main tube-propelling base. An auxiliary pushing sleeve is mounted in the through-hole, and the core rod passes through the auxiliary pushing sleeve.
    Type: Grant
    Filed: March 30, 2013
    Date of Patent: September 22, 2020
    Inventors: Chieh-Wei Chen, Jun Lu
  • Patent number: 10784756
    Abstract: An electric machine having a housing assembly and a stator assembly coupled with a rotor assembly. A plurality of MOSFET assemblies are operably coupled with the stator assembly. The MOSFET assemblies are disposed in openings defined by the housing assembly and include a carrier that is secured within the openings with a press-fit engagement. The carrier defines an interior space extending the full longitudinal length of the carrier and includes at least one planar mounting surface wherein a MOSFET is mounted on the planar mounting surface. In some embodiments, the housing assembly includes an aluminum heat exchange member that defines an opening in which a MOSFET assembly is installed. The carrier may be formed by extruding copper and include longitudinally extending ribs that engage the housing assembly in press fit engagement. A method of manufacturing an electric machine is also disclosed.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: September 22, 2020
    Assignee: BorgWarner Inc.
    Inventors: Attila Nagy, Bruce Hamilton
  • Patent number: 10784129
    Abstract: A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 22, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kohei Sugihara, Hidenori Goto
  • Patent number: 10774427
    Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 15, 2020
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Po-Yi Wu, Chun-Hung Lu
  • Patent number: 10775855
    Abstract: A circuit card assembly release tool is disclosed. The tool includes a body and two flanges extending outward from the body at an end of the body. The tool is structured and arranged such that the two flanges are adapted to simultaneously apply a force to two ejectors that are pivotally connected to a seated circuit card assembly when the tool is urged in a direction relative to the seated circuit card assembly.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: September 15, 2020
    Assignee: Lockheed Martin Corporation
    Inventor: Steve J. V. Pacquing
  • Patent number: 10778059
    Abstract: An electrical submersible pump assembly has a motor with a stator stack of limitations. The stack has slots through which magnet wires are wound. An encapsulate surrounds and bonds the magnet wires together within each slot. The encapsulate includes ceramic particles within a polymer adhesive matrix. The polymer matrix may be a fluoropolymer adhesive. Each of the magnet wires may have an electrical insulation layer surrounding a copper core. The ceramic particles are rounded and much smaller than a cross-sectional area of each of the magnet wires. At least some of the magnet wires may be in contact with a perimeter of the slot. The ceramic particles may be porous.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: September 15, 2020
    Assignee: BAKER HUGHES, A GE COMPANY, LLC
    Inventor: Ping Duan
  • Patent number: 10776553
    Abstract: The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: September 15, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Lin Shen, Yongming Xiong, Shahbaz Mahmood, Maurilio De Nicolo
  • Patent number: 10779391
    Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: David Barron, Mark K. Hoffmeyer, Matthew T. Richardson, Christopher W. Mann, Roger D. Hamilton, Jason R. Eagle
  • Patent number: 10779413
    Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatio
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
  • Patent number: 10779417
    Abstract: A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method comprising the steps of: (o) optionally removing organic varnish, (p) positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars, and (q) applying heat to melt the solder bumps and to wet the ends of the vias with solder.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: September 15, 2020
    Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.
    Inventors: Dror Hurwitz, Alex Huang
  • Patent number: 10772249
    Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 8, 2020
    Assignee: Mycronic AB
    Inventors: Nils Jacobsson, Roger Jonasson
  • Patent number: 10763376
    Abstract: A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: September 1, 2020
    Assignee: THE BOEING COMPANY
    Inventors: John S. Frost, Randolph J. Brandt, Peter Hebert, Omar Al Taher
  • Patent number: 10763039
    Abstract: Provided is an inductor winding method and an inductor winding device. The inductor winding method comprises steps of: A. dividing turns of coil of each winding of the inductor into a first winding and a second winding based on a preset ratio; B. winding the first winding on one of multiple magnetic columns, and winding the second winding on another one of the multiple magnetic columns which is different from the magnetic column on which the first winding is wound; and C. performing step A and step B cyclically until all the windings of the inductor are wound. With a coupling inductor having interleaving-wound structure, power frequency magnetic fluxes generated by magnetic lines in magnetic columns counteract one another, thereby solving the problem of high magnetic flux density in a magnetic core while achieving certain leakage inductance.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: September 1, 2020
    Assignee: Vertiv Tech Co., Ltd.
    Inventors: Yunfeng Wei, Yaming Shi, Fubin Xu
  • Patent number: 10764992
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
  • Patent number: 10763583
    Abstract: A method of assembling an antenna aperture from a plurality of antenna aperture segments is described. The method may include placing a first aperture segment relative to a second aperture segment to partially form the antenna aperture. Furthermore, an overlap of the first aperture segment overlaps a complementary underlap of the second aperture segment at a seam. The method may also include joining the overlap of the first aperture segment to the underlap of the second aperture segment to partially form the antenna aperture.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: September 1, 2020
    Assignee: KYMETA CORPORATION
    Inventors: Steven Linn, Robert Morey, Stephen Olfert, Andrew Turner, Matthew Riley, Jonathan Mallari, Colin Stuart Short
  • Patent number: 10756410
    Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen