Patents Examined by Peter DungBa Vo
  • Patent number: 11510350
    Abstract: The unloading operation of winding the carrier tape on the component supply reel by driving the component supply reel to extract the component supply reel from the tape feeder is performed. That is, the carrier tape removed from the tape feeder is wound on the component supply reel. Thus, it is possible to suppress the interference of the preceding tape removed from the tape feeder with the succeeding tape.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: November 22, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yuzuru Taniguchi
  • Patent number: 11510352
    Abstract: A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: November 22, 2022
    Assignee: FUJI CORPORATION
    Inventor: Toru Matsumoto
  • Patent number: 11502665
    Abstract: A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: November 15, 2022
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Kouhei Kurimoto, Kazuhito Kishida, Rinzo Kayano, Jun Mizuno, Shoji Kakio
  • Patent number: 11502587
    Abstract: The method and apparatus comprise the following features: —forming coil members (21) by bending an electric conductor (20) externally coated with an outer insulation (20?); wherein the bending is made at predetermined lengths from a reference position (16?), and wherein each one of the coil members (21), when formed, comprises at least one head portion (21?) and leg portions (21?) extending from said at least one head portion (21?); —feeding the electric conductor (20) to accomplish the bending; —cutting the electric conductor (20) to detach a formed coil member (21) from said electric conductor (20); —inserting the leg portions (21?) of the coil members (21) into slots of the stator, so that parts of said leg portions (21?) extend from one end of the stator and the head portions (21?) extend from an opposite end of the stator; —arranging at least one laser beam (13?a, 13?b) to remove the insulation (20?) from predetermined areas (20a, 20b) of the electric conductor (20); —radiating the surface of the electri
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: November 15, 2022
    Assignee: ATOP S.p.A.
    Inventors: Massimo Ponzio, Rubino Corbinelli, Davide Chesi
  • Patent number: 11501914
    Abstract: The present invention discloses a grain boundary diffusion method of an R—Fe—B series rare earth sintered magnet, an HRE diffusion source, and a preparation method thereof, comprising the following steps: engineering A of forming a dry layer on a high-temperature-resistant carrier, the dry layer being adhered with HRE compound powder, the HRE being at least one of Dy, Tb, Gd, or Ho; and engineering B of performing heat treatment on the R—Fe—B series rare earth sintered magnet and the high-temperature-resistant carrier treated with the engineering A in a vacuum or inert atmosphere and supplying HRE to a surface of the R—Fe—B series rare earth sintered magnet. The method can reduce the consumption of heavy rare earth element and control the loss of residual magnetism Br while increasing the coercivity.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: November 15, 2022
    Assignee: Fujian Changting Golden Dragon Rare-Earth Co., Ltd
    Inventors: Yulin Lin, Hiroshi Nagata, Zongbo Liao, Juhua Xie, Hanshen Ye
  • Patent number: 11497153
    Abstract: A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: November 8, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Katsuyuki Amma, Yoichi Matsushita
  • Patent number: 11497133
    Abstract: A method of making a data centre is disclosed, comprising making a data centre in an existing building (3010) having a floor, walls and a roof, an air inlet and an air outlet. The method includes: installing prefabricated data centre elements by (a) connecting to the inlet an air handling module (3001, 3002); and (b) installing cold aisle services modules (3011) each having one or more integrated blanking portions and one or more data centre services extending along its length terminating with a connection to an adjacent module (3011); and installing racks of IT equipment arranged in parallel rows; the method being so performed that the floor, racks, and cold aisle services modules (3011) together define parallel cold aisles for entraining cooling air flows to the IT equipment. Also disclosed are a data centre, a service carrying frame and a cold aisle services module for a data centre and a supporting frame for supporting prefabricated data centre elements.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: November 8, 2022
    Assignee: Bripco BVBA
    Inventors: Paul Rogers, Neil Crow, Lucian Hicks, Richard Whiteley, Aaron Favill, Samuel Hanks, William Thornton
  • Patent number: 11495485
    Abstract: A method of transferring a micro device using a micro device transfer head is provided. The micro device transfer head includes a base arm, a first side arm and a second side arm, and the micro device is fabricated on a substrate. The method includes moving the first side arm within a sensing range of the micro device, charging the first side arm for drawing the micro device away from the substrate to move towards a space between the first side arm and the second side arm, and shortening a distance between the first side arm and the second side arm for clamping the micro device.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: November 8, 2022
    Assignee: ACER INCORPORATED
    Inventors: Jui-Chieh Hsiang, Chih-Chiang Chen
  • Patent number: 11496028
    Abstract: A hairpin type of stator coil forming apparatus includes a first forming machine configured to form a vertex in a material coil so that a central portion of the material coil protrudes upward, and to form inclined portions inclined to both sides of the vertex, a second forming machine configured to receive the material coil bent-formed by the first forming machine and to form a front/rear bent portion in the material coil by bending one inclined portion and a portion of the other inclined portion based on the vertex, and a third forming machine configured to receive the material coil bent-formed by the second forming machine and to roundly form the inclined portions in front and rear directions.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: November 8, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Seungkyu Jang
  • Patent number: 11496029
    Abstract: A laminated core manufacturing method according to the present invention is a manufacturing method for a laminated core including: a laminated body that is configured by laminating core strips that are made of a magnetic material, the laminated body including: a core back portion; and a tooth portion; and electrically insulating members that are disposed on two side portions of the tooth portion, wherein the laminated core manufacturing method includes a bonding step in which the insulating members are pressed onto each of the side surfaces of the tooth portion of the laminated body so as to integrate the laminated body and also so as to fix the insulating members to the laminated body, by means of at least one of an adhesive and a pressure-sensitive adhesive that is disposed between each of the side surfaces of the tooth portion and the insulating members.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: November 8, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tatsuro Hino, Akihito Mori, Naohiko Ayukawa, Kenichi Hirooka, Masashi Nakamura, Kohei Egashira, Shinichiro Yoshida, Daisuke Shijo
  • Patent number: 11489419
    Abstract: A motor housing removal assembly comprises an extension defining a plurality of surface features on at least one side, an adjustment member comprising, a support member configured to couple to and move relative to the extension, an engagement element moveably coupled to the support member and configured to engage the extension to define a locked position preventing the support member from moving relative to the extension, a base portion coupled to the support member, and a plurality of pry members each comprising a first end coupled to the base and comprising a first thickness, and a second end opposing the first end and comprising a second thickness. A holder is fixedly coupled to an end of the extension and configured to hold at least a portion of a motor housing.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: November 1, 2022
    Inventor: Craig Alemi
  • Patent number: 11488753
    Abstract: A manufacturing method for an electronic component includes preparing a first composite magnetic section provided with a first composite magnetic layer and at least one marker layer disposed on the first composite magnetic layer; and preparing a second composite magnetic section provided with a second composite magnetic layer and at least one coil formed by winding a conductive wire and buried in the second composite magnetic layer with part of the coil being exposed. The manufacturing method further includes obtaining a multilayer body by disposing the first composite magnetic section so that a surface on the opposite side of the first composite magnetic section to a surface where the marker layer is disposed opposes a surface of the second composite magnetic section; and obtaining a molded body having a marker area formed with non-conductive particles pressed into the first composite magnetic layer.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: November 1, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiji Iso, Isao Ida, Hiroshi Okuizumi, Takao Kawachi
  • Patent number: 11490552
    Abstract: A part verification system includes sensors for detecting tapes, a reader which reads identification information from a recording part provided to a reel, and a memory part which stores part verification information. The system further includes a part verification part which performs verification updating processing for determining whether or not the tape is mounted on the tape feeder at the set position corresponding to the identification information, and updating tape presence or absence information at the set position when the tape is mounted, a tape monitoring part for determining whether or not the tape is mounted with respect to each tape feeder during a period which differs from a period where the verification updating processing is performed, and a notification part which performs notification to request reading of the identification information relating to the tape from the recording part when the tape is mounted on the tape feeder.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: November 1, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yoichi Matsushita
  • Patent number: 11478822
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 25, 2022
    Assignees: J-Metrics Technology Co., Ltd., Peking University Shenzhen Graduate School
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Patent number: 11482824
    Abstract: An apparatus (102) for holding at least one elongated workpiece (106) to be crimped, wherein the apparatus comprises a holder frame (122), a guide member (124) and a locator element (114) having at least one holder surface (116) defining an elongated cavity (118) for receiving and holding the workpiece. The holder frame is arranged to hold the guide member and the locator element, the at least one elongated cavity having a longitudinal main extension (120). The locator element is movable in a first guide (126) in the direction (127) of the longitudinal main extension. The guide member is movable in a second guide (128) in relation to the locator element in a direction (129) perpendicular to the direction (127) of the longitudinal main extension. The guide member and the locator element are slidably engaged with one another.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: October 25, 2022
    Assignee: Pressmaster AB
    Inventors: Otto Sivertsen, Marco Endler
  • Patent number: 11477928
    Abstract: A component mounting device includes a component supply device that supplies a component to a component supply position by using a component housing tape, a head unit provided with a suction nozzle that can be moved up and down, a first image capturing unit that captures the component supplied to the component supply position, and a component posture determination unit that determines the posture of the component supplied to the component supply position. Based on a captured image captured by the first image capturing unit, the component posture determination unit determines whether the component takes an abnormal posture protruding from a component housing part in a direction intersecting the vertical direction on a horizontal plane in the component housing tape.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: October 18, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Kunimune Komaike
  • Patent number: 11467121
    Abstract: Disclosed is a manufacturing method of a gas sensor. The gas sensor has a plate-shaped sensor element with at least one pair of electrode pads, a separator disposed around the sensor element, and at least one pair of opposed metal terminals held in an insertion hole of the separator and electrically connected at contact regions thereof to the respective electrode pads. The manufacturing method includes mounting the metal terminals in the insertion hole of the separator with use of a mounting jig. The mounting jig has a flat portion interposed between the contact regions of the metal terminals during the mounting of the metal terminals in the separator so as to prevent contact and entanglement of the opposed metal terminals.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: October 11, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Takehiro Oba, Tatsuya Okumura
  • Patent number: 11469732
    Abstract: A method of making a SiC resonator includes forming a layer of an oxide material on a relatively thick wafer of SiC; bonding the layer of oxide material on the relatively thick wafer of SiC to a handle wafer having at least an oxide exterior surface, the resulting bond being substantially free of voids; planarizing the relatively thick wafer of SiC to a desired thickness; forming top and bottom electrodes on the wafer of SiC wafer to define a SiC wafer resonator portion; and forming a trench around the top and bottom electrodes, the tench completely penetrating the planarized wafer of SiC around a majority of a distance surrounding said top and bottom electrodes, except for one or more tether regions of the planarized wafer of SiC which remain physically coupled a remaining portion the SiC wafer resonator portion which defines a frame formed of the planarized wafer of SiC surrounding the SiC wafer resonator portion.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: October 11, 2022
    Assignee: HRL LABORATORIES, LLC
    Inventors: Raviv Perahia, Logan D. Sorenson, Lian X. Huang, David T. Chang, Makena S. White, Jeremy Bregman
  • Patent number: 11469652
    Abstract: A method of manufacturing a stacked core includes forming a first pilot hole in a metal plate, forming a worked portion of the metal plate in a state in which a first pilot pin is inserted into the first pilot hole, the worked portion being displaced relative to a plane of the metal plate, press-fitting the worked portion of the metal plate to reposition the worked portion to extend along the plane of the metal plate, forming a second pilot hole in the metal plate after press-fitting the worked portion of the metal plate, and forming a blanked member by blanking the metal plate in a state in which a second pilot pin is inserted into the second pilot hole, the blanked member including the worked portion.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: October 11, 2022
    Inventors: Akihiro Hashimoto, Daisuke Komiya
  • Patent number: 11462877
    Abstract: A die clearance monitoring system includes a light source, a light detector, and a controller. The light source is disposed along a front side of a die set of a crimping device and emits light towards the die set. The die set includes a first crimp die and a second crimp die that engage and crimp an object along a crimp stroke. The light detector is disposed along a rear side of the die set. The light detector receives the emitted light from the light source that traverses across the die set through a gap defined between the first and second crimp dies and generates light absorption data based on the emitted light that is received. The controller is communicatively connected to the light detector. The controller processes the light absorption data to determine a relative spacing between the first crimp die and the second crimp die.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: October 4, 2022
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Richard R. Dobson, Jr., Matthew John Orlowski