Patents Examined by Peter DungBa Vo
  • Patent number: 11152152
    Abstract: The present disclosure relates to a fabrication process for a current transformer. For example, the process may include wrapping first windings around a first core half of a magnetic core of a current transformer. The process may include wrapping second windings around a second core half of the magnetic core. The magnetic core may be inserted into an overmold tool. The process may include overmolding a first overmold over the first core half of the magnetic core and a second overmold over the second core half of the magnetic core. After overmolding, the magnetic core may be cut in half.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 19, 2021
    Assignee: Schweitzer Engineering Laboratories, Inc.
    Inventors: Mark A. Thomas, Eric Ryan, David Kenny
  • Patent number: 11145440
    Abstract: Methods of testing and installing fire-resistant coaxial cables are described. The dielectric between the coax cable's central conductor and outer coaxial conductor ceramify under high heat, such as those specified by common fire test standards (e.g., 1850° F./1010° C. for two hours). The dielectric can be composed of ceramifiable silicone rubber, such as that having a polysiloxane matrix with inorganic flux and refractory particles. Because thick layers of uncured ceramifiable silicone rubber deform under their own weight when curing, multiple thinner layers are coated and serially cured in order to build up the required thickness. A sacrificial sheath mold is used to hold each layer of uncured ceramifiable silicone rubber in place around the central conductor while curing. The outer conductor can be a metal foil, metal braid, and/or corrugated metal.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: October 12, 2021
    Assignee: American Fire Wire, Inc.
    Inventor: William E. Rogers
  • Patent number: 11146155
    Abstract: Provided are an alignment method and an alignment device by which, immediately before aligning, the leg parts of adjacent conductors do not interfere with each other. The alignment method, in which by providing a plurality of coil elements (40) in an annular shape and moving the plurality of coil elements (40) in a direction in which the diameter of the annular shape is reduced, the plurality of coil elements (40) are aligned in a state where turn sections (42) provided at substantially apex portions are alternately overlapped, wherein the plurality of coil elements (40) are aligned by moving each of the plurality of coil elements (40) toward an annularly shaped center, and while doing so, rotating the plurality of coil elements about a rotation axis (231e) that is parallel to the central axis (C1) of the annular shape.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: October 12, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Daisuke Ueno, Kenichi Ohno, Yutaka Matsumoto, Shinichi Kawano, Mitsugu Ueno
  • Patent number: 11145618
    Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: October 12, 2021
    Inventors: Katsuji Iguchi, Masumi Maegawa, Keiichi Sawai, Hiroyoshi Higashisaka, Takanobu Matsuo
  • Patent number: 11146033
    Abstract: A multicore cable manufacturing method for manufacturing a multicore cable with reduced influence on high-frequency characteristics is provided. The multicore cable manufacturing method includes a plurality of crimping dies, each crimping die being constituted of a pair of dies to connect, by crimping, each electric wire and each terminal. The plurality of crimping dies is configured to substantially simultaneously connect the plurality of electric wires and the plurality of terminals, and the crimping die is configured to connect a front end portion of each electric wire and each terminal with the front end portions of the plurality of electric wires extending radially centering on a branch point located on a rear side of the front end portion.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 12, 2021
    Inventor: Miyoshi Mabuchi
  • Patent number: 11139126
    Abstract: A method for producing a solid-insulated circuit-breaker pole includes forming a pole shell housing with an elastic layer that is integrally joined to the pole shell housing; and mounting a vacuum fault interrupter into the pole shell housing provided with the elastic layer. Also disclosed is a solid-insulated circuit-breaker pole.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: October 5, 2021
    Inventor: Dirk Pohle
  • Patent number: 11138487
    Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: October 5, 2021
    Inventor: Yoshimitsu Maeda
  • Patent number: 11140786
    Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.
    Type: Grant
    Filed: January 19, 2020
    Date of Patent: October 5, 2021
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Michael A. Gaynes
  • Patent number: 11140801
    Abstract: A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: October 5, 2021
    Inventors: Shigeto Oyama, Tomokatsu Kubota, Jun Iisaka
  • Patent number: 11130164
    Abstract: A crimping tool is disclosed. The crimping tool includes a base, an operating member and a moving member. The base includes a pivot location, a sliding groove, and first and second fixing locations. The first and second fixing locations are respectively located on two ends of the sliding groove to fix a connector of a wire. The operating member includes a holding portion, a pivot hole and a gear. The pivot hole is pivotally connected to the pivot location of the base through a pivot shaft. The moving member includes a rack, and first and second crimping elements. When the operating member rotates, the gear drives the rack to enable the moving member to move simultaneously, so as to use the first or second crimping element to press fit the connector of the wire placed at the first or second fixing location.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: September 28, 2021
    Assignee: Hanlong Industrial Co., Ltd.
    Inventors: Chien-Chou Liao, Mei-Fang Lin
  • Patent number: 11134574
    Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: September 28, 2021
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: I-Lin Tseng, Tzu-Chun Chen
  • Patent number: 11133635
    Abstract: A system for multi-stage crimping of a contact to a wire includes a first crimping die having a first portion of a selected shape defined therein, and a second crimping die having a complementary second portion of the selected shape defined therein. The system also includes the first and second crimping dies being operable to be displaced towards each other and along a first axis during a compression stroke. The first and second crimping dies are also operable to be displaced along a second axis during a closing stroke subsequent to the compression stroke, where the second axis is generally perpendicular to the first axis. In addition, the system includes the first and second crimping dies cooperating to crimp the contact into the selected shape to the wire upon completion of the closing stroke.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: September 28, 2021
    Inventors: William D. Kelly, Aron Bacs, Jr.
  • Patent number: 11134596
    Abstract: A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: September 28, 2021
    Inventors: Shuhei Yamada, Yusuke Yamakage
  • Patent number: 11134599
    Abstract: During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: September 28, 2021
    Inventor: Kenji Hara
  • Patent number: 11134597
    Abstract: A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: September 28, 2021
    Inventor: Kazushi Takama
  • Patent number: 11129277
    Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas when the distal ends of the truss structure engage and are compressed between the two areas.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 21, 2021
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Patent number: 11128086
    Abstract: An apparatus for inserting and retention testing an electrically conductive contact in an electrical connector. The apparatus includes a connector holder, an insertion tip, an insertion tip displacement assembly, a test probe, and a test probe displacement assembly. The connector holder holds an electrical connector. The insertion tip contacts one end of a contact partially inserted in a hole in the electrical connector while providing clearance for a wire. The insertion tip displacement assembly displaces the insertion tip in a first direction along a first linear path to further insert the insertion tip in the hole in the electrical connector. The test probe contacts another end of the contact after the contact has been inserted further into the hole. The test probe displacement assembly displaces the test probe in a second direction (opposite to the first direction) along a second linear path which partially overlaps the first linear path.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: September 21, 2021
    Assignee: The Boeing Company
    Inventor: Mark E. Hulscher
  • Patent number: 11129318
    Abstract: According to some embodiments, a method operable by an electronic component recovery system for detaching an electronic component adhesively bonded to a housing by way of an adhesive bond, is described. The electronic component is carried within a cavity defined by the housing of a portable electronic device. The method can include while the housing having the electronic component attached thereto is located at an electronic component detaching module, where the electronic component detaching module includes a movable arm capable of rotating about a hinge: cooling the housing and the electronic component attached thereto to a temperature that is low enough to weaken the adhesive bond, and causing the movable arm to rotate about the hinge such that a portion of the housing strikes a detachment element with sufficient force to separate the electronic component from the housing.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: September 21, 2021
    Assignee: APPLE INC.
    Inventors: Charissa Rujanavech, Patrick S. Wieler, Sean P. Shannon, Thomas Loeper, David Novak, Dan Powell, Jason Schwarz, John Sever, Darragh Staunton
  • Patent number: 11121611
    Abstract: A method is provided for balancing rotors (10) of electrical machines. Each rotor (10) has a shaft (11) and at least one laminated core (12) is arranged on the shaft. The method includes providing blanks (13) with a length (l) that is smaller than an outside diameter (d) of the laminated core (12) of the rotor (10). A magnitude and orientation of an initial unbalance of the rotor (10) then is ascertained. A recess (15) then is made in each blank (13) spaced from the center of gravity by a distance depending on the magnitude of the ascertained initial unbalance. The blank (13) is mounted by fitting the recess (15) on the shaft (11) of the rotor (10) and mounting the processed blank (13) on the rotor (11) in an angular position that is dependent on the orientation of the ascertained initial unbalance.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: September 14, 2021
    Inventors: Johannes Stoll, Gregor Michna, Peter Wurster
  • Patent number: 11116449
    Abstract: Methods of manufacturing and assembling a catheter shaft may include depositing electrical traces on an interior surface of the shaft of the catheter, rather than using separate wires, forming a bore in a sensor, and electrically coupling the sensor to the trace through a bore in the sensor.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: September 14, 2021
    Assignee: St. Jude Medical, Cardiology Division, Inc.
    Inventors: Terry L. Sterrett, Allyn Jensrud