Patents Examined by Peter DungBa Vo
  • Patent number: 11905168
    Abstract: A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: February 20, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Hsien-Chung Tai, Lin-Huei Fang, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Wei-Ming Lee
  • Patent number: 11903136
    Abstract: An electronic component supply device, comprising: a tape feeder configured to feed out a taped electronic component and supply an electronic component; and a holding mechanism arranged to handle the tape feeder and configured to hold a container for accommodating the taped electronic component supplied to the tape feeder, in which the holding mechanism is configured to hold the container having a width larger than the width of the tape feeder.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: February 13, 2024
    Assignee: FUJI CORPORATION
    Inventor: Takaji Mukohara
  • Patent number: 11895920
    Abstract: A method of forming a piezoelectric thin film includes sputtering a first surface of a substrate to provide a piezoelectric thin film comprising AlN, AlScN, AlCrN, HfMgAlN, or ZrMgAlN thereon, processing a second surface of the substrate that is opposite the first surface of the substrate to provide an exposed surface of the piezoelectric thin film from beneath the second surface of the substrate, wherein the exposed surface of the piezoelectric thin film includes a first crystalline quality portion, removing a portion of the exposed surface of the piezoelectric thin film to access a second crystalline quality portion that is covered by the first crystalline quality portion, wherein the second crystalline quality portion has a higher quality than the first crystalline quality portion and processing the second crystalline quality portion to provide an acoustic resonator device on the second crystalline quality portion.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: February 6, 2024
    Assignee: Akoustis, Inc.
    Inventors: Craig Moe, Jeffrey B. Shealy, Mary Winters, Dae Ho Kim, Abhay Saranswarup Kochhar
  • Patent number: 11894823
    Abstract: A SAW device manufacturing method includes a piezoelectric ceramic substrate polishing step of polishing a first surface of the piezoelectric ceramic substrate, a support substrate polishing step of polishing a first surface of the support substrate, a bonding step of bonding the first surface of the piezoelectric ceramic substrate to the first surface of the support substrate to thereby form a stacked substrate, a grinding step of grinding a second surface of the piezoelectric ceramic substrate, and a vibration diffusion layer forming step of applying a laser beam to the stacked substrate in the condition where the focal point of the laser beam is positioned inside the piezoelectric ceramic substrate to thereby form a modified layer as a vibration diffusion layer inside the piezoelectric ceramic substrate.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 6, 2024
    Assignee: DISCO CORPORATION
    Inventor: Kenya Kai
  • Patent number: 11888280
    Abstract: A device is provided for aligning a ribbon cable relative to an electrical connector to crimp the electrical connector onto the ribbon cable with a tool. The device includes a side portion and a central piece. The side portion includes an upper end and a cable track having a width sized to receive the ribbon cable. The central piece is coupled to the side portion and includes an upper surface. The upper surface of the central piece and the upper end of the side portion at least partially define a connector retaining segment sized to receive the electrical connector.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: January 30, 2024
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Mark E. Davidsz, Michael S. Baran, Shravan Rajmohan, Douglas J. Carpiaux, Scott H. Micoley
  • Patent number: 11888364
    Abstract: The stator manufacturing method includes a step involving, simultaneously with or after a first slot-housed portion placing step, moving a second slot-housed portion of each pair of slot-housed portions radially outward while unfolding an insulating sheet in a direction intersecting a direction of extension of folded portions of the insulating sheet, thus placing each second slot-housed portion.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 30, 2024
    Assignees: AISIN CORPORATION, HAYASHI KOGYOSYO CO., LTD.
    Inventors: Toru Kuroyanagi, Takahiko Hobo
  • Patent number: 11887776
    Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: January 30, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yi Yan, Zhemin Zhang, Yuki Sato, Kenji Otake, Vijaylaxmi Khanolkar
  • Patent number: 11881831
    Abstract: A method of manufacture for an acoustic resonator device. The method includes forming a nucleation layer characterized by nucleation growth parameters overlying a substrate and forming a strained piezoelectric layer overlying the nucleation layer. The strained piezoelectric layer is characterized by a strain condition and piezoelectric layer parameters. The process of forming the strained piezoelectric layer can include an epitaxial growth process configured by nucleation growth parameters and piezoelectric layer parameters to modulate the strain condition in the strained piezoelectric layer. By modulating the strain condition, the piezoelectric properties of the resulting piezoelectric layer can be adjusted and improved for specific applications.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: January 23, 2024
    Assignee: Akoustis, Inc.
    Inventors: Shawn R. Gibb, Alexander Y. Feldman, Mark D. Boomgarden, Michael P. Lewis, Ramakrishna Vetury, Jeffrey B. Shealy
  • Patent number: 11879787
    Abstract: Disclosed is a heat sensor cable having: a conductor defining a conductor first end and a conductor body extending by a first longitudinal span from the conductor first end to a conductor second end; a coil that is non-conductive and includes a coil first end and a coil body extending by a second longitudinal span from the coil first end to a coil second end, wherein the coil surrounds the conductor from the conductor first end to the conductor second end; an outer sheath that is conductive and includes an outer sheath first end and an outer sheath body extending by a third longitudinal span from the outer sheath first end to an outer sheath second end, wherein the outer sheath surrounds the coil from the conductor first end to the conductor second end; and an eutectic salt that is disbursed between the conductor and the outer sheath.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: January 23, 2024
    Assignee: KIDDE TECHNOLOGIES, INC.
    Inventor: James Allen Varnell
  • Patent number: 11872735
    Abstract: In a first step, a circuit sheet is set such that a first region of a second main surface of the circuit sheet is in contact with a plateau portion of a first mold and a second region is not in contact with the first mold. In the first step, a first fixed portion of the circuit sheet is arranged on a first portion of the first mold, and a second fixed portion is arranged on a second portion of the first mold. The first portion is a portion that is higher than the plateau portion and runs along at least one of a first protruding portion and a second protruding portion provided along the plateau portion. The second portion is a portion where the first protruding portion or the second protruding portion is not provided along the plateau portion.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: January 16, 2024
    Assignee: NISSHA CO., LTD.
    Inventors: Seiichi Yamazaki, Toshihiro Higashikawa, Hitoshi Hirai, Koji Asai, Yuki Matsumoto
  • Patent number: 11877413
    Abstract: A printed circuit board assembly (PCBA) controls an electrically initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: January 16, 2024
    Assignee: Sparton DeLeon Springs, LLC
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 11877404
    Abstract: Systems, methods, and devices related to catalyzed metal foils are disclosed. Contemplated metal foils have a bottom surface, preferably roughened to Ra of at least 0.1 ?m, bearing a catalyst material. The metal foils are etchable, typically of aluminum or derivative thereof, and is less than 500 ?m thick. Methods and systems for forming circuits from catalyzed metal foils are also disclosed. The catalyst material bearing surface of the metal foil is applied to a substrate and laminated, in some embodiments with a thermoset resin or thermoplastic resin therebetween or an organic material first coating the catalytic material. The metal foil is removed to expose the catalyst material, and a conductor is plated to the catalyst material.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 16, 2024
    Assignee: Averatek Corporation
    Inventor: Shinichi Iketani
  • Patent number: 11870410
    Abstract: A packaging method and a packaging structure of a film bulk acoustic resonator are provided. The packaging method includes: providing a resonant cavity main structure including a first substrate and a film bulk acoustic resonant structure having a first cavity formed therebetween; forming a resonator cover by providing a second substrate and forming an elastic bonding material layer containing a second cavity; bonding the resonant cavity main structure and the resonator cover together through the elastic bonding material layer and removing elasticity of the elastic bonding material layer, where the second cavity is at least partially aligned with the first cavity; forming a through-hole penetrating through the resonator cover and exposing a corresponding electrical connection part of the film bulk acoustic resonant structure; and forming a conductive interconnection layer on a sidewall of the through-hole and on a portion of a surface of the resonator cover.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: January 9, 2024
    Assignee: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
    Inventors: Hailong Luo, Wei Li, Fei Qi
  • Patent number: 11862919
    Abstract: A system for separating terminals (e.g., electrical terminals) from a terminal strip includes a shear tool movably mounted to a frame for selectively shearing the terminal from the terminal strip. A primary shear depressor is provided for driving the shear tool from an initial position to an intermediate position during which the terminal is sheared from the terminal strip. A secondary shear depressor is movably mounted to the primary shear depressor for driving the shear tool from the intermediate position after the terminal has been sheared from the terminal strip, to a final position.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: January 2, 2024
    Inventor: David Alan College
  • Patent number: 11864464
    Abstract: A method for polarizing a piezoelectric film is described. In this method, a piezoelectric film is formed by using an injection deposition method. The piezoelectric film is flat adhered to a surface of a conductive substrate. A polarization process is performed on the piezoelectric film while the piezoelectric film is flat adhered to the surface of the conductive substrate by generating static electricity on the adhesion surface of the piezoelectric film, and generating the static electricity on the adhesion surface of the piezoelectric film comprises using a pressurized gas to blow the adhesion surface, and the adhesion surface of the piezoelectric film is adhered to the even surface of the conductive substrate by an electrostatic adsorption method.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: January 2, 2024
    Assignee: CREATING NANO TECHNOLOGIES, INC.
    Inventors: Ji-Yung Lee, Andrew Ronaldi Tandio, Bo-Fan Tsai
  • Patent number: 11850416
    Abstract: Various methods of manufacture can produce three-dimensional, high density, high-electrode probe arrays that can advantageously be used in neural-based applications. In one example, deep reactive ion etched (DRIE) ultra-high aspect ratio holes are etched in silicon and refilled with multiple films to a high density array of individual probes, each probe having individual recording and/or stimulation sites or tips. Using a DRIE lag effect technique can help control tip sharpness and electrode length, allowing for narrow, long, and dense needles to be formed side-by-side in a single array. In some examples, multimodal probe arrays are manufactured, with some probes having a recording/stimulating site, other probes having a waveguide, and yet other probes having a microfluidic channel.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: December 26, 2023
    Assignee: The Regents of the University of Michigan
    Inventors: Khalil Najafi, Seyed Amin Sandoughsaz Zardini, Daniel Egert
  • Patent number: 11854748
    Abstract: A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: December 26, 2023
    Assignee: RUBYCON CORPORATION
    Inventors: Tomonao Kako, Chiharu Ito
  • Patent number: 11848659
    Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, a
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: December 19, 2023
    Assignee: NAGASE CHEMTEX CORPORATION
    Inventors: Takayuki Hashimoto, Takuya Ishibashi, Hiroyuki Okada, Kazuki Nishimura
  • Patent number: 11848660
    Abstract: A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: December 19, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chen-Hsiao Wang, Kai-Kuang Ho
  • Patent number: 11849542
    Abstract: A mounting head is configured to be detachably attached to a mounting device main body. This mounting head includes a storage section having multiple storage areas, and a storage control section configured to acquire multiple operation data relating to an operation of the mounting head individually at different timings and store the multiple operation data individually in the multiple storage areas in such a state that the mounting head is attached to the mounting device main body.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 19, 2023
    Assignee: FUJI CORPORATION
    Inventors: Hidetoshi Ito, Jun Iisaka, Mitsuhiro Hashimoto, Kazuma Hattori