Patents Examined by Peter DungBa Vo
  • Patent number: 11778800
    Abstract: An article management apparatus allocates articles necessary for a board working machine out of the articles stored in a storage based on a production plan of the board working machine that performs a predetermined board work on the board to produce the board product. The article management apparatus includes a first setting section, a second setting section, and a selecting section. The first setting section allows a user of the board working machine to set a restriction condition for each production plan of the board product. The second setting section allows the user to set a priority among multiple priority elements when allocating the articles for the articles needed in a case of producing the board product under the restriction condition set by the first setting section. The selecting section allocates the articles based on the priority of the priority element set by the second setting section.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 3, 2023
    Assignee: FUJI CORPORATION
    Inventors: Kazuya Fukao, Kazuyuki Ishiyama, Fumitaka Kato, Tomoko Ozaki
  • Patent number: 11776713
    Abstract: A wire harness manufacturing system including a plurality of processing zones and configured to manufacture a wire harness by using a subassembly including a plurality of electrical lines to each of which a connection component is attached includes a conveyance device provided along the plurality of processing zones and including: work boards in a number at least corresponding to the number of the plurality of processing zones; a circulation conveyer configured to sequentially convey each work board in a horizontal state from an upstream side to a downstream side on a downstream conveyance path along the plurality of processing zones and then return the work board from the downstream side to the upstream side on an upstream conveyance path; and a raiser configured to set the work board to a stand-up state in which one of edge parts extending in a conveyance direction of the work board is positioned on an upper side of the other edge part in the work board, and to set the work board in the stand-up state to th
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: October 3, 2023
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Eiji Aramaki, Koji Kato, Mitsuyuki Akai, Takayuki Okubo, Nobuyuki Minami
  • Patent number: 11778798
    Abstract: An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: October 3, 2023
    Assignee: FUJI CORPORATION
    Inventor: Takeshi Sakurayama
  • Patent number: 11764077
    Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: September 19, 2023
    Assignee: Innolux Corporation
    Inventors: Chuan-Ming Yeh, Heng-Shen Yeh, Kuo-Jung Fan, Cheng-Chi Wang
  • Patent number: 11752608
    Abstract: In accordance with embodiments of the present disclosure, a tool may include a main body and a plurality of fingers extending from one side of the main body, the fingers arranged in a plurality of rows and a plurality of columns such that in each of the plurality of rows, each pair of adjacent fingers in a row may have a gap formed in between such pair of adjacent fingers such that each gap may receive a component for insertion or removal from a system and such that the adjacent fingers apply a force to the component to retain the component within the tool. The tool may also include a receptacle formed at one end of the main body and configured to receive a removable arm, and wherein the removable arm is configured to receive a plurality of removable fingers.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Nicholas Adam Kelly, Matthew Dang
  • Patent number: 11751847
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: September 12, 2023
    Assignee: GE PRECISION HEALTHCARE LLC
    Inventors: Flavien Daloz, Jason Barrett, Edouard Da Cruz, Jean Pierre Malacrida
  • Patent number: 11749427
    Abstract: An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: September 5, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Jared Bilas, David R. Peterson, Gerald A. Rhinehart, Jr.
  • Patent number: 11751371
    Abstract: A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: September 5, 2023
    Assignee: FUJI CORPORATION
    Inventor: Kohei Sugihara
  • Patent number: 11751477
    Abstract: A method for preparing a piezoelectric film includes: coating a solution containing a piezoelectric polymer and a solvent on a substrate to obtain a film, wherein the piezoelectric polymer is a copolymer of vinylidene fluoride and trifluoroethylene; and annealing the film at a temperature ranging from 122° C. to 133° C., to obtain the piezoelectric film.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: September 5, 2023
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Huan Ding, Weikun Lee, Mengzhu Ma
  • Patent number: 11742732
    Abstract: Provided is a coil insertion device for inserting a wound coil into slots formed in a stator core and opening to a through-hole of the stator core, by placing the coil in the through-hole, and by expanding the coil to move the coil from inside toward outside with respect to the stator core. The coil insertion device includes a coil expander having a plurality of piece members arranged in an annular shape. The plurality of piece members are movable between a first position where the plurality of piece members are reduced in diameter so as to be insertable inside the wound coil, and a second position where the plurality of piece members are expanded in diameter from the first position to press the wound coil from inside toward outside, thereby inserting the wound coil into the slots at once.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: August 29, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yasuto Ohashi, Norihiko Hikima, Shoma Okubo
  • Patent number: 11735453
    Abstract: A system for transferring a substrate includes a substrate transporter at which is captured a first image with which a position of the substrate at the substrate transporter is determined; a tray at which is captured a second image with which a position of each of a plurality of substrates relative to the tray is determined; a substrate mover with which the substrate is movable in a revolving manner between the substrate transporter and the tray, the substrate mover including: an arm portion movable in the revolving manner between the substrate transporter and the tray, and a substrate securing portion movable together with the arm portion; and an imager with which the first image and the second image are captured, the imager connected to the arm portion and movable in the revolving manner between the substrate transporter and the tray together with the arm portion.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Heungyeol Na, Mingyoun Kang, Dongwon Seol
  • Patent number: 11733154
    Abstract: An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: August 22, 2023
    Assignee: International Business Machines Corporation
    Inventors: Theron Lee Lewis, John R. Dangler, David J. Braun
  • Patent number: 11735984
    Abstract: A coil forming apparatus includes: a coil winding jig including a plurality of comb-shaped grooves; a coil conveying mechanism that pivotally conveys the belt-shaped coil along at least a portion of the outer periphery of the coil winding jig; and guide members guide the belt-shaped coil in an arc shape along an outer periphery of the coil winding jig while being in contact with the side ends, and allow the plurality of straight portions to be inserted into a respective one of the plurality of comb-shaped grooves in a second half portion of the belt-shaped coil upon pivot conveyance. The guide members include a reforming portion in a first half portion of the belt-shaped coil upon pivot conveyance, and the reforming portion deforms and reforms the belt-shaped coil in an arc shape in a state sandwiching the side ends of the belt-shaped coil.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: August 22, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Eishi Yoshida, Shuhei Okuda
  • Patent number: 11735882
    Abstract: A system for mounting an electrical terminal applicator to a cassette containing a plurality of terminals is provided. The system includes a support plate for fixedly attaching to the applicator, and a yoke releasably attached to the support plate. The yoke and support plate define an attachment therebetween providing at least one degree of freedom of motion of the support plate relative to the yoke in an attached state. The yoke is further configured to be movably mounted to the cassette with at least one additional degree of freedom of motion.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 22, 2023
    Assignee: TE Connectivity Solutions GmbH
    Inventors: Matthew Steven Houser, David Michael Stull, Jack DePasquale
  • Patent number: 11735983
    Abstract: A widening apparatus for a hairpin-type stator coil is provided to extend a distance between welding portions of hairpin-type stator coils inserted into slots of a stator core, and the widening apparatus includes, a coil support unit installed on a base frame, a tool driving unit installed on the base frame to be vertically movable below the coil support unit, and including a first gear operation part and a second gear operation part, a plurality of lower widening tools operably connected to the first gear operation part, and reciprocally movable along a layer direction of the stator coils, and a plurality of upper widening tools operably connected to the second gear operation part, and configured to be reciprocally movable above the plurality of lower widening tools.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: August 22, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Yeongsu Yu, Myoung Gil Han, Jiwon Yu
  • Patent number: 11728630
    Abstract: A method of electric wire routing includes: routing an electric wire in an electric wire routing path which is provided in a case and has a concave shape in a cross-sectional view; and covering an upper portion of the electric wire routing path with a cover. A pair of guide pins are inserted into a through hole formed in a bottom portion of the electric wire routing path in the case from below to a position above a side wall portion which forms the electric wire routing path. The electric wire is passed between the guide pins. The cover is assembled to the upper portion of the electric wire routing path while the guide pins are pulled out from the through hole.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 15, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Hideki Adachi, Yuji Migimatsu
  • Patent number: 11729959
    Abstract: Disclosed is a mounting substrate manufacturing system including: a component mounting system including: a component mounting device; a housing body stocker that stores a housing body; a component supply device that pulls out a carrier tape from the housing body stored in the housing body stocker and transports the carrier tape to the component mounting device; and a replacement device that includes an end effector for holding the housing body, and replaces the housing body stored in the housing body stocker, wherein the housing body stocker includes at least a pair of partition members that partition a storage space for storing the housing body, at least one of the partition members adjacent to each other includes an assist portion that assists a replacement operation of replacing the housing body, and the replacement device recognizes a position for a replacement operation by bringing the end effector or the housing body held thereby into contact with the assist portion.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: August 15, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hiroki Kobayashi, Ryouji Eguchi
  • Patent number: 11721662
    Abstract: A method of aligning two wafers during a bonding process includes aligning a first wafer having a plurality of alignment markings with a second wafer having a plurality of alignment markings. The method further includes placing a plurality of flags between the first wafer and the second wafer. The method further includes detecting movement of the plurality of flags with respect to the first wafer and the second wafer using at least one sensor. The method further includes determining whether the wafers remain aligned within an alignment tolerance based on the detected movement of the plurality of flags relative to the first wafer and the second wafer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: August 8, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yun-Tai Shih, Ching-Hou Su, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin, Kuan-Ming Pan, Jui-Mu Cho, Wun-Kai Tsai
  • Patent number: 11723184
    Abstract: In a component supply unit arrangement determination method for a mounter, in which multiple component supply units are exchangeably arranged and which mounts a component on a board based on a job, as the component supply unit to be exchanged for the component supply unit to be newly arranged due to switching of multiple jobs whose execution order is determined, the component supply unit is selected such that a time interval from a job, in which the component supply unit is to be used last, to the switching is long, among the component supply units that are arranged before the switching and are not planned to be used in a job after the switching. In addition, an arrangement position of the selected component supply unit is determined as an arrangement position of the component supply unit to be newly arranged.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 8, 2023
    Assignee: FUJI CORPORATION
    Inventors: Yukihiro Yamashita, Yoshihiro Yasui
  • Patent number: 11722041
    Abstract: A one-piece solenoid stator core is provided, comprising: a plurality of outer wall segments; a plurality of inner wall segments; and a lower wall extending between the plurality of outer wall segments and the plurality of inner wall segments; wherein a plurality of outer slots is defined between the plurality of outer wall segments and a plurality of inner slots is defined between the plurality of inner wall segments, each of the outer slots being radially aligned with an inner slot relative to a central axis of the stator core.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: August 8, 2023
    Assignee: Cummins Inc.
    Inventors: Edward B. Manring, Ross A. Phillips, Steven E. Ferdon