Patents Examined by Peter DungBa Vo
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Patent number: 11832521Abstract: A method of forming a piezoelectric thin film can include depositing a material on a first surface of a Si substrate to provide a stress neutral template layer. A piezoelectric thin film including a Group III element and nitrogen can be sputtered onto the stress neutral template layer and a second surface of the Si substrate that is opposite the first surface can be processed to remove that Si substrate and the stress neutral template layer to provide a remaining portion of the piezoelectric thin film. A piezoelectric resonator can be formed on the remaining portion of the piezoelectric thin film.Type: GrantFiled: April 17, 2020Date of Patent: November 28, 2023Assignee: Akoustis, Inc.Inventors: Craig Moe, Jeffrey M. Leathersich
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Patent number: 11823813Abstract: A robotic system for laying out a specified wiring harness. A robotic arm is configured to arrange a plurality of wire segments along the harness support surface. A system controller is configured to direct the robotic arm to arrange each of the plurality of wire segments on the harness support surface along a specified wire route. A preparation device can label one or both ends of each wire segment as they are being laid out on the support surface. The labeler can automatically apply adhesive labels as flags at selected locations along the length of the wire segment. In a method of making a wiring harness, the robotic arm positions pins on a harness support surface to define wire routes and then arranges at least one wire segment on the harness support surface along each of the wire routes.Type: GrantFiled: September 19, 2020Date of Patent: November 21, 2023Assignee: WITCHITA STATE UNIVERSITYInventors: Brian Brown, Michael Wescott, Alexander VanPelt
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Patent number: 11825595Abstract: The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.Type: GrantFiled: December 30, 2021Date of Patent: November 21, 2023Assignees: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD., GARUDA TECHNOLOGY CO., LTD.Inventors: Mao-Feng Hsu, Zhi-Hong Yang
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Patent number: 11817663Abstract: An electrical contact part comprising, a carrier substrate of a metallic material, a metallic coating applied to the carrier substrate, and a coating barrier material applied to the carrier substrate in a partial area of the carrier substrate, wherein the coating barrier material substantially prevents coating of the carrier substrate in the portion.Type: GrantFiled: January 31, 2021Date of Patent: November 14, 2023Assignee: Auto-Kabel Management GmbHInventors: Oliver Scharkowski, Marie Redder
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Patent number: 11818954Abstract: A method of manufacturing a piezoelectric actuator includes preparing a laminate including a substrate, a first electrode layer disposed on the substrate, a piezoelectric layer disposed on the first electrode layer, and a second electrode layer disposed on the piezoelectric layer, and forming a contour shape of the piezoelectric layer. The forming of the contour shape includes dry etching the piezoelectric layer from the second electrode layer side to dig the piezoelectric layer halfway in a thickness direction, covering, with a resist film, a dry etched surface formed on a side surface of the piezoelectric layer by the dry etching, and wet etching the piezoelectric layer from the second electrode layer side to dig the piezoelectric layer until the first electrode layer is reached.Type: GrantFiled: September 22, 2021Date of Patent: November 14, 2023Assignee: SEIKO EPSON CORPORATIONInventor: Noboru Furuya
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Patent number: 11818849Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.Type: GrantFiled: April 21, 2023Date of Patent: November 14, 2023Assignee: YIELD ENGINEERING SYSTEMS, INC.Inventors: Kenneth Sautter, Syndee Young, Charudatta Galande
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Patent number: 11817234Abstract: There is provided a wiring harness assembly comprising a main trunk cable assembly, a branch cable assembly and at least one connector. The main trunk assembly defines opposite terminal ends and comprises main trunk wires. The branch cable assembly defines opposite terminal ends and comprises branch wires. The connector connects the main trunk cable assembly and the branch cable assembly. The connector comprises an outer housing with an inner wiring harness positioned therein. The wiring harness comprises main trunk wire segments and branch wire segments interconnected at mutual connecting points. The main trunk wire segments define terminal ends connected to the main trunk wires at one of the terminal ends of the main trunk cable assembly. The branch wire segments define terminal ends connected to the branch wires at one of the terminal ends of the branch cable assembly.Type: GrantFiled: December 14, 2020Date of Patent: November 14, 2023Assignee: iLux electric (Cablage Kumar Inc.)Inventors: Rajeev Kumar, Rakesh Kumar
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Patent number: 11806772Abstract: A hydrostatic/hydrodynamic fluid bearing assembly for a can bodymaker is provided. The hydrostatic/hydrodynamic fluid bearing assembly is separate from the ram body. The outboard guide bearing assembly includes a carriage assembly and a number of elongated journals. The carriage assembly includes a ram coupling, a crank coupling, and body defining a number of journal passages. The ram body is coupled to a ram coupling. The crank coupling is structured to be coupled to a crank arm. Each journal extends through a carriage assembly body journal passage. In this configuration, the ram body may form a can body in a traditional manner, but fluid bearing assembly fluid is not applied to the ram body. Instead, the fluid bearing assembly fluid is applied to the journals.Type: GrantFiled: June 23, 2021Date of Patent: November 7, 2023Assignee: Stolle Machinery Company, LLCInventors: Gregory H. Butcher, Aaron E. Carstens, Kenneth E. Carper, Russell Bauer, Ian Kenneth Scholey
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Patent number: 11811279Abstract: An apparatus for assembling a coil includes a blade inserted into a slot of a stator core in a state where insulating paper is inserted into the slot. In a method for assembling the coil, the insulating paper is inserted into the slot of the stator core, the blade is inserted into the slot into which the insulating paper is inserted, the coil is inserted into the slot into which the blade is inserted, the coil being inserted in a direction opposite to a direction in which the blade is inserted. When the coil is inserted into the slot, the blade is pulled out from the slot along with the insertion of the coil into the slot.Type: GrantFiled: February 25, 2022Date of Patent: November 7, 2023Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Ken Noda
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Patent number: 11806519Abstract: Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway.Type: GrantFiled: November 9, 2020Date of Patent: November 7, 2023Assignee: MEDTRONIC, INC.Inventors: Steven T. Deininger, Michael J. Baade, Charles E. Peters
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Patent number: 11811391Abstract: An acoustic resonator is fabricated by forming a patterned first photoresist mask on a piezoelectric plate at locations of a desired interdigital transducer (IDT) pattern. An etch-stop layer is then deposited on the plate and first photoresist mask. The first photoresist mask is removed to remove parts of the etch-stop and expose the plate. An IDT conductor material is deposited on the etch stop and the exposed plate. A patterned second photoresist mask is then formed on the conductor material at locations of the IDT pattern. The conductor material is then etched over and to the etch-stop to form the IDT pattern which has interleaved fingers on a diaphragm to span a substrate cavity. A portion of the plate and the etch-stop form the diaphragm. The etch-stop and photoresist mask are impervious to this etch. The second photoresist mask is removed to leave the IDT pattern.Type: GrantFiled: November 7, 2020Date of Patent: November 7, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Patrick Turner, Ryo Wakabayashi
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Patent number: 11811182Abstract: Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.Type: GrantFiled: October 11, 2018Date of Patent: November 7, 2023Assignee: Intel CorporationInventors: Tyler Leuten, Mohammed Rahman, Bilal Khalaf
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Patent number: 11804819Abstract: A method and structure for single crystal acoustic electronic device. The device includes a substrate having an enhancement layer formed overlying its surface region, a support layer formed overlying the enhancement layer, and an air cavity formed through a portion of the support layer. Single crystal piezoelectric material is formed overlying the air cavity and a portion of the enhancement layer. Also, a first electrode material coupled to the backside surface region of the crystal piezoelectric material and spatially configured within the cavity. A second electrode material is formed overlying the topside of the piezoelectric material, and a dielectric layer formed overlying the second electrode material. Further, one or more shunt layers can be formed around the perimeter of a resonator region of the device to connect the piezoelectric material to the enhancement layer.Type: GrantFiled: March 14, 2022Date of Patent: October 31, 2023Assignee: Akoustis, Inc.Inventor: Jeffrey B. Shealy
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Patent number: 11804685Abstract: The present disclosure provides crimping pliers with quick replaceable jaws, comprising: a crimping pliers body and a jaw; the crimping pliers body comprises a handle; the clamping end of the handle is provided with a groove, the groove is equipped with a fixed block, a guide block and a button, the central section of the button is rotated on the fixed block and one end is used to clamp the front end face of the jaw; the fixed block is provided with a blind hole, and a push-eject spring is placed inside the blind hole; the end of the push-eject spring is in contact with the rear end face of the jaw; the jaw uses the clamping force of button to compress push-eject spring, and simultaneously is in contact with the guide block, the fixed block and the inner wall of the groove.Type: GrantFiled: July 28, 2023Date of Patent: October 31, 2023Inventor: Lijin Zhou
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Patent number: 11799183Abstract: A method of producing an electrically conductive line, the method including providing a substrate, printing a first layer on the substrate, applying a powdered conductive material to the first layer, and bonding the powdered conductive material to the first layer.Type: GrantFiled: July 17, 2019Date of Patent: October 24, 2023Assignee: Xerox CorporationInventors: David C. Craig, Eliud Robles Flores
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Patent number: 11791700Abstract: An apparatus for bending ends, arranged in annular layers, of bar conductors for an electrical machine are arranged in a stator main body having multiple coaxially arranged coupling elements with coupling recesses, by which the ends of the bar conductors can be taken layer by layer and plastically deformed. Each coupling element has a driving platform, which can be moved in the axial direction together with the coupling element. The coupling element belonging to a driving platform can be rotated on the driving platform. All of the driving platforms move axially on a common climbing linkage. Each driving platform has a dedicated first driving device for axially moving the driving platform and a dedicated second driving device for rotating the coupling element on the driving platform, wherein the two driving devices are moved axially, together with the driving platform. The apparatus is of a simple construction requiring little installation space.Type: GrantFiled: September 10, 2021Date of Patent: October 17, 2023Assignee: FELSOMAT GmbH & Co. KGInventors: Juergen Peschina, Peter Haberstroh
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Patent number: 11785723Abstract: A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.Type: GrantFiled: November 22, 2021Date of Patent: October 10, 2023Assignee: PRIMAX ELECTRONICS LTD.Inventors: Sheng-Hsiang Chiu, Ching-Hui Chang
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Patent number: 11784099Abstract: A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a sticking force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a sticking force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.Type: GrantFiled: December 7, 2021Date of Patent: October 10, 2023Assignee: MIKRO MESA TECHNOLOGY CO., LTD.Inventor: Li-Yi Chen
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Patent number: 11783988Abstract: A method of manufacturing an inductor element includes preparing an insert member including a winding portion where a conductor is wound in a coil shape. A plurality of preliminary green compacts is obtained by conducting a preliminary compression molding of a granule containing a magnetic powder and a resin at a pressure of 2.5×102 to 1×103 MPa. The insert member and the plurality of preliminary green compacts are integrated so that a joint interface of the plurality of preliminary green compacts is formed intermittently.Type: GrantFiled: September 11, 2020Date of Patent: October 10, 2023Assignee: TDK CORPORATIONInventors: Yasuhide Yamashita, Katsushi Yasuhara, Chiomi Sato
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Patent number: 11777383Abstract: The present invention provides a method for manufacturing a variable speed accelerator including: a preparation step of preparing a variable speed electric motor 71 including a variable speed rotor 72 in which a shaft insertion hole 74 extending in a horizontal direction is formed, a first variable speed rotor bearing 85i and a second variable speed rotor bearing 85o that rotatably support the variable speed rotor 72 by aligning an axial direction of the variable speed rotor 72 in the horizontal direction, and a variable speed stator 86 that surrounds the variable speed rotor 72 from an outer circumferential side; and a shaft insertion step of inserting a constant speed shaft 77 into the shaft insertion hole 74 of the variable speed rotor 72 in the horizontal direction so as to penetrate the variable speed rotor 72 after the preparation step.Type: GrantFiled: November 21, 2019Date of Patent: October 3, 2023Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATIONInventor: Koichi Mizushita