Patents Examined by Peter DungBa Vo
-
Patent number: 11715895Abstract: A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.Type: GrantFiled: July 9, 2020Date of Patent: August 1, 2023Assignee: Seagate Technology LLCInventors: Michael J. Peterson, Michael R. Fabry, Sean M. Horgan, John F. Fletcher, William B. Green
-
Patent number: 11711885Abstract: A printed circuit board (PCB) having an engineered thermal path and a method of manufacturing are disclosed herein. In one aspect, the PCB includes complementary cavities formed on opposite sides of the PCB. The complementary cavities are in a thermal communication and/or an electrical communication to form the engineered thermal path and each cavity is filled with a thermally conductive material to provide a thermal pathway for circuits and components of the PCB. The method of manufacturing may further include drilling and/or milling each cavity, panel plating the cavities and filling the cavities with a suitable filling material.Type: GrantFiled: January 29, 2021Date of Patent: July 25, 2023Assignee: TTM Technologies, Inc.Inventors: Rick Bauer, Jerrad Martinson, Shane Hoffstatter, Doyle Laudal, Mike Lugert, Mike Len
-
Patent number: 11711898Abstract: There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.Type: GrantFiled: February 5, 2020Date of Patent: July 25, 2023Assignee: GOOGLE LLCInventor: Douglas Raymond Dykaar
-
Patent number: 11710583Abstract: A superconducting coil comprising an oxide superconducting wire includes: a superconducting laminate comprising a substrate and an oxide superconducting layer; and a stabilization layer made of copper plating formed around the superconducting laminate. A thickness d of the stabilization layer is in the range of 10 to 40 ?m. A ratio Ra/d of the thickness d of the stabilization layer and an arithmetic mean roughness Ra of an outer surface of the stabilization layer is in the range of 0.005 to 0.03. An intermediate layer is arranged between the substrate and the oxide superconducting layer. When a tensile test of pulling the oxide superconducting wire in a longitudinal direction within a stress range of 180 to 600 MPa in liquid nitrogen is performed, a ratio of a critical current when a repeated pulling number reaches 100,000 times and an initial critical current measured before the tensile test is 0.99 or more.Type: GrantFiled: April 6, 2020Date of Patent: July 25, 2023Assignee: Fujikura Ltd.Inventor: Shinji Fujita
-
Patent number: 11705792Abstract: A coil insertion device includes: a pair of delivery jigs respectively formed with slits into which a pair of side portions of a coil that are parallel with each other can be inserted; and a side portion inserting mechanism configured to push out the side portions inserted into the slits from the slits to insert the side portions into slots of a stator core, the slots facing the slits, the side portion inserting mechanism has: pushing blocks inserted into the slits; and a pushing block moving mechanism configured to move the pushing blocks in a depth direction of the slits.Type: GrantFiled: April 14, 2020Date of Patent: July 18, 2023Assignee: NITTOKU CO., LTD.Inventors: Shinji Sugimoto, Takayuki Hasebe
-
Patent number: 11700686Abstract: A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.Type: GrantFiled: July 2, 2021Date of Patent: July 11, 2023Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Keiji Kuroda, Haruki Kondoh, Kazuaki Okamoto, Rentaro Mori, Hiroshi Yanagimoto
-
Patent number: 11700698Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.Type: GrantFiled: March 4, 2022Date of Patent: July 11, 2023Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Hao-Yi Wei, Yan-Lu Li
-
Patent number: 11688987Abstract: Aspects and techniques of the present disclosure relate to a tool capable of terminating two different jack types (i.e. communication modules). That is, two different jack types can be arranged and configured to sit in the tool with a termination device. The tool can be a dual-purpose tool that has a configuration that allows a user to terminate different style jacks by adding termination device that becomes a lacing fixture.Type: GrantFiled: July 15, 2021Date of Patent: June 27, 2023Assignee: CommScope Technologies LLCInventors: Zhihui Liu, Jing Wang, Wenyong Wu
-
Patent number: 11688990Abstract: A terminal structure of a high-frequency signal connector and a manufacturing method thereof, in which multiple first terminals and multiple second terminals, multiple excavation areas and multiple trimming lines are trimmed from a tape, the first terminals and the second terminals are arranged alternately, each of the trimming lines is located between one of the first terminals and one of the second terminals that are disposed next to each other, followed by stamping the first terminals and the second terminals to form a first terminal set and a second terminal set. The first terminals and the second terminals are formed simultaneously on a single tape, and in turn, the period for fabricating dies and developing dies may be reduced, and less metal tapes is wasted after blanking of the first terminals and the second terminals, in order to decrease processes and reduce a manufacturing cost of the connector effectively.Type: GrantFiled: August 11, 2020Date of Patent: June 27, 2023Assignee: T-CONN PRECISION CORPORATIONInventors: Jen-Hao Chang, Chien-Hung Lu
-
Patent number: 11689171Abstract: A fabrication method of a bulk acoustic wave (BAW) resonator includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode on a temporary substrate; forming a first dielectric layer on the piezoelectric layer and covering the first electrode; forming a trench in the first dielectric layer; forming a second dielectric layer on the first dielectric layer and in the trench; forming a third dielectric layer on the second dielectric layer and filling in the trench; forming a bonding layer on the third dielectric layer; bonding a resonator substrate to the third dielectric layer via the bonding layer; removing the temporary substrate and the buffer layer to expose a surface layer of the piezoelectric layer; removing the surface layer of the piezoelectric layer; forming a second electrode on the piezoelectric layer; and removing a portion of the first dielectric layer surrounded by the trench to form a cavity.Type: GrantFiled: November 18, 2022Date of Patent: June 27, 2023Assignee: Shenzhen Newsonic Technologies Co., Ltd.Inventor: Guojun Weng
-
Patent number: 11688543Abstract: A power control module and a method to create the power control module is provided. The power control module includes a plurality of transformers, wherein each transformer of the plurality of transformers includes a stack of ferrite cores comprising a plurality of ferrite cores and a continuous winding. The continuous winding has a plurality of turns through each ferrite core of the plurality of ferrite cores. The plurality of ferrite cores are oriented such that the plurality of ferrite cores are stacked together with legs of the plurality of ferrite cores oriented in opposite directions, and wherein the continuous winding comprises a folded section that extends between the plurality of ferrite cores of the stack of ferrite.Type: GrantFiled: February 10, 2020Date of Patent: June 27, 2023Assignee: THE BOEING COMPANYInventors: Arthur Edward Brockschmidt, Jr., Shailesh Atreya, Justin M. Rapozo, Kenneth P. Kollias, Tina Stoia
-
Patent number: 11684959Abstract: Devices and methods for performing shear-assisted extrusion processes for forming extrusions of a desired composition from a feedstock material are provided. The processes can use a device having a scroll face having an inner diameter portion bounded by an outer diameter portion, and a member extending from the inner diameter portion beyond a surface of the outer diameter portion. Extrusion feedstocks and extrusion processes are provided for forming extrusions of a desired composition from a feedstock. The processes can include providing a feedstock having at least two different materials and engaging the materials with one another within a feedstock container. Methods for preparing metal sheets are provided that can include preparing a metal tube via shear assisted processing and extrusion; opening the metal tube to form a sheet having a first thickness; and rolling the sheet to a second thickness that is less than the first thickness.Type: GrantFiled: February 4, 2022Date of Patent: June 27, 2023Assignee: Battelle Memorial InstituteInventors: Scott A. Whalen, Vineet V. Joshi, Md. Reza-E-Rabby, Jens T. Darsell, Mageshwari Komarasamy, Curt A. Lavender, Glenn J. Grant, Aashish Rohatgi, William E. Frazier, III
-
Patent number: 11683921Abstract: An insertion tool for assisting in the insertion of an OCP 3.0 type expansion card in an expansion card slot of a computer system is disclosed. The expansion card may be a pull tab type form factor that does not have a mechanism such as an ejector latch to assist in applying force to insert the card. The expansion card has a front panel opposite a distal edge connector. The tool has a handle and a head coupled to the handle. The head has two contact areas that contact different areas of the front panel of the expansion card. For example, one of the contact areas may be an extended side arm and the other area may be a lateral rib extending from the head.Type: GrantFiled: March 8, 2021Date of Patent: June 20, 2023Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Jen-Jia Liou, Jui-Tang Chang
-
Patent number: 11682939Abstract: To reduce the time for producing slot insulators, a method for producing slot insulators for winding slots of a component of an electrical machine, includes supplying a strip of insulating material, cutting off an insulator strip portion from the strip, molding the insulator strip portion for adjustment to the mold of the winding slot, and inserting the molded insulator strip portion into the winding slot, wherein at least the molding and inserting steps are carried out in parallel for at least two insulator strip portions to be inserted into different winding slots. Moreover, a device for carrying out the method is described.Type: GrantFiled: December 3, 2018Date of Patent: June 20, 2023Assignee: GROB-WERKE GMBH & CO. KGInventors: Manfred Hengge, Steffen Pohl
-
Patent number: 11683920Abstract: An automatic exchanging device is provided which moves alongside the front face of a component mounting line. When an automatic exchange request for a feeder is generated in any of multiple component mounting machines constituting the component mounting line, the automatic exchanging device moves to the front of the component mounting machine in which the automatic exchange request was generated to automatically exchange the feeder. When a new automatic exchange request is generated in any one of the component mounting machines, a pull-out operation of a predetermined number of component mounting machines is prohibited, from the component mounting machine facing the automatic exchanging device toward the position of the component mounting machine in which the new automatic exchange request was generated.Type: GrantFiled: November 6, 2017Date of Patent: June 20, 2023Assignee: FUJI CORPORATIONInventor: Hideya Kuroda
-
Patent number: 11681337Abstract: A method of manufacturing a chassis of an HIS includes manufacturing a chassis having a base panel with an upper chassis surface. The method further includes attaching at least one resilient component to the upper chassis surface and that upwardly presents an adhesive surface to fixedly engage and to provide vibration damping for a storage drive that is inserted on the adhesive surface during assembly of the IHS.Type: GrantFiled: June 6, 2019Date of Patent: June 20, 2023Assignee: Dell Products, L.P.Inventors: Daniel Alvarado, Edmond I. Bailey
-
Patent number: 11682951Abstract: A coil insertion guide device includes a positioning jig that positions a stator core; and a guide member that is provided in the positioning jig so as to be able to contact an end face of the stator core in an axial direction. A coil inserted into the slots along the radial direction of the stator core is guided by the guide members. The guide member includes a guide groove. The guide groove includes, on a side close to the end face of the stator core, a cuff support groove that houses and supports a cuff of one of the insulating members that protrudes from the end face of the stator core, and on a side far from the end face, a coil guide groove that protrudes toward an inside of the slot more than the cuff support groove and contacts the coil to guide movement of the coil.Type: GrantFiled: February 23, 2022Date of Patent: June 20, 2023Assignee: HONDA MOTOR CO., LTD.Inventor: Norihiko Hikima
-
Patent number: 11677372Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include a dielectric protection layer (DPL) that protects the piezoelectric layer from etching processes that can produce rough surfaces and reduces parasitic capacitance around the perimeter of the resonator when the DPL's dielectric constant is lower than that of the piezoelectric layer. The DPL can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, or both.Type: GrantFiled: April 14, 2021Date of Patent: June 13, 2023Assignee: Akoustis, Inc.Inventors: Dae Ho Kim, Frank Zhiquang Bi, Mary Winters, Abhay Saranswarup Kochhar, Emad Mehdizadeh, Rohan W. Houlden, Jeffrey B. Shealy
-
Patent number: 11676760Abstract: A method for producing a coil for electric apparatus of the present invention is the method for producing a coil for electric apparatus for cutting spirally a block-shaped workpiece formed with a cylindrical portion corresponding to the coil in a circumferential direction of the cylindrical portion, the spiral coil is formed by turning a cutting means while moving it relatively to the workpiece from a part corresponding to one end of the coil to a part corresponding the other end of the coil along a machining line spirally set in the circumferential direction of the cylindrical portion. According to the invention, since the coil is formed by cutting the continuous cutting machining plane without generating a step in design from the block-shaped workpiece formed with a cylindrical portion corresponding to the coil using a wire-tool etc., it is possible to constitute a high-quality coil.Type: GrantFiled: May 29, 2019Date of Patent: June 13, 2023Assignee: FUKUI PREFECTURAL GOVERNMENTInventors: Yoshinori Sasaki, Masaki Hashimoto, Taiki Tanaka, Hiroshi Sano, Yuichi Hashimoto
-
Patent number: 11678473Abstract: A machine that is used to automate the assembly of a circuit board assembly is provided. The machine includes a rotating indexer, at least one anvil holder, a punch, and an activation switch. The at least one anvil holder is carried by the rotating indexer and is configured to receive a connector pin. The anvil holder is rotatable relative to the punch, such that the at least one anvil holder may be aligned with the punch. A circuit board may be located about the connector pin, after which the activation switch may be activated to cause movement of the punch towards the anvil holder. When this occurs, the connector pin is compressed, which causes the connector pin to be secured to the circuit board. More specifically, a top section of the connector pin is compressed to form a top lip, where the circuit board is located between the top lip and a shoulder of the connector pin.Type: GrantFiled: May 11, 2022Date of Patent: June 13, 2023Assignee: Concord Electronics, Inc.Inventors: Agustin Flores, Richard Guiterrez, Omar Gonzalez