Abstract: A device for assembling a reflection bowl of an intelligent LED headlamp, including a first feeding device, a second feeding device and a third feeding device. The first feeding device is configured to lead a heat sink base out. The second feeding device is configured to lead the reflection bowl out to an outlet of the first feeding device and assemble the reflection bowl with the heat sink base. The third feeding device is configured to feed a LED lamp bead to the outlet of the first feeding device and assemble the LED lamp bead with the heat sink base.

Abstract: A system for the automated manufacture of a wiring harness, which demonstrates a branched structure made up of multiple individual conductor elements. To form wiring harnesses having an individually branched structure, the conductor elements are automatically brought into a predefined distribution structure, multiple second rails oriented in parallel to each other and multiple second transporters, distributed on the second rails, being used for this purpose. The second transporters are each fitted with one wire end of the conductor elements. To form the distribution structure, the second rails are subsequently moved in a vertical direction, and the second transporters are moved along the second rail. In this spread-apart structure, additional processing steps are carried out, for example a fixing of the conductor elements to each other.

Abstract: A three-phase AC reactor according to an embodiment of the present invention includes three-phase coils that are not arranged in parallel, an input and output terminal block having an input and output unit having a parallel arrangement, and an external connection position change unit disposed between a coil end of each of the three-phase coils and the input and output terminal block to connect the coil end to the input and output terminal block.

Abstract: A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.

Abstract: A device is provided for aligning a ribbon cable relative to an electrical connector to crimp the electrical connector onto the ribbon cable with a tool. The device includes a side portion and a central piece. The side portion includes an upper end and a cable track having a width sized to receive the ribbon cable. The central piece is coupled to the side portion and includes an upper surface. The upper surface of the central piece and the upper end of the side portion at least partially define a connector retaining segment sized to receive the electrical connector.

Abstract: A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

Abstract: A method for producing a connecting device for connecting films with conductor tracks includes the steps of laying a first film with conductor tracks onto a forming die, applying a first lower shell of a plastic material onto a first end portion of the forming die, producing a cut-out and shifting the first film so that the cut-out lies completely on the first lower shell, applying upper conductor tracks of a conductive material onto the first lower shell so that the upper conductor tracks overlap with the conductor tracks of the first film, and applying a first upper shell of a plastic material onto the first lower shell so that the first film, the first lower shell and the first upper shell connect together by substance bonding to form a first connector. In this way, an integral connector can be provided on each film.

Abstract: The coil winding apparatus is for manufacturing a coil by winding a wire rod around a winding core rotated by a rotating mechanism, wherein the winding core has a base plate and a plurality of winding pins erected on the base plate, and a circumferential groove into which a wire rod are put is formed on the periphery of the plurality of winding pins. The rotation mechanism is provided with a rotatable rotating plate, a drive mechanism for rotating the rotating plate, and a pair of columnar members erected on the rotating plate so as to put a rotation center with between a pair of the columnar members. An inner base plate is mounted to a tip of the pair of columnar members, and the coil winding apparatus is provided with an outer winding core moving mechanism.

Abstract: A process for forming extruded products using a device having a scroll face configured to apply a rotational shearing force and an axial extrusion force to the same preselected location on material wherein a combination of the rotational shearing force and the axial extrusion force upon the same location cause a portion of the material to plasticize, flow and recombine in desired configurations. This process provides for a significant number of advantages and industrial applications, including but not limited to extruding tubes used for vehicle components with 50 to 100 percent greater ductility and energy absorption over conventional extrusion technologies, while dramatically reducing manufacturing costs.

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

Abstract: A method of assembling a jaw member of an electrosurgical forceps includes aligning in vertical registration an electrically conductive seal plate, an insulative spacer and a jaw support. The method further includes stacking the seal plate atop the insulative spacer and the jaw support such that a flange depending from the seal plate seats within a corresponding cavity defined within a flange depending from the insulative spacer which, in turn, seats within a cavity defined within the jaw support. The method further includes mechanically securing the seal plate, insulative spacer and jaw support to one another and securing a jaw housing to surround the jaw support, the insulative spacer and the seal plate.

Abstract: In the formation of coil windings of an electrical machine, the invention provides a ring arrangement device for forming a ring arrangement from a plurality of concentrically arranged rings of electrical conductors to form a coil winding of a component of an electrical machine, comprising a collecting receptacle with a plurality of grooves arranged in a ring around an axis and delimited by radial webs and a ring positioning device for the relative axial positioning of one or more of the rings, wherein the ring positioning device has a support device for supporting the electrical conductors of one of the rings to be inserted in an axial insertion position and one holding device for holding the conductors in a storage position, in which the conductors of a completely inserted ring are moved further into the collecting receptacle.

Abstract: A shear assisted extrusion process for producing cladded materials wherein a cladding material and a material to be cladded are placed in sequence with the cladded material positioned to contact a rotating scroll face first and the material to be cladded second. The two materials are fed through a shear assisted extrusion device at a preselected feed rate and impacted by a rotating scroll face to generate a cladded extrusion product. This process allows for increased through wall strength and decreases the brittleness in formed structures as compared to the prior art.

Abstract: An automatic insertion apparatus includes an actuator, a clamping device, and a light shielding device. The clamping device is connected to the actuator for clamping an electronic component, and the light shielding device is movably connected to the actuator to shield a part of the electronic component, and the light shielding device and the clamping device horizontally moves together with the actuator.

Abstract: Provided is a method for producing a piezoelectric element in which a piezoelectric body substrate piece is subjected to polarization treatment and a piezoelectric element is produced. The method includes a first step in which the piezoelectric body substrate piece is held on a flat plate-shaped slightly adhesive sheet and a second step in which voltage is applied to the piezoelectric body substrate piece held on the slightly adhesive sheet and the piezoelectric body substrate piece is subjected to polarization treatment.

Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Abstract: The unloading operation of winding the carrier tape on the component supply reel by driving the component supply reel to extract the component supply reel from the tape feeder is performed. That is, the carrier tape removed from the tape feeder is wound on the component supply reel. Thus, it is possible to suppress the interference of the preceding tape removed from the tape feeder with the succeeding tape.

Abstract: A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.

Abstract: A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.

Abstract: The method and apparatus comprise the following features: —forming coil members (21) by bending an electric conductor (20) externally coated with an outer insulation (20?); wherein the bending is made at predetermined lengths from a reference position (16?), and wherein each one of the coil members (21), when formed, comprises at least one head portion (21?) and leg portions (21?) extending from said at least one head portion (21?); —feeding the electric conductor (20) to accomplish the bending; —cutting the electric conductor (20) to detach a formed coil member (21) from said electric conductor (20); —inserting the leg portions (21?) of the coil members (21) into slots of the stator, so that parts of said leg portions (21?) extend from one end of the stator and the head portions (21?) extend from an opposite end of the stator; —arranging at least one laser beam (13?a, 13?b) to remove the insulation (20?) from predetermined areas (20a, 20b) of the electric conductor (20); —radiating the surface of the electri