Abstract: A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.

Abstract: A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane.

Abstract: A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold—gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.

Abstract: Linear configurations of metallic fuse sections have a bit combination which represents a characteristic of a circuit on a wafer. The metallic fuse sections need to be rid of a polyimide layer covering them in order to make it possible to burn the fuse sections. In the event of unsatisfactory adherence to process parameters and insufficient removal of polyimide on the metallic fuse sections, a resulting relative error in a characteristic of the circuit is minimized according to the method since the fuse section corresponding to the most significant bit is neighbored on both sides by other fuse sections.

Abstract: Device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area by a wire guide and a portal, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).

Abstract: A winding on a stator of a rotary electric machine is constructed by welding end portions of a plurality of segments. A plurality of pairs arranged on an end of the stator are welded by a welder. In a welding stage, the pairs are held by a plurality of insertion rods of a circumferential side holding tool. The insertion rods are radially disposed. The insertion rods are movable in a radial direction. The insertion rods are moved back toward a radial outside to release a holding of the pairs after ball-shaped welding marks are formed. Holding is released without damage on the welding mark.

Abstract: A merged magnetic head has a top first pole tip layer and a bottom second pole tip layer which are located entirely between an air bearing surface and a coil layer. A write gap layer separates the pole tip layers from one another at the ABS. A zero throat height (ZTH) defining layer is located adjacent the top gap layer between the pole tip layers and is recessed from the ABS so as to further separate the pole tip layers from one another at a location recessed from the ABS so as to define the zero throat height of the write head where the first and second pole pieces first commence to separate from one another after the ABS.

Abstract: A process of forming a microactuator for positioning a transducing head over a selected radial track of a rotatable disc in a disc drive system is disclosed. A tub is etched in a substrate, and a bottom coil layer is plated at least partially in the tub. A first insulating layer is deposited on the bottom coil layer. A ferromagnetic core layer is formed on the first insulating layer. A second insulating layer is deposited on and around the ferromagnetic core layer. A top coil layer is plated on the second insulating layer, and contacts the bottom coil layer at a point spaced from the ferromagnetic core. A rotor is formed on a rotor substrate to confront the ferromagnetic core, is operatively attached to the slider and is movable with respect to the ferromagnetic core.

Abstract: In a thin-film structure, since a flat face of a bump, which is exposed at the surface of an insulating layer and is to be in contact with an electrode layer, is an exposed surface of a nickel layer, an oxide layer on the flat face can be reliably removed by using ion-milling or sputter etching.

Abstract: A method of linking commutator bars of a commutator for a motor wherein N is the number of magnetic poles of the motor and N is an even integer greater than 2. The method include a) arranging a plurality of commutator bars to be generally equally spaced in a circular arrangement to define the commutator, each commutator bar having a tang extending therefrom, b) contacting an end of a continuous, insulated conductive member to a tang, c) moving the member to contact a second tang which is disposed at an angle of 720°/N from the previously contacted tang to form a link, and when N is greater than four, repeating this step until N/2−1 links are created, d) moving the member to contact a tang which is immediately adjacent to the second tang contacted in step (c) such that the member defines a bridging portion between the adjacent tangs, e) repeating steps (c) and (d) and until all tangs have been contacted by the member, and f) cutting the bridging portion between adjacent tangs.

Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.

Abstract: A flat-panel display is fabricated according to a process in which a liquid-containing film (92, 116, 124, 132, 144, or 166) is formed over a substrate (80). In addition to suitable liquid, the liquid-containing film contains oxide or/and hydroxide. Liquid is removed from the liquid-containing film to convert it into a solid porous film (82 or 150) having (a) a porosity of at least 10% along an exposed face of the film, (b) an average resistivity of 108-1014 ohm-cm at 25° C., and (c) an average thickness of no more than 20 &mgr;m. A spacer (24) formed with at least a segment of the substrate and overlying solid porous film is positioned between opposing first and second plate structures (20 and 22) of the display. The second plate structure (22) emits light upon receiving electrons emitted by the first plate structure (20).

Abstract: Methods for attaching an integrated circuit die to a substrate. Specifically, substrates which are used for BOC/COB or F/C surface mounting comprise protrusions on the surface of the substrate. The protrusions are configured to form barriers to hold an adhesive paste within the barriers. An integrated circuit die is disposed on the top of the barriers and coupled to the substrate by the adhesive paste.

Abstract: A magnetoresistive device includes a metal layer, formed over a substrate, in which a groove is formed. A magnetoresistive element is formed in the groove, forming two magnetoresistive element portions that are separated by a conductive element. A sense current applied to the metal layer flows through the two magnetoresistive element portions with a predominant current-perpendicular-to-plane component. The method includes techniques that are less complex and less expensive than submicron photolithography to form the above described magnetoresistive device with submicron geometries.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: An extraction device for removing a connector plug from a disc drive socket including first and second lever plates having a length extending between opposed first and second ends and a width extending between opposed sides and the first and second lever plates being pivotally connected between the first and second ends to form lever handles and lever arms. The lever arms include opposed fingers spaced along the width of the lever plates between opposed sides. The lever arms include a slot between fingers, a width of which is sized to enclose a length of the connector plug. A spring biases the lever arms of the first and second lever plates towards one another and the lever plates being movable against a spring bias to open the lever arms to remove a connector plug. A method for removing a connector from a disc drive socket including aligning an extraction device with the connector plug and operating the device to remove the connector plug.

Abstract: A toroidal printed coil includes a plurality of annular holes (2) and a plurality of center holes (3) surrounded by the annular holes (2) in an insulating substrate (1). A plurality of annular juts (4), each comprising a portion surrounded by the annular hole (2) and the center hole (3), are formed. A printed coil sheet having a plurality of toroidal printed coils, in which a conductor film (6) is spirally formed at front-and-rear surfaces and side surfaces of annular portions (5) of the annular juts (4) with each annular portion taken as an axis, is obtained. With this printed coil sheet, a plurality of toroidal printed coils (P) are obtained by cutting the insulating substrate (1) off from the individual annular juts (4).

Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Abstract: A method for manufacturing a motor assembly for an acoustic transducer is provided. The motor assembly includes a base member, a support member, a diaphragm and a backplate. The base member has a surface and a protrusion extending a distance from the surface. The support member has an opening therethrough, and the diaphragm is connected to the support member such that the diaphragm covers a portion of the opening of the support member. The support member is placed on the base member such that the support member contacts the surface of the base member, and the protrusion of the base member contacts the diaphragm. The backplate is placed on the diaphragm such that the backplate is supported by the protrusion. As part of the assembly, the backplate is secured to the support member. By having an assembly wherein the backplate does not contact the diaphragm, the capacitance of the assembly is reduced.

Abstract: The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.