Abstract: A method of separating a thin die (20, 60) from a support body (72) of a semiconductor wafer (70). The thin die (20, 60) being initially attached to the support body (72) by an attachment mechanism (78, 178). The attachment mechanism may be a plurality of tethers (78, 178) that extend between the thin die (20, 60) and the support body (72).

Abstract: A main body includes a plurality of holes formed therein a main clip and includes an exterior contact portion positioned exterior to the main body, a first carrier strip connected to the exterior contact portion and located within the main body and a plurality of clips extending from this carrier strip, each position within a corresponding hole formed in the main body. A slave clip includes a carrier strip located within the main body and a plurality of clips extending from the carrier strip, each positioned within a corresponding hole of the main body to make the corresponding one of the clips of the main clip. The pair of the clips formed within each hole form a terminal to allow terminal portions of a grounding wire to be connected therein. A cap having a plurality of holes corresponding in position and size to the holes formed in the main body may be frictionally engaged in a hollow portion of the main body to complete the assembly. The same potential block (e.g.

Abstract: A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the substrate to allow the portion of the solder mask formed over a vent hole in the substrate to be substantially raised to an elevated flat surface where a groove is then formed to surround the exit of the vent hole. During a molding process, when the encapsulation material infiltrates to the exit of the vent hole, it can be confined within the groove in the elevated flat surface over the dummy pad, thereby preventing it from flashing to nearby solder-ball pads.

Abstract: A process for manufacturing an electronic part having a ceramic body and an outer electrode form on the surface of the body, the outer electrode including a plurality of layers and having a Sn plating layer as the outermost layer. The Sn plating layer having an average crystal grain size of about 1 &mgr;m or less is formed on a Ni or Ni alloy by electroplating in a plating bath having a pH of about 3 to 10.

Abstract: A method of manufacturing a fuel injector is disclosed. The method includes assembling a power group assembly with a valve group assembly to form the fuel injector. The power group assembly includes an overmold formed over a coil assembly. The valve group assembly includes a tube assembly formed by connecting an inlet tube to a valve body. The valve body includes a seat, a lower guide, and an armature/ball assembly disposed within the valve body. A retention member can be used to retain the power group assembly to the valve group assembly.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

Abstract: A compliant mechanism and method of manufacturing the same includes a plurality of layers formed from stamping a plurality of layers from a layer of thinner material and stacking the layers together. Compliant mechanisms can include clutches, switches, derailleurs, brakes and other mechanisms. The compliant mechanism includes rigid and flexible sections of integral construction. The rigid and flexible sections provide an integral device capable of achieving motion by elastic deformation. The flexible section is deflectable, and stores energy in the form of strain energy when deflected.

Abstract: A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

Abstract: A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.

Abstract: Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.

Abstract: A method of manufacturing metal ferrules used as connector elements for optical fibers is characterized such that, by growth-guidance of an internal-diameter formation member whose external diameter is the same as the internal diameter of the metal ferrule to be manufactured, while a tube-shaped electroformed layer having an internal hole is being grown on the cathode side of an electroforming cistern, the electroformed layer is continuously lifted from the electroforming cistern at a specified speed. In the process of lifting the cylindrical electroformed layer while growing it, the cylindrical electroformed layer that has grown to a prescribed external diameter is cut to prescribed dimensions outside the electroforming cistern.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor die 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: A spin valve sensor has a pinned layer structure that has a net positive stress induced uniaxial anisotropy that promotes a pinning of the pinned layer structure in a pinned direction for stabilizing the pinning of the pinned layer structure at high temperatures near to a blocking temperature of a pinning layer which is exchange coupled to the pinned layer.

Abstract: A method of making a temporary medical electrical lead for pacing or defibrillating a heart of a patient.

Abstract: A process and apparatus for installation of a lockbolt to fasten together an assembly of at least two parts having a viscous fluid such as adhesive or sealant in the interface between the two parts, inserts a lockbolt into aligned holes through the two parts and exerts a pulling force of a predetermined intermediate magnitude on the lockbolt while reacting the pulling force against opposite sides of the assembly to exert a compressive force on the assembly to squeeze the fluid out of the interface. The intermediate pulling force is maintained for a precisely timed dwell period based on an optimal period for that fluid and that temperature. After the dwell period, the pulling force is increased in magnitude while simultaneously swaging a collar into threads on the lockbolt to secure the collar on the lockbolt and secure the lockbolt in a state of tension in the hole in the assembly. The pulling force magnitude continues to increase said until the pintail breaks off the lockbolt.

Abstract: Method of manufacture of a composite wiring structure for use with at least one semiconductor device, the structure having a first conductive member upon which the semiconductor device can be mounted for electrical connection thereto. A dielectric member, made of ceramic or organo-ceramic composite material, is bonded to the first conductive member and contains embedded therein a conductive network and a thermal distribution network. A second conductive member may be incorporated with the composite wiring structure, with a capacitor electrically connected between the conductive network and the second conductive member. Bonding between the dielectric member and the conductive members may be in the form of a direct covalent bond formed at a temperature insufficient to adversely effect the structural integrity of the conductive network and the thermal distribution network.

Abstract: A progressive stamping die assembly apparatus and method in which strip stock material advances in a first direction through the apparatus and substantially simultaneously with the strip stock movement, a transversely moveable die station moves in opposite second and third directions substantially perpendicular to the first direction to one of a plurality of predetermined positions.

Abstract: Apparatus for assembling injection devices includes first and second pairs of shafts spaced apart from one another and defining axes extending parallel to a first inclined axis. The shafts include grooves extending helically between ends of the shafts, the helical grooves together defining passages extending vertically between the shafts. The shafts are rotated about their axes such that the passages move between first and second ends of the shafts. Syringes are introduced into successive passages to carry the syringes downwardly along the inclined axis between the first and second ends of the shafts while maintaining the syringes oriented vertically and spaced apart. Guards are carried along a horizontal axis that converges with the inclined axis at a convergence region. The guards are spaced apart and suspended vertically below corresponding syringes such that the syringes are received in successive guards at the convergence region.

Abstract: The invention relates to a device for mounting components on a carrier comprising a frame (25) in which a shaft (8) is accommodated, the shaft is provided with a longitudinal bore (16), and means for displacing said hollow shaft (8) in vertical direction through said frame (25), wherein said shaft (8) at one end (8a) facing away from the carrier can be coupled to means (17) for generating an under pressure or vacuum within said bore (16) and wherein the other end (8b) of the shaft facing towards the carrier is provided with means for picking up and mounting a component. According to the invention, the device is characterized in that said shaft (8) is coupled to a yoke (12) which forms part of said displacement means, which coupling can be temporarily disengaged the moment the shaft makes contact with a component or a carrier.