Abstract: A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained. A component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle.

Abstract: Method of manufacture a wide bore, high field superconducting magnet. The superconducting magnet has a plurality of superconducting coils impregnated with epoxy and nested within each other. An innermost one of the nested coils has a bore therethrough that defines a bore width of the magnet. The bore width is greater than approximately 100 millimeters. The nested coils are electrically connected in series and cooled to an operating temperature less than approximately 4 degrees K. The magnet also has external reinforcements on the coils that are applied prior to impregnating the coils with epoxy. An active protection circuit protects the coils in response to a quench in the magnet. The protection circuit includes heater elements positioned in thermal contact with the coils prior to impregnating the coils with epoxy. The magnet further has lead supports for supporting the lead wires with epoxy that extend from the coils.

Abstract: A method and apparatus for installing a hollow threaded insert into a hole in a substrate having first and second surfaces. The insert has a hollow shaft having a first end portion, a second end portion and an intermediate portion. The insert has a front flange at the first end portion for engaging the front surface of the substrate around the hole. The second end portion of the shaft has an internal thread and, the intermediate collapses to engage the second surface when a force is applied that pulls the second end portion toward the first end portion.

Abstract: A semi-automated method for forming armature coils comprising a plurality of transposed wire pairs includes joining a plurality of pairs of wires having offset segments along their lengths, wherein each pair of wires are in contiguous, surface-to-surface engagement with each other along a length defining said each pair of wires, insulating each of the transposed pairs of wires, assembling the plurality of the insulated transposed pairs of wires with the transpositions being staggered to create a pack, and forming the pack into an armature coil in an automated coil forming machine by bending the pack in two planes. The joining of the plurality of pairs of wires having the offset segments along their lengths is effectuated at a transposition point. Each pair of wires has a transposition at a unique point relative to others of the plurality of the pairs of wires forming the coils.

Abstract: A method of forming a resistor is described which achieves improved resistor stability and voltage coefficient of resistance. A resistor is formed from a conducting material such as doped silicon or polysilicon. The resistor has a rectangular first, second, third, fourth, and fifth resistor elements. A layer of protective dielectric is formed over the first, second, and third resistor elements leaving the fourth and fifth resistor elements exposed. The conducting material in the exposed fourth and fifth resistor elements is then changed to a silicide to form low resistance contacts between the second and fourth resistor elements and between the second and fourth resistor elements. The second and third resistor elements are wider than the first resistor element and provide a low resistance contacts to the first resistor element. This provides a low voltage coefficient of resistance and thermal process stability for the resistor.

Abstract: The present invention is generally directed towards a catalytic converter installed in the motor vehicles. More specifically to a method of measuring the pressure on the substrate as the catalytic converter is subject to the spin forming process. A pressure-measuring device such as a sensor is contact with the substrate. In order to transfer data from the rotating catalytic converter to a stationary object, a slip ring device is connected to the pressure-measuring sensor.

Abstract: A manufacturing method of manufacturing a liquid jet head which has a plurality of piezoelectric vibrators, each having, at least in part, a laminate structure of electrodes and at least one layer of piezoelectric material. An ejection characteristic measurement step applies a similar drive signal to all of the piezoelectric vibrators to eject liquid from the nozzle openings. The liquid ejection characteristics are measured in a one-by-one basis of the nozzle openings. An ejection characteristic adjustment step sets a treatment condition for at least one of the piezoelectric vibrators based on a result of measurement by the ejection characteristic measurement step. At least one piezoelectric vibrator is subjected to a displacement amount adjustment based on the set treatment condition by trimming away a portion of an external electrode, thereby making the liquid ejection characteristic associated with the nozzle openings uniform.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

Abstract: A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each mounted at one end adjacent the substrate support, and each having a loose end. When the portions of the fiber adjacent the loose fiber ends are each brought into contact with the under surface of the substrate, Van der Waals forces are exerted between the substrate and the fibers to urge the substrate toward the underlying substrate support. In a preferred embodiment, the substrate and portions of the fiber adjacent the loose fiber ends are first vertically brought into physical contact with one another, and then a horizontal force is applied to horizontally move, with respect to one another, the substrate and the portions of the fibers adjacent the loose fiber ends.

Abstract: Disclosed herein is an apparatus and method for installing a c-clip outside a far end of a passage. In some embodiments, the apparatus comprises prong members each comprising a prong end, a base end, and a lip part. A base is secured to the base ends, so the prong members are parallel with each other, and so the lip parts form a ring-shaped lip adapted to secure the c-clip. A tube is provided comprising an inner surface having a varying radius. The base inserts the prong members through the tube and against the inner surface, the inner surface forcing the c-clip to close into a closed c-clip. The prong ends are moved at least partially through the rear of the tube, and in some embodiments through a tube extension, permitting a restoring force of the c-clip to open the c-clip.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member. The support is readily compressed to allow placement into or onto a space defined by surfaces of a positioning device, and the support expands upon its release to fill the space. When the support is left in the positioning device during a change over to a different circuit board, the support will automatically adjust to any width-wise adjustment in the space between the surfaces of the positioning device.

Abstract: A method and apparatus for progressively cutting, piercing, bending, stacking, and interlocking lamination assemblies from a strip of laminate. The stacked laminations are mechanically interlocked with a staple-style interlock that secures all the laminations in the stack together. All the steps in the process of forming, stacking and interlocking are done within the tool and die assembly, eliminating the need for additional equipment to stack and interlock assemblies.

Abstract: An apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A method of attaching a bearing (216) and hub (214) to a knuckle (212) in a corner assembly (220) of a vehicle to prevent the introduction of lateral moments into a plurality of rollers (232,234,232′,234′) retained in the bearing (216). The bearing (216) has an inner race (222) and an outer race (226) with the plurality of rollers (232,234,232′,234′) being retained between an outer race (226) and an inner race (222). The hub (214) has a cylindrical body with a flange (220) located adjacent a first end (219) and a mounting surface (224) located adjacent a second end (213). The flange (220) has a plurality of axial openings (250,250′ . . . 250n) that are spaced in an arc with respect to an axis of the cylindrical body. After the inner race (222) is located on the mounting surface (224), the inner race (222) is fixed to the cylindrical body. Thereafter, hub (214) is placed on a tool (242) such that a plurality of pins (248,248′ . . .

Abstract: A method of forming a flowmeter having a case enclosing a single straight tube surrounded by a balance bar. The balance bar ends are coupled by means of a brace bar to the flow tube as well as by case connect links to the inner wall of the case. The flow tube projects beyond the case end and is sealably coupled to a cone connect element in the case end. A void is defined by the space between the flow tube outer surface and the inner surface of the cone connect element and the end flanges. The case connect links contain out of plane bends to accommodate a change in the effective diameter of the case and the balance bar with respect to each other due to changing thermal conditions.

Abstract: A method of manufacturing a perforated metal cover (1) includes steps of: step (60), successively punching holes in a piece of metal sheet at a plurality of workstations and cutting the metal sheet into a plurality of metal bases; step (62), stamping the metal bases into three dimensions; step (64), grinding the metal bases; and step (66), anodizing the metal bases to produce the finished covers. Each workstation includes at least one punch, and each punch includes a die having a plurality of punch heads, which number and arrangement are predetermined according to the holes (3) to be formed in the perforated cover. Different arrays of holes are punched in the metal sheet in different punches.

Abstract: A method of creating a fluid ejection device is described. The fluid ejection device has a substrate having a set of thin-film layers disposed on a first surface. A photoresist is applied on the set of thin-film layers, the photoresist has openings defined therein. The set of thin-film layers and substrate in the openings are etched to create deep slots beneath the first surface of the substrate. The photoresist is removed. A protection layer is applied over the set of thin-film layers thereby filling the deep slots in the set of thin-film layers and substrate. A feed channel is created on a second surface of the substrate until the protection layer within the deep slots is exposed. The protection layer is then removed.