Abstract: An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting.

Abstract: A mainframe printed wiring board assembly for receiving plug-in circuit boards of two different types in connectors on the mainframe printed wiring board. Each connector is correct for only one of the two types of circuit board. The mainframe printed wiring board assembly includes a row of connectors of a first type and a row of connectors of a second type, with each connector in each row having an elongated slot adapted to receive a circuit board edge. The slots in the connectors in each row extend transversely to the direction of the row. A first elongated key element extends along the first row of connectors adjacent the connector ends. A second elongated key element extends along the second row of connectors, spaced apart from the connector ends. The two different types of plug-in circuit boards have, on their connector engaging edges, different contours to accommodate one or the other of the elongated key elements.

Abstract: A printed wiring board file employing guide tracks of wire construction to engage guide runners of printed wiring board assemblies to be mounted therein. The guide tracks are assembled to lateral positioning members at regular or optionally, predetermined differing spacings and each guide includes a forwardly projecting divergent lead-in area to assist in aligning the board assembly guide runner with the file guide tracks. A pair of depressions are formed in each guide track to engage corresponding projections in the guide runners to retain the board assemblies in their fully inserted position within the file.

Abstract: A substrate for wiring an electrical component in an electrical circuit comprises a base substrate, a first insulating layer of an organic material formed over the base substrate, a wiring member formed on the first insulating layer, coupled to the component, a second insulating layer of an organic material formed over the first insulating layer, and a terminal member on the first insulating layer and appearing from the second insulating layer, connected to the wiring member. A third insulating layer of an organic material may be interposed between the first and the second insulating layers, carrying a second wiring member connected to the first wiring member.

Abstract: A high density dimensionally stable encapsulated wire circuit board and a method of making such a board is described. A photo-curable adhesive having a unique combination of rheological properties is utilized to bond insulated wires to a substrate. The unique combination of rheological properties of the adhesive used in the encapsulated wire circuit boards of this invention include a specified range of values for the Storage Shear Modulus and specified range of values for the Loss Angle ratio.

Abstract: Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and supplying welding current from the electrodes through the lead head and metal piece.

Abstract: Edge notches of various depths in circuit boards correspond with slots of various depths in a card guide so that the boards are not interchangeable.

Abstract: A silicon circuit board incorporates multiple levels of patterned conductors. First level upper and lower patterned conductors are situated on an insulation-coated, monocrystalline silicon substrate. Upper and lower, high resistivity, polycrystalline silicon layers, in turn, are situated on the first level upper and lower patterned conductors, respectively. Second level upper and lower patterned conductors are situated over the upper and lower polycrystalline silicon layers. Further levels of patterned conductors in the circuit board may be provided by iteratively forming on the board polycrystalline silicon layers and patterned conductors. Conducting feedthroughs in the circuit board provide electrical communication between various patterened conductors.

Abstract: There is disclosed a click disc switch assembly comprising a plate-like base having on it electroconductive ink paths including (a) "row" paths each including a respective row of contact pads in a row-and-column matrix of such pads on the base, and (b) "column" paths corresponding to the columns of the matrix and including respective junction pads. Overlying the columns of the matrix are click disc strips secured to the rest of the assembly solely by being adhered to an overlying sheet sealing the top of the assembly. Interposed between the strips and the "row" paths is an insulating layer deposited on the base to cover portions of the row paths while leaving uncovered their junction pads.

Abstract: A hybrid integrated circuit device comprising in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer surface of a base (6) which is mounted on a multilayer ceramic package (2) which incorporates the element (1). In this assembled and operated hybrid device, function trimming of the film resistor pattern can be carried out by using a computer and testing is easier than is capable with prior art devices.

Abstract: A printed wiring board file employing printed wiring board guides positionable within the file at a plurality of first predetermined spacings and further positionable at a plurality of second predetermined spacings in increments different from those of said first showings. A tab at one end and a clip at the other end of each printed wiring board guide permit assembly to support members and further permit the removal of same should it become necessary to reposition printed wiring boards within the file.

Abstract: A circuit board having a window for receiving an electronic device substantially in the form of a plate is provided with elastic holding tabs of at least two different lengths which project into the window, the tabs forming the ends of conductor runs on the circuit board. Upon a pushing of the plate through the window, the short holding tabs snap back and the plate becomes clamped to the circuit board by the holding tabs, these tabs also serving to complete the electrical coupling between the conductor runs of the circuit board and contacts on the plate.

Abstract: A double file printed wiring board module arranged to mount printed wiring boards on both sides of a centrally positioned interconnect or side plane while providing for the convection cooling of the printed wiring boards and the interconnection of same with conductors of minimal length. The printed wiring boards are supported by a connector at one side edge and a board guide at an opposite side edge. The interconnect or side plane includes an external termination connector mounted at its rear edge to permit the efficient connection of the circuit module to external terminations.

Abstract: Certain regions of a printed circuit assembly having mechanically laid wires are formed of two parallel sheets of polyimide film, the circuit assembly being flexible in those regions. The edges of these sheets of film are secured in the region of the edges of the rigid parts of the assembly by means of thermally activated adhesives. In the flexible regions, the wires are embedded in a thermally activated adhesive layer held between the two sheets of polyimide film. This adhesive layer, unlike adhesive layers on the rigid parts, contains no fabric.

Abstract: Printed circuit boards each having an electronic component packaged thereon are stacked in a casing with conductive elastic members being interleaved therebetween and an opening of the casing is closed by a cover so that the printed circuit boards are urged against the casing and electrically connected to each other.

Abstract: A circuit board stiffener includes an elongated stiffening member adapted to extend over the board surface in spaced relation to that surface; the member has contact surfaces adapted to engage one side of the board, and bendable retainer structure to retain the member in position relative to the board. The retainer structure may comprise bendable arms that project through board openings to be bent at the opposite side of the board, and to be locked in position by solder at that opposite side. The member may have a zig-zag cross section to enhance its stiffness.

Abstract: A first printed circuit board with electronic components mounted thereon is connected to a second printed circuit board having a first contact for key input by electrically connecting means. A spacer is interposed between the electrically connecting means and the second printed circuit board to separate them. The electrically connecting means has a second contact which contacts the first contact, and is connected to the first printed circuit board by urging means.

Abstract: Disclosed herein is a ceramic thick film circuit substrate for use in an electronic circuit part, characterized in that a conductive layer at a place where it is to be connected with a thick film circuit is composed of a mixture of tungsten and at least one of platinum and palladium. Based on 100 parts by weight of tungsten, platinum is 0.1-100 parts by weight in the case of platinum alone, palladium is 0.1-20 parts by weight in the case of palladium alone; and a total amount of platinum and palladium is 0.1-76 parts by weight in the case of combination of platinum and palladium. Thereby, the ceramic thick film circuit substrate has an excellent oxidation resistance, and low contact resistance to the thick film circuit.

Abstract: An enclosure for a printed wiring board. The enclosure includes a U-shaped channel member having a ledge in each of its sides. Each ledge has a floor and a wall, and each wall includes at least one projection. A printed wiring board is retained against the ledge floors by means of the projections acting against the printed wiring board. Longitudinal motion of the printed wiring board, in its retained position, is prevented by a tubular projection attached to the U-shaped member extending through an aperture in the printed wiring board. A cover is provided and retained in engagement with the U-shaped member by a plurality of cover projections engaging depressions in a cover receiving ledge formed in the U-shaped member. The enclosure is adapted to be positioned relative to a relay structure by a longitudinal rib attached to the base of the U-shaped member. A fastener extends through the cover and the tubular projection, and engages the relay structure to affix the enclosure to the relay structure.

Abstract: Robotic handling of printed circuit boards stored within a tote box is facilitated by the use of a structurally integrated insert within the tote box that is adjustable to accommodate boards of various widths and heights. The insert includes a locating element that extends through the tote box for contact by the locating apparatus of the robot and thus precisely establish the location of each circuit board.